Type
NUMBER
PRODUCT SPECIFICATION
TITLE
PAGE
TM
GS-12-390
REV.
PCI EXPRESS
SMT TYPE CONNECTOR
1 of
10
AUTHORIZED BY
DATE
A
01/24/’07
Richard Chiu
TABLE
SECTION 1
SECTION 2
SECTION 3
3.1
3.2
3.3
3.4
SECTION 4
4.1
4.2
4.3
4.4
4.5
4.6
4.7
SECTION 5
OF
CONTENTS
INTRODUCTION
GENERAL REQUIREMENTS
MECHANICAL
EXAMINATION OF PRODUCT
INSERTION/WITHDRAWAL FORCES – ADD IN CARD
CONTACT RETENTION
SOLDERABILITY
ELECTRICAL
LOW LEVEL CONTACT RESISTANCE
INSULATION RESISTANCE
DIELECTRIC WITHSTANDING
CONTACT CURRENT RATING
INSERTION LOSS
RETURN LOSS
CROSSTALK
ENVIRONMENTAL
5.1 THERMAL SHOCK
5.2 CYCLIC TEMPERATURE AND HUMIDITY
5.3 TEMPERATURE LIFE (PRE-CONDITIONING)
5.4 TEMPERATURE LIFE
5.5 VIBRATION
5.6 DURABILITY (PRE-CONDITIONING)
5.7 DURABILITY
5.8 MIXED FLOWING GAS
5.9 RESEATING
5.10 RESISTANCE TO SOLDER HEAT
SECTION 6
TEST MATRIX
PDS:
This document is the property of and embodies CONFIDENTIAL and PROPRIETARY information of FCI. No part of the information shown on
Printed: Jan 28,
way or
Rev :A
STATUS:Released
the document may be used in any
2011
disclosed to others without the written consent of FCI.
Copyright
Form E-3005
Rev E
FCI.
GS-01-001
Type
NUMBER
PRODUCT SPECIFICATION
TITLE
PAGE
TM
GS-12-390
REV.
PCI EXPRESS
SMT TYPE CONNECTOR
2 of
10
AUTHORIZED BY
DATE
A
01/24/’07
Richard Chiu
1.0 INTRODUCTION
1.1 SCOPE
This document describes the functional and test requirements
for the PCI Express
TM
card-edge connector. The connector is
designed to meet the requirements of the PCI Express Card
Electromechanical Specification and certain customer
specifications not covered by the PCI-SIG document.
1.2 APPLICABLE DOCUMENTS
1.2.1
1.2.2
1.2.3
1.2.4
1.2.5
Solderability : BUS-19-002/A
PCI Express Card Electromechanical Specification
EIA-364-09,17,20,21,28,31,32,65,70,90,101,108,638.
EIA-364-1000.01 test groups 1,2,3 and 4.
PCI Express Connector High Speed Electrical Test
Procedure.
FCI drawing, PCI Express connector, inspection &
customer copy.
1.3 DRAWING PRECEDENCE
In the event of conflict between this document and product
prints, the product prints shall take precedence.
2.0 GENERAL REQUIREMENTS
2.1
The connector has the following characteristics:
1.00m(0.040”) pitch, X1, X4, X8 sizes, surface mount
configuration, rectangular outline, plastic peg or two
holdowns requiring solder pad on PCB.
Visual examination, unless otherwise specified, shall be
made at 7X.
Silicone compounds (mold releases, lubricants, etc.) May
not be used in the manufacturing processes.
Flammability to be rated UL 94V-0.
Unless otherwise specified, tests that require the use of
a pc edge card shall use the following
Card material: FR-4 glass epoxy.
Thickness: 1.57 +/- 0.13 (0.062 +/- 0.005 inch)
Trace material: 0.035 (0.0014 inches), copper.
Trace plating: 0.76 micrometers (30 microinches)
minimum gold over 1.27 micrometers (50 microinches)
minimum unbrushed nickel
2.2
2.3
2.4
2.5
2.5.1
2.5.2
2.5.3
2.5.4
2.5.5 Pad and trace design: pad and trace design shall follow
PCI Express standard as depicted in customer drawing.
PDS:
This document is the property of and embodies CONFIDENTIAL and PROPRIETARY information of FCI. No part of the information shown on
Printed: Jan 28,
way or
Rev :A
STATUS:Released
the document may be used in any
2011
disclosed to others without the written consent of FCI.
Copyright
Form E-3005
Rev E
FCI.
GS-01-001
Type
NUMBER
PRODUCT SPECIFICATION
TITLE
PAGE
TM
GS-12-390
REV.
PCI EXPRESS
SMT TYPE CONNECTOR
3 of
10
AUTHORIZED BY
DATE
A
01/24/’07
Richard Chiu
2.6 SOLDERTAIL TERMINATION
Tests requiring termination of the soldertails to a PC
board shall be prepared as follows:
2.6.1 A 1.6 mm minimum thick FR-4 glass epoxy board having no
internal ground planes with plated pads in the pattern
specified in FCI customer drawing, shall be used.
2.6.2 For soldering soldertails, 0.09 mm minimum thickness
solder paste should be used on PC board pads.
3.0 MECHANICAL REQUIREMENTS
3.1 EXAMINATION OF PRODUCT
Samples must comply to applicable FCI product prints.
3.2 INSERTION / WITHDRAWAL FORCE- ADD IN CARD
PER EIA-364-13
Mating cycle is with maximum/minimum thickness gauge at a rate
of 25.4 mm/minute.
3.2.1 Maximum insertion force is 1.15 N max. per contact pair
when measured with a 1.70 +0.00/-0.01(0.067 +0.000/
-0.004 inches) thick hardened steel card made to the
dimensions shown for the PCI Express expansion board
in the FCI customer drawing. The card has a R0.05
min., R0.10 max.(sharpedge)and the surface roughness
in connector area to be 0.10 micrometers (4
microinches) maximum.
3.2.2 Withdrawal force is 0.15N minimum per contact pair when
measured with a 1.44 +0.01/-0.00 (0.067 +0.004/-0.000
inches) thick hardened steel card made to the
dimensions shown for the PCI Express expansion board
in the FCI customer drawing. The card has a R0.05
min., R0.10 max (sharp edge) and the surface
roughness in the connector area to be 0.10 micrometers
(4 microinches) maximum.
3.3
CONTACT RETENTION
Minimum retention force of terminals in the connector
housing to be 5N each. Pull rate to be 1.27 mm/min.
3.4 SOLDERABILITY
PDS:
This document is the property of and embodies CONFIDENTIAL and PROPRIETARY information of FCI. No part of the information shown on
Printed: Jan 28,
way or
Rev :A
STATUS:Released
the document may be used in any
2011
disclosed to others without the written consent of FCI.
Copyright
Form E-3005
Rev E
FCI.
GS-01-001
Type
NUMBER
PRODUCT SPECIFICATION
TITLE
PAGE
TM
GS-12-390
REV.
PCI EXPRESS
SMT TYPE CONNECTOR
4 of
10
AUTHORIZED BY
DATE
A
01/24/’07
Richard Chiu
Per EIA –364-52
a. steam age for 1 hour
b. 220°C for 5 seconds(Tin/Lead plating);245°C for 5
seconds(Tin plating)
c. contact areas evaluated shall meet 95% minimum coverage.
4.0 ELECTRICAL REQUIREMENTS
Unless otherwise specified, all measurements should be
performed in the following ambients:
relative humidity:
temperature:
barometric pressure:
4.1 LOW LEVEL CONTACT RESISTANCE
EIA-364-23
4.1.1 Solder connector to pc board per section 2.6 and insert card
per section 2.5
4.1.2 Resistance measurements should be made from the underside of
the pc board to the PTH in the add-in card above the contact
pad. The test current shall be 100 milliampere d.c. max.
with a maximum open circuit voltage of 20 millivolts D.C.
See figure 1.0 for attachment of current and voltage leads.
4.1.3 Requirement is 30 milliohms maximum initial, with change of
10 milliohms maximum after exposure testing.
50% or less
25°C +/- 5°c
711 to 812 mm mercury (at sea level)
PDS:
This document is the property of and embodies CONFIDENTIAL and PROPRIETARY information of FCI. No part of the information shown on
Printed: Jan 28,
way or
Rev :A
STATUS:Released
the document may be used in any
2011
disclosed to others without the written consent of FCI.
Copyright
Form E-3005
Rev E
FCI.
GS-01-001
Type
NUMBER
PRODUCT SPECIFICATION
TITLE
PAGE
TM
GS-12-390
REV.
PCI EXPRESS
SMT TYPE CONNECTOR
5 of
10
AUTHORIZED BY
DATE
A
01/24/’07
Richard Chiu
CONTACT RESISTANCE TEST SET UP
SMT TYPE
FIGURE 1.0
4.2 INSULATION RESISTANCE
Requirement is 1000 megohm minimum at 100 + / - 10% vdc when
tested to EIA-364-21 per spec. The connector shall not be mated
during insulation resistance measurement.
4.3 DIELECTRIC WITHSTANDING
Per EIA-364-20 method B per spec. Test potential to be 300 VAC RMS,
60 HZ, and applied for 1 minute. No breakdown should occur. Test
is performed with connector unmated.
4.4 CONTACT CURRENT RATING
1.1 amp per contact minimum per EIA-364—70, method 2 and
PCI
Express Connector High Speed Electrical Test Procedure.
The
temperature rise shall not exceed 30 degree C. Ambient condition
is still air at 25°C.
4.5 INSERTION LOSS
PDS:
This document is the property of and embodies CONFIDENTIAL and PROPRIETARY information of FCI. No part of the information shown on
Printed: Jan 28,
way or
Rev :A
STATUS:Released
the document may be used in any
2011
disclosed to others without the written consent of FCI.
Copyright
Form E-3005
Rev E
FCI.
GS-01-001
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