features enhanced peak load current capability. It
employs optically coupled MOSFET technology to
provide 3750V
rms
of input to output isolation.
Its optically coupled outputs, which use the patented
OptoMOS architecture, are controlled by a highly
efficient GaAIAs infrared LED.
This OptoMOS relay provides a more compact design
solution than discrete single-pole relays in a variety of
applications, and saves board space over conventional
electromechanical relays.
Features
•
3750V
rms
Input/Output Isolation
•
Low Drive Power Requirements
TTL/CMOS Compatible
•
High Reliability
•
Arc-Free With No Snubbing Circuits
•
FCC Compatible
•
VDE Compatible
•
No EMI/RFI Generation
•
Small 6-Pin Package
•
Machine Insertable, Wave Solderable
•
Surface Mount Tape & Reel Versions Available
Approvals
•
UL Recognized Component: File E76270
•
CSA Certified Component: Certificate 1175739
•
EN/IEC 60950-1 Certified Component:
TUV Certificate B 09 07 49410 006
Applications
•
Telecommunications
•
Telecom Switching
•
Tip/Ring Circuits
•
Modem Switching (Laptop, Notebook, Pocket Size)
•
Hook Switch
•
Dial Pulsing
•
Ground Start
•
Ringing Injection
•
Instrumentation
•
Multiplexers
•
Data Acquisition
•
Electronic Switching
•
I/O Subsystems
•
Meters (Watt-Hour, Water, Gas)
•
Medical Equipment-Patient/Equipment Isolation
•
Security
•
Aerospace
•
Industrial Controls
Ordering Information
Part #
LCB127
LCB127S
LCB127STR
Description
6-Pin DIP (50/Tube)
6-Pin Surface Mount (50/Tube)
6-Pin Surface Mount (1,000/Reel)
Pin Configuration
AC/DC Configuration
+ Control
– Control
Do Not Use
1
2
3
6
5
4
Load
Do Not Use
Load
DC Only Configuration
+ Control
– Control
Do Not Use
1
2
3
6
5
4
+ Load
– Load
Switching Characteristics
of Normally Closed Devices
Form-B
I
F
I
LOAD
90%
10%
t
off
t
on
Pb
DS-LCB127-R05
e
3
www.ixysic.com
1
I
NTEGRATED
C
IRCUITS
D
IVISION
Absolute Maximum Ratings @ 25ºC
Parameter
Ratings
Blocking Voltage
250
Reverse Input Voltage
5
Input Control Current
50
Peak (10ms)
1
Input Power Dissipation
1
150
800
Total Power Dissipation
2
Isolation Voltage, Input to Output
3750
Operational Temperature
-40 to +85
Storage Temperature
-40 to +125
1
2
LCB127
Units
V
P
V
mA
A
mW
mW
V
rms
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Derate linearly 1.33 mW / ºC
Derate linearly 6.67 mW / ºC
Electrical Characteristics @ 25ºC
Parameter
Output Characteristics
Load Current
Continuous, AC/DC Configuration
1
Continuous, DC Configuration
Peak
On-Resistance
AC/DC Configuration
DC Configuration
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Input to Output Capacitance
Conditions
Symbol
Min
Typ
Max
Units
-
t =10ms
I
L
=200mA
I
L
=300mA
V
L
=250V
P
I
L
I
L
I
LPK
-
-
-
-
-
-
-
-
-
-
0.4
0.9
-
-
-
-
-
8
2
-
-
-
50
-
0.7
1.2
-
3
200
300
±400
10
3
1
5
5
-
5
-
1.4
10
-
mA
rms
/ mA
DC
mA
DC
mA
P
A
R
ON
I
LEAK
t
on
t
off
C
OUT
I
F
I
F
V
F
I
R
C
I/O
I
F
=5mA, V
L
=10V
V
L
=50V, f=1MHz
I
L
=200mA
-
I
F
=5mA
V
R
=5V
-
ms
pF
mA
mA
V
A
pF
2
www.ixysic.com
R05
I
NTEGRATED
C
IRCUITS
D
IVISION
PERFORMANCE DATA* (@25ºC Unless Otherwise Noted)
Typical LED Forward Voltage Drop
(N=50)
35
30
Device Count (N)
Device Count (N)
25
20
15
10
5
0
1.17
1.19
1.21
1.23
1.25
LED Forward Voltage Drop (V)
25
20
15
10
5
0
0.03
0.05
0.07
0.09
0.11
0.13
Turn-On Time (ms)
LCB127
Typical Turn-On Time
(N=50, I
F
=5mA, I
L
=200mA
DC
)
25
20
15
10
5
0
Typical Turn-Off Time
(N=50, I
F
=5mA, I
L
=170mA
DC
)
Device Count (N)
0.75
1.05
1.35
1.65
1.95
2.25
Turn-Off Time (ms)
25
20
15
10
5
0
Typical I
F
for Switch Operation
(N=50, I
L
=200mA
DC
)
Typical I
F
for Switch Dropout
(N=50, I
L
=170mA
DC
)
25
20
15
10
5
0
25
20
15
10
5
0
1.0
1.4
1.8
2.2
2.6
3.0
Typical On-Resistance Distribution
(N=50, I
F
=5mA, I
L
=200mA
DC
)
Device Count (N)
Device Count (N)
Device Count (N)
1.4
1.8
2.2
2.6
3.0
3.4
5.325
5.495
5.665
5.835 6.005
6.175
LED Current (mA)
LED Current (mA)
On-Resistance ( )
Typical Blocking Voltage Distribution
(N=50)
25
20
15
10
5
0
310
314
318
322
326
330
Blocking Voltage (V
P
)
Device Count (N)
Typical LED Forward Voltage Drop
vs. Temperature
LED Forward Voltage Drop (V)
1.8
Turn-On Time (ms)
1.6
1.4
1.2
1.0
0.8
-40
-20
0
20
40
60
80
100
120
Temperature (ºC)
0.06
0.05
Typical Turn-On Time
vs. LED Forward Current
(I
L
=200mA
DC
)
1.6
1.4
Turn-Off Time (ms)
1.2
1.0
0.8
0.6
0.4
0.2
0
5
10
15
20
25
30
35
40
45
50
0
0
5
Typical Turn-Off Time
vs. LED Forward Current
(I
L
=200mA
DC
)
0.04
0.03
0.02
0.01
0
LED Forward Current (mA)
I
F
=50mA
I
F
=30mA
I
F
=20mA
I
F
=10mA
I
F
=5mA
10
15
20
25
30
35
40
45
50
LED Forward Current (mA)
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
R05
www.ixysic.com
3
I
NTEGRATED
C
IRCUITS
D
IVISION
PERFORMANCE DATA* (@25ºC Unless Otherwise Noted)
Typical Turn-On Time
vs. Temperature
(I
F
=5mA, I
L
=200mA
DC
)
Typical Turn-Off Time
vs. Temperature
(I
L
=200mA
DC
)
LCB127
0.12
Turn-On Time (ms)
0.10
2.5
Turn-Off Time (ms)
2.0
8
7
On-Resistance ( )
Typical On-Resistance
vs. Temperature
(I
F
=5mA, I
L
=200mA
DC
)
0.08
0.06
0.04
0.02
0
-40
I
F
=5mA
1.5
6
5
4
3
2
1
I
F
=10mA
1.0
I
F
=20mA
0.5
0
0
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
Temperature (ºC)
Temperature (ºC)
-20
0
20
40
60
80
100
Temperature (ºC)
4.5
4.0
LED Current (mA)
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
-40
Typical I
F
for Switch Operation
vs. Temperature
(I
L
=200mA
DC
)
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
LED Current (mA)
Typical I
F
for Switch Dropout
vs. Temperature
(I
L
=200mA
DC
)
250
Load Current (mA)
200
150
100
50
0
Maximum Load Current
vs. Temperature
(I
F
=5mA)
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
120
Temperature (ºC)
Temperature (ºC)
Temperature (ºC)
Typical Load Current
vs. Load Voltage
(I
F
=5mA)
200
Blocking Voltage (V
P
)
150
Load Current (mA)
100
50
0
-50
-100
-150
-200
-1.0 -0.8 -0.6 -0.4 -0.2
0
0.2 0.4 0.6 0.8 1.0
Typical Blocking Voltage
vs. Temperature
400
350
Leakage ( A)
300
250
200
150
100
50
0
-40
-20
0
20
40
60
Temperature (ºC)
80
100
0.045
0.040
0.035
0.030
0.025
0.020
0.015
0.010
0.005
0
-40
Typical Leakage vs. Temperature
Measured across Pins 4&6
-20
0
20
40
60
80
100
Load Voltage (V)
Temperature (ºC)
Energy Rating Curve
1.2
1.0
Load Current (A)
0.8
0.6
0.4
0.2
0
10 s 100 s 1ms 10ms 100ms
Time
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
1s
10s 100s
4
www.ixysic.com
R05
I
NTEGRATED
C
IRCUITS
D
IVISION
Manufacturing Information
Moisture Sensitivity
LCB127
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard,
IPC/JEDEC J-STD-020,
in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a
Moisture Sensitivity Level (MSL) rating
as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard
IPC/JEDEC J-STD-033.
Device
LCB127 / LCB127S
Moisture Sensitivity Level (MSL) Rating
MSL 1
ESD Sensitivity
This product is
ESD Sensitive,
and should be handled according to the industry standard
JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020
must be observed.
Device
LCB127 / LCB127S
Maximum Temperature x Time
250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
嵌入式系统
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
