solid state relay that uses optically coupled MOSFET
technology to provide 5000V
rms
of enhanced input to
output isolation.
Its optically coupled outputs, which use the patented
OptoMOS architecture, are controlled by a highly
efficient GaAIAs infrared LED.
Features
•
5000V
rms
Input/Output Isolation
•
Low Drive Power Requirements (TTL/CMOS
Compatible)
•
No Moving Parts
•
High Reliability
•
Arc-Free With No Snubbing Circuits
•
FCC Compatible
•
VDE Compatible
•
No EMI/RFI Generation
•
Small 6-Pin Package
•
Machine Insertable, Wave Solderable
Approvals
•
UL Recognized Component: File E76270
•
CSA Certified Component: Certificate 1175739
•
EN/IEC 60950-1 Certified Component:
TUV Certificate B 09 07 49410 004
Ordering Information
Part #
PLA191
PLA191S
PLA191STR
Description
6-Pin DIP (50/Tube)
6-Pin Surface Mount (50/Tube)
6-Pin Surface Mount (1000/Reel)
Applications
•
Telecommunications
•
Telecom Switching
•
Tip/Ring Circuits
•
Modem Switching (Laptop, Notebooks, Pocket
Size)
•
Hook Switch
•
Dial Pulsing
•
Ground Start
•
Ringing Injection
•
Instrumentation
•
Multiplexers
•
Data Acquisition
•
Electronic Switching
•
I/O Subsystems
•
Meters (Watt-Hour, Water, Gas)
•
Medical Equipment—Patient/Equipment Isolation
•
Security
•
Aerospace
•
Industrial Controls
Pin Configuration
AC/DC Configuration
+ Control
- Control
NC
1
2
3
6
5
4
Load
Do Not Use
Load
DC Only Configuration
+ Control
- Control
NC
1
2
3
6
5
4
+ Load
- Load
Switching Characteristics of
Normally Open Devices
Form-A
I
F
90%
I
LOAD
t
on
10%
t
off
Pb
DS-PLA191-R03
e
3
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1
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NTEGRATED
C
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D
IVISION
Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation
1
Total Package Dissipation
2
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
1
2
PLA191
Ratings
400
5
50
1
150
800
5000
-40 to +85
-40 to +125
Units
V
P
V
mA
A
mW
mW
V
rms
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Derate linearly 1.33 mW / ºC
Derate linearly 6.67 mW / ºC
Electrical Characteristics @ 25ºC
Parameters
Output Characteristics
Load Current, Continuous
AC/DC Configuration
DC Configuration
Peak Load Current
On-Resistance
1
AC/DC Configuration
DC Configuration
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Input to Output Capacitance
1
Conditions
Symbol
Min
Typ
Max
Units
-
-
t=10ms
I
L
=150mA
I
L
=250mA
V
L
=400V
P
I
L
I
LPK
-
-
-
-
-
-
-
-
-
-
0.4
0.9
-
-
-
-
-
-
-
-
-
-
65
-
0.7
1.2
-
3
250
350
±500
8
3
1
3
1
-
5
-
1.4
10
-
mA
rms
/ mA
DC
mA
DC
mA
P
A
ms
ms
pF
mA
mA
V
A
pF
R
ON
I
LEAK
t
on
t
off
C
OUT
I
F
I
F
V
F
I
R
C
I/O
I
F
=5mA, V
L
=10V
V
L
=50V, f=1MHz
I
L
=150mA
-
I
F
=5mA
V
R
=5V
-
Measurement taken within 1 second of on-time.
2
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R03
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NTEGRATED
C
IRCUITS
D
IVISION
PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted) *
Typical LED Forward Voltage Drop
(N=50, I
F
=5mA)
35
30
Device Count (N)
25
20
15
10
5
0
1.17
1.19
1.21
1.23
1.25
LED Forward Voltage Drop (V)
Device Count (N)
25
20
15
10
5
0
0.39
0.65
0.91
1.17
1.43
1.69
Turn-On Time (ms)
PLA191
Typical Turn-On Time
(N=50, I
F
=5mA, I
L
=250mA
DC
)
25
20
15
10
5
0
Typical Turn-Off Time
(N=50, I
F
=5mA, I
L
=250mA
DC
)
Device Count (N)
0.018
0.030
0.042
0.054
0.066
0.078
Turn-Off Time (ms)
25
20
15
10
5
0
Typical I
F
for Switch Operation
(N=50, I
L
=250mA
DC
)
25
20
15
10
5
0
Typical I
F
for Switch Dropout
(N=50, I
L
=250mA
DC
)
Typical On-Resistance Distribution
(N=50, I
F
=5mA, I
L
=250mA
DC
)
35
30
Device Count (N)
25
20
15
10
5
0
Device Count (N)
1.5
2.1
2.7
3.3
3.9
4.5
Device Count (N)
0.9
1.5
2.1
2.7
3.3
3.9
5.03
5.38
5.73
6.08
6.43
6.78
LED Forward Current (mA)
LED Forward Current (mA)
On-Resistance ( )
Typical Blocking Voltage Distribution
(N=50)
35
30
Device Count (N)
25
20
15
10
5
0
430
442
454
466
478
490
Blocking Voltage (V
P
)
Typical LED Forward Voltage Drop
vs. Temperature
LED Forward Voltage Drop (V)
1.8
Turn-On Time (ms)
1.6
1.4
1.2
1.0
0.8
-40
-20
0
20
40
60
80
100
120
Temperature (ºC)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0
5
Typical Turn-On Time
vs. LED Forward Current
(I
L
=250mA
DC
)
I
F
=50mA
I
F
=30mA
I
F
=20mA
I
F
=10mA
I
F
=5mA
0.050
0.045
0.040
0.035
0.030
0.025
0.020
0.015
0.010
0.005
0
0
5
Typical Turn-Off Time
vs. LED Forward Current
(I
L
=250mA
DC
)
Turn-Off Time (ms)
10
15
20
25
30
35
40
45
50
10
15
20
25
30
35
40
45
50
LED Forward Current (mA)
LED Forward Current (mA)
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
R03
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3
I
NTEGRATED
C
IRCUITS
D
IVISION
PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted) *
Typical Turn-On Time
vs. Temperature
(I
L
=250mA
DC
)
I
F
=5mA
I
F
=10mA
I
F
=20mA
PLA191
2.5
Turn-On Time (ms)
2.0
1.5
1.0
0.5
0
-40
-20
0.07
0.06
Turn-Off Time (ms)
0.05
0.04
0.03
0.02
0.01
Typical Turn-Off Time
vs. Temperature
(I
F
=5mA, I
L
=250mA
DC
)
On-Resistance ( )
0
20
40
60
80
100
0
-40
10
9
8
7
6
5
4
3
2
1
0
-40
-20
Typical On-Resistance
vs. Temperature
(I
F
=5mA, I
L
=250mA
DC
)
-20
0
20
40
60
80
100
0
20
40
60
80
100
Temperature (ºC)
Temperature (ºC)
Temperature (ºC)
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
-40
Typical I
F
for Switch Operation
vs. Temperature
(I
L
=250mA
DC
)
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
-40
Typical I
F
for Switch Dropout
vs. Temperature
(I
L
=250mA
DC
)
-20
0
20
40
60
80
100
-20
0
20
40
60
80
100
250
200
150
100
50
0
-50
-100
-150
-200
-250
-2.0 -1.5
Typical Load Current
vs. Load Voltage
(I
F
=5mA)
Load Current (mA)
LED Current (mA)
LED Current (mA)
-1.0
-0.5
0
0.5
1.0
1.5
2.0
Temperature (ºC)
Temperature (ºC)
Load Voltage (V)
Maximum Load Current
vs. Temperature
350
Load Current (mA)
300
250
200
150
100
-40
-20
0
20
40
60
80
100
120
Temperature (ºC)
Blocking Voltage (V
P
)
485
480
Typical Blocking Voltage
vs. Temperature
0.12
0.10
Leakage ( A)
0.08
0.06
0.04
0.02
0
-40
Typical Leakage vs. Temperature
Measured across Pins 4&6
475
470
465
460
455
450
445
-40
-20
0
20
40
60
80
100
Temperature (ºC)
I
F
=20mA
I
F
=10mA
I
F
=5mA
-20
0
20
40
60
80
100
Temperature (ºC)
Energy Rating Curve
1.2
1.0
Load Current (A)
0.8
0.6
0.4
0.2
0
10 s 100 s 1ms 10ms 100ms
Time
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
1s
10s 100s
4
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R03
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NTEGRATED
C
IRCUITS
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IVISION
Manufacturing Information
Moisture Sensitivity
PLA191
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard,
IPC/JEDEC J-STD-020,
in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a
Moisture Sensitivity Level (MSL) rating
as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard
IPC/JEDEC J-STD-033.
Device
PLA191 / PLA191S
Moisture Sensitivity Level (MSL) Rating
MSL 1
ESD Sensitivity
This product is
ESD Sensitive,
and should be handled according to the industry standard
JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020
must be observed.
Device
PLA191 / PLA191S
Maximum Temperature x Time
250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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