电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

10124274-001TRLF

产品描述I/O Connectors 12 Gb/s SAS, 29P R/A RCPT SMT,2.85mm
产品类别连接器   
文件大小325KB,共12页
制造商FCI [First Components International]
下载文档 详细参数 全文预览

10124274-001TRLF在线购买

供应商 器件名称 价格 最低购买 库存  
10124274-001TRLF - - 点击查看 点击购买

10124274-001TRLF概述

I/O Connectors 12 Gb/s SAS, 29P R/A RCPT SMT,2.85mm

10124274-001TRLF规格参数

参数名称属性值
产品种类
Product Category
I/O Connectors
制造商
Manufacturer
FCI [First Components International]
RoHSDetails
产品
Product
SAS Connectors
型式
Gender
Female
位置数量
Number of Positions
29 Position
主体材料
Contact Plating
Gold
端接类型
Termination Style
SMD
安装角
Mounting Angle
Right
系列
Packaging
Reel
ColorBlack
触点材料
Contact Material
Copper Alloy
电流额定值
Current Rating
1.5 A
Flammability RatingUL 94 V-0
外壳材料
Housing Material
Thermoplastic
工厂包装数量
Factory Pack Quantity
450

文档预览

下载PDF文档
NUMBER
TYPE
GS-12-1120
TITLE
PRODUCT SPECIFICATION
PAGE
REVISION
1 of 12
Serial Attached SCSI -3 (SAS -3) Connector
AUTHORIZED BY
DATE
C
19OCT2017
HK LIM
CLASSIFICATION
UNRESTRICTED
1.0
Objective
This specification defines the performance, test, quality and reliability requirements of Serial Attached SCSI -
3 host and device series products.
2.0
Scope
This specification is applicable to the termination characteristics of the SAS-3(up to 12Gb/s) family of
products which provides for direct blind mate interconnection of disk drives to backplanes.
3.0
Ratings
3.1
3.2
3.3
3.4
Operating Voltage Rating = 30 Volts Max (V
AC
or V
DC
)
Operating Current Rating = 1.5 Amperes per contact (DC or AC (RMS) MAX. @ 60 HZ)
Operating Temperature Range = 0 to 85 (
o
C)
Non-Operating Temperature Range = -40 to 85 (
o
C)
4.0
Applicable Documents
4.1
FCI Specifications
4.1.1
4.1.2
4.1.3
Engineering drawings
Process drawings
Application specification(s)
4.1.3.1
4.1.3.2
4.1.3.3
4.1.3.4
4.1.3.5
4.1.3.6
4.1.3.7
4.1.3.8
4.1.3.9
BUS-03-114:
GS-15-007:
GS-15-015:
BUS-19-002:
GS-19-048:
GS-19-039:
BUS-19-122:
GS-19-027:
Capacitance Measurement
Electrodeposited Tin
Gold in Contact Plating
Solderability
Porosity
Plating Adhesion
Solder Joint Reliability
Moisture Sensitivity Level
Pb-free Solder Heat Resistance Procedure – Convection Oven
Flow
4.1.3.11 GS-22-012:
Pb-free Solder Heat Resistance Procedure – Wave Solder
BUS-15-002/X: Nickel Plating
4.1.3.10 GS-22-011:
©
2016
AFCI.
GS-01-029
Form E-3701 – Revision D
PDS: Rev :C
STATUS:Released
Printed: Oct 26, 2017

技术资料推荐更多

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2870  951  2071  2657  1133  14  8  31  19  53 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved