电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

C1825N334K5XRL7370

产品描述Multilayer Ceramic Capacitors MLCC - SMD/SMT .330UF 50.0V
产品类别无源元件   
文件大小1MB,共11页
制造商KEMET(基美)
官网地址http://www.kemet.com
下载文档 详细参数 全文预览

C1825N334K5XRL7370在线购买

供应商 器件名称 价格 最低购买 库存  
C1825N334K5XRL7370 - - 点击查看 点击购买

C1825N334K5XRL7370概述

Multilayer Ceramic Capacitors MLCC - SMD/SMT .330UF 50.0V

C1825N334K5XRL7370规格参数

参数名称属性值
产品种类
Product Category
Multilayer Ceramic Capacitors MLCC - SMD/SMT
制造商
Manufacturer
KEMET(基美)
电容
Capacitance
0.33 uF
电压额定值 DC
Voltage Rating DC
50 VDC
电介质
Dielectric
BX
容差
Tolerance
10 %
外壳代码 - in
Case Code - in
1825
外壳代码 - mm
Case Code - mm
4564
高度
Height
1.5 mm
最大工作温度
Maximum Operating Temperature
+ 125 C
最小工作温度
Minimum Operating Temperature
- 55 C
产品
Product
High Reliability MLCCs
电容-nF
Capacitance - nF
330 nF
电容-pF
Capacitance - pF
330000 pF
长度
Length
4.5 mm
封装 / 箱体
Package / Case
1825 (4564 metric)
端接类型
Termination Style
SMD/SMT
宽度
Width
6.4 mm

文档预览

下载PDF文档
CERAMIC CHIP/MIL-PRF-55681
CAPACITOR OUTLINE DRAWINGS
BW
DIMENSIONS—MILLIMETERS AND (INCHES)
STYLE
KEMET
SIZE
CODE
T
L
W
MIN.
MAX.
BW
CDR01
CDR02
CDR03
CDR04
CDR05
CDR06
CDR31
CDR32
CDR33
CDR34
CDR35
C0805
C1805
C1808
C1812
C1825
C2225
C0805
C1206
C1210
C1812
C1825
2.03 ±.38 (.080 ±.015)
4.57 ±.38 (.180 ±.015)
4.57 ±.38 (.180 ±.015)
4.57 ±.38 (.180 ±.015)
+.51
+.020
4.57
.180
–.38
–.015
5.72 ±.51 (.225 ±.020)
2.00 ±.20 (.078 ±.008)
3.20 ±.20 (.125 ±.008)
3.20 ±.25 (.125 ±.010)
4.50 ±.25 (.176 ±.010)
4.50 ±.30 (.176 ±.012)
(
)
1.27 ±.38 (.050 ±.015)
1.27 ±.38 (.050 ±.015)
2.03 ±.38 (.080 ±.015)
3.18 ±.38 (.125 ±.015)
+.51
+.020
6.35
.250
–.38
–.015
6.35 ±.51 (.250 ±.020)
1.25 ±.20 (.049 ±.008)
1.60 ±.20 (.062 ±.008)
2.50 ±.25 (.098 ±.010)
3.20 ±.25 (.125 ±.010)
6.40 ±.30 (.250 ±.012)
.56 (.022)
.56 (.022)
.56 (.022)
.56 (.022)
.51 (.020)
.51 (.020)
1.40 (.055)
1.40 (.055)
2.03 (.080)
2.03 (.080)
2.03 (.080)
2.03 (.080)
1.30 (.051)
1.30 (.051)
1.50 (.059)
1.50 (.059)
1.50 (.059)
.51 ± 0.25 (.020 ±.010)
.51 ± 0.25 (.020 ±.010)
.51 ± 0.25 (.020 ±.010)
.51 ± 0.25 (.020 ±.010)
.51 ± 0.25 (.020 ±.010)
.51 ± 0.25 (.020 ±.010)
.50 ± 0.20 (.020 ±.008)
.50 ± 0.20 (.020 ±.008)
.50 ± 0.25 (.020 ±.010)
.50 ± 0.25 (.020 ±.010)
.50 ± 0.30 (.020 ±.012)
(
)
Note:
For MIL-C55681 “S” Endmet, the length, width and thickness positive tolerances (including bandwidth) cited above are allowed to increase by the following
amounts:
Length
Width
Length
CDR01
0.51MM (.020)
0.38MM (.015)
CDR02-06
0.64MM (.025)
0.38MM (.015)
CDR31-35
0.60MM (.023)
0.30MM (.012)
MIL-PRF-55681 PART NUMBER ORDERING INFORMATION
CDR01
B P
101 B K
Z
M
STYLE & SIZE CODE
STYLE
C — Ceramic
D — Dielectric, Fixed Chip
R — Established Reliability
FAILURE RATE LEVEL
(%/1000 hrs.)
TERMINATION FINISH
S — Solder Coated, Final
(SolderGuard I)
U — Base Metalization—
Barrier Metal—Solder
Coated
(SolderGuard I)
W — Base Metalization—
Barrier Metal—Tinned
Tin or (Tin/Lead Alloy)
SolderGuard II
Y — Base Metalization
Barrier Metal—Tinned
(100% Tin)
Solderguard II
RATED TEMPERATURE
–55°C to +125°C
DIELECTRICS
P —± 30 PPM/°C—WITH OR WITHOUT VOLTAGE
X —± 15%—without voltage
+ 15%, –25%—with voltage
CAPACITANCE
Expressed in picofarads (pF).
First 2 digits represent significant figures and the last digit specifies the number of zeros to follow.
(Use 9 for 1.0 through 9.9pF. Example: 2.2pF = 229)
CAPACITANCE TOLERANCE
B
C
D
F
±.1 pF ±.25 pF ±.5 pF ±1%
J
±5%
K
M
±10% ±20%
Z – Base metallization -
barrier metal-tinned (tin/lead
alloy, with a min. of 4% lead)
RATED VOLTAGE
A — 50; B — 100
KEMET/MIL-PRF-55681 PART NUMBER EQUIVALENTS
C 0805
P 101 K
1 G M
L
CERAMIC
SIZE CODE
See Table Above
END METALIZATION
L — 70Sn/30Pb Plated (Military codes Z,W,U )
C— 100% Tin Plated (Military code Y)
H – Sn60 Coated (Military code S)
SPECIFICATION
P -MIL-PRF-55681 = CDR01-CDR06
N-MIL-PRF-55681 = CDR31-CDR35
FAILURE RATE
(%/1,000 hrs.)
R — 0.01
S — 0.001
M — 1.0
P — 0.1
CAPACITANCE CODE
Expressed in picofarads (pF).
First two digits represent significant figures.
Third digit specifies number of zeros. (Use 9
for 1.0 thru 9.9 pF. Example: 2.2 pF –229)
VOLTAGE TEMPERATURE CHARACTERISTIC
Designated by Capacitance
Change Over Temperature Range
G — BP (C0G/NP0) (±30 PPM/°C)
X — BX (±15% Without Voltage
+15% -25% With Voltage)
CAPACITANCE TOLERANCE
B
C
D
F
J
K
M
±
.1 pF
±
.25 pF
±
.5 pF
±
1%
±
5%
±
10%
±
20%
VOLTAGE
1 — 100V, 5 — 50V
*
Part Number Example: C0805P101K1GML
(14 digits - no spaces)
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
87
Ceramic Surface Mount
M — 1.0
P — 0.1
R — 0.01
S — 0.001
WinCE支持类似SMTP的发送邮件的类吗?
我想要在WinCE6.0上通过GPRS模块发送邮件。问了一下,WinCE是支持GPRS模块的AT指令的。现在就想知道WinCE支持SMTP这样的类吗?在上面能不能实现发送邮件的功能啊?...
sacole 嵌入式系统
51单片机的程序与C语言的程序有哪里不同?
现在我看了51单片机的书籍可是我喜欢的就是他的编程 ,但是对于51单片机的程序我不懂他是怎么控制电路的,他是怎么实现灯泡发亮的时间? ...
嘟嘟0.0 51单片机
STM8L151 MCU 单片机程序项目外包,欢迎深圳有经验的软件工程师联系
MCU 单片机程序项目外包,欢迎深圳有经验的软件工程师联系 MCU采用STM8L151K6T6 外围有CP2102 串口通讯电路,DS1302 时钟芯片,和华邦8M存储器,和8字数字显示屏 主要实现存储,通讯 ......
hegll 求职招聘
做技术的也有2B青年
122279...
mmmllb 聊聊、笑笑、闹闹
QUARTUS 中进行系统仿真时,顶层模块与基本模块,求指点!!
看书上介绍仿真时,是将基本模块设置成顶层实体,然后在进行仿真,这是为什么? 而这样的话,基本模块都设置成顶层实体,那么顶层模块的顶层实体呢?这之间有啥区别吗? 求高手解答 ......
wangdj1107 FPGA/CPLD
Internal PA 与 External FEM 比较
在 Wi-Fi 无线射频的架构下,有三个主要的关键器件决定了 Wi-Fi 系统的性能,它们分别是 Wi-Fi 射频主芯片(Wi-Fi Chipset),前端射频器件如功率放大器、低噪放、开关或模组(PA/LNA/Switch or ......
alan000345 无线连接

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2678  1723  2495  311  1886  35  48  18  53  26 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved