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10112684-F03-07ULF

产品描述Headers u0026 Wire Housings Crimp-to-Wire Hsg,7P Pol,Latch,Single Row
产品类别连接器   
文件大小191KB,共7页
制造商FCI [First Components International]
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10112684-F03-07ULF概述

Headers u0026 Wire Housings Crimp-to-Wire Hsg,7P Pol,Latch,Single Row

10112684-F03-07ULF规格参数

参数名称属性值
产品种类
Product Category
Headers & Wire Housings
制造商
Manufacturer
FCI [First Components International]
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产品
Product
Headers
类型
Type
Pin Strip
位置数量
Number of Positions
7 Position
节距
Pitch
2 mm
排数
Number of Rows
1 Row
端接类型
Termination Style
SMD
安装角
Mounting Angle
Right Angle
主体材料
Contact Plating
Gold
触点材料
Contact Material
Phosphor Bronze
电流额定值
Current Rating
2 A
外壳材料
Housing Material
Thermoplastic
绝缘电阻
Insulation Resistance
1000 MOhms
Mating Post Length4 mm
工厂包装数量
Factory Pack Quantity
41
电压额定值
Voltage Rating
650 V

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TYPE
NUMBER
PRODUCT SPECIFICATION
TITLE
PAGE
GS-12-0804
REVISION
MINITEK
TM
Header SMT HORIZONTAL
1 of 7
AUTHORIZED BY
DATE
A
11 Jan 2011
JM COMPAGNON
CLASSIFICATION
UNRESTRICTED
1.0
OBJECTIVE
This specification defines the performance, test, quality, and reliability requirements of the Minitek
2.0 millimeters centerline SMT R/A.
TM
Header
2.0
SCOPE
This specification is applicable to the termination characteristics of the Minitek Header, when mated with
TM
FCI Minitek terminals or other 0.51mm pin compatible receptacles, 2mm centerline. This product provides
board to board, board to cable, board to discrete wire capabilities in horizontal one or two row configurations.
TM
3.0
REQUIREMENTS
3.1
MATERIAL
3.1.1 Pins: Pins shall be Phosphor Bronze Alloy UNS C51000 drawn wire in accordance with
ASTMB159
3.1.2 Insulator: High temperature Glass-filled polymer with a flame retardant rating of UL-94-V0
3.2
FINISH
The finish of the pins shall be as specified herein.
3.2.1 Solder tails: 2-6µm pure matte Tin over 1.27µm nickel MIN under plating.
3.2.2 Contact areas: As defined by product drawings, will be plated with the specified thickness
Class II -
0.76µm Gold/GXT over 1.27µm nickel MIN under plating.
Class III
Gold flash over 1.27µm nickel MIN under plating
2µm MIN full Tin MIN over 1.27µm nickel MIN under plating
3.2.3 All other areas will be plated with 1.27µm min of nickel.
3.3
Copyright FCI
Form E-3334
Rev E
DESIGN AND CONSTRUCTION
GS-01-001

 
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