1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 1.0Vrms, 0.0Adc, @ +25°C
2. Full Load Inductance (FLL) Test Parameters: 100kHz, 1.0Vrms, @ I
sat
, @ +25ºC
3. I
rms
: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary for AC currents.
PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the
temperature rise. It is recommended that the temperature of the part not exceed 125°C under worst case operating
conditions verified in the end application.
4. I
sat
: Peak current for approximately 30% rolloff @ +25°C
5. K-factor: Used to determine B
p-p
for core loss (see graph). Bp-p = K * L *
ΔI.
B
p-p
: (Gauss), K: (K-factor from table), L:
(Inductance in μH),
ΔI
(Peak to peak ripple current in Amps).
6. Part Number Definition: HCM1307-xxx-R
HCM1307 = Product code and size
xxx= inductance value in μH, R= decimal point ,
If no R is present then last character equals number of zeros
-R suffix = RoHS compliant
Dimensions (mm)
b
13.2
±1.0
6.3
±0.2
a
Recommended Pad Layout
2.5
±0.3
14.20
Schematic
1
12.5
±0.5
XXX
wlyy R
3.8
±0.5
2
1
1
2
4.9
2
8.0
ref
3.25
7.7
Part marking: XXX=Inductance value in uH, R= decimal point. If no R is present then last character equals number of zeros.
wlyy=date code, R=revision level
All soldering surfaces to be coplanar within 0.10 millimeters
Tolerances are ±0.3 millimeters unless stated otherwise
Color: Grey
Do not route traces or vias underneath the inductor
2
www.eaton.com/elx
HCM1307
High current power inductors
Packaging information (mm)
Supplied in tape and reel packaging, 400 parts per 13” diameter reel
Technical Data
10433
Effective September 2015
4.0
1.5 dia
2.0
1.75
XXX
wlyy R
11.5
24.0
±0.3
13.3
20.0
1.5 dia
7.0
4.5
13.1
User direction of feed
Temperature rise vs. total loss
60
50
Temperature Rise (°C)
40
30
20
10
HCM1307-R47-R
HCM1307-1R0-R
HCM1307-3R3-R
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
0
Total Loss (W)
www.eaton.com/elx
3
Technical Data
10433
Effective September 2015
HCM1307
High current power inductors
Core loss vs. Bp-p
10.000
1MHz
1.000
500kHz
300kHz
200kHz
100kHz
Core Loss (mw)
0.100
50kHz
25kHz
0.010
0.001
100
1000
10000
B
p-p
(Gauss)
Inductance characteristics
HCM1307-R47-R
110%
100%
110%
100%
90%
HCM1307-1R0-R
% of OCL
90%
80%
70%
60%
50%
40%
0
10
20
30
40
50
60
70
80
90
% of OCL
80%
70%
60%
50%
40%
0
5
10
15
20
25
30
35
40
45
50
55
60
65
I
DC
(Amps)
I
DC
(Amps)
HCM1307-3R3-R
110%
100%
90%
% of OCL
80%
70%
60%
50%
40%
0
5
10
15
20
25
30
35
40
45
I
DC
(Amps)
4
www.eaton.com/elx
HCM1307
High current power inductors
Solder reflow profile
T
P
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
T
L
Preheat
A
t
t
P
T
C
-5°C
Technical Data
10433
Effective September 2015
Table 1 - Standard SnPb Solder (Tc)
Package
Thickness
Volume
mm3
<350
Volume
mm3
≥350
<2.5mm)
≥2.5mm
T
smax
235°C
220°C
220°C
220°C
Temperature
Table 2 - Lead (Pb) Free Solder (Tc)
T
smin
t
s
Package
Thickness
Volume
mm
3
<350
Volume
mm
3
350 - 2000
Volume
mm
3
>2000
<1.6mm
1.6 – 2.5mm
>2.5mm
25°C
Time 25°C to Peak
260°C
260°C
250°C
260°C
250°C
245°C
260°C
245°C
245°C
Time
Reference JDEC J-STD-020D
Profile Feature
Standard SnPb Solder
Lead (Pb) Free Solder
Preheat and Soak
• Temperature min. (Tsmin)
• Temperature max. (Tsmax)
• Time (Tsmin to Tsmax) (ts)
100°C
150°C
60-120 Seconds
3°C/ Second Max.
183°C
60-150 Seconds
Table 1
20 Seconds**
6°C/ Second Max.
6 Minutes Max.
150°C
200°C
60-120 Seconds
3°C/ Second Max.
217°C
60-150 Seconds
Table 2
30 Seconds**
6°C/ Second Max.
8 Minutes Max.
Average ramp up rate Tsmax to Tp
Liquidous temperature (T
l
)
Time at liquidous (tL)
Peak package body temperature (TP)*
Time (tp)** within 5 °C of the specified classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax)
Time 25°C to Peak Temperature
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
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