Embedded Power for
Business-Critical Continuity
PTHxx010Y
3.3/5/12 Vin
Total Power:
# of Outputs:
27 Watts
Single
Rev. 3.23.09_73
PTHxx010Y Series
1 of 5
Specifications
Special Features
• V
TT bus termination output
(output the system V
REF)
• 15 A output current
• 3.3, 5, or 12 Vdc input voltage
• DDR and QDR compatible
• ON/OFF inhibit ( for V
TT stand-
by)
• Under-voltage lockout
• Operating temperature range:
-40 °C to +85 °C
• Efficiencies up to 91%
• Output overcurrent protection
(non-latching, auto-reset)
• Point-of-Load-Alliance (POLA)
compatible
• Available RoHS compliant
• 2 Year Warranty
Input
Input current:
Input voltage range:
No load
PTH03010Y
PTH05010Y
PTH12010Y
Vin increasing
Vin decreasing
Vin increasing
Vin decreasing
Vin increasing
Vin decreasing
PTH03010Y & PTH05010Y
PTH12010Y
10 mA
2.95 - 3.65 Vdc
4.5 - 5.5 Vdc
10.8 - 13.2 Vdc
2.45 V typ., 2.80 V max.
2.20 V min., 2.40 V typ.
4.30 V typ., 4.45 V max.
3.40 V min., 3.70 V typ.
9.5 V typ., 10.4 V max.
8.80 V min., 9.0 V typ.
470 µF
560 µF
Positive logic
Undervoltage lockout:
PTH03010Y
PTH05010Y
PTH12010Y
Input capacitance:
(See Note 3, page 3)
Remote ON/OFF:
All specifications are typical at nominal input, V
REF
= 1.25 V, full load at 25 °C unless otherwise stated
C
in,
C
o1, C
C
o2 = typical value
Safety
• UL/cUL CAN/CSA-C22.2
No. 60950
File No. E174104
• TÜV Product Service
B 04 06 38572 044
(EN60950) Certificate No.
• CB Report and Certificate
to IEC60950, Certificate No.
US/8292/UL
Embedded Power for
Business-Critical Continuity
Specifications Continued
Output
Output current:
(over V
REF
range)
V
(See Note 1, page 3)
Tracking range for V
REF
:
Tracking tolerance
to
V
REF
(V
TT
- V
REF
):
(over line, load & temperature)
Ripple and noise:
Load transient response:
(See Note 4, page 3)
Output capacitance:
Non-ceramic values
(See Notes 4 & 5, page 3)
Ceramic values
(See Note 4, page 3)
(See Note 6, page 3)
PTH03010Y
PTH05010Y
PTH12010Y
PTH03010Y
PTH05010Y
PTH12010Y
ESR (non-ceramic)
470 µF typ., 8,200 µF max.
µF typ., 8,200 µF max.
470 µF typ., 8,200 µF max.
µF typ., 8,200 µF max.
940 µF typ., 6,600 µF max.
µF typ., 6,600 µF max.
200 µF typ., 300 µF max.
µF typ., 300 µF max.
200 µF typ., 300 µF max.
µF typ., 300 µF max.
400 µF typ., 600 µF max.
µF typ., 600 µF max.
4 mΩ min.
20 MHz bandwidth
PTH03010Y & PTH05010Y
PTH12010Y
± 15 A
± 12 A
0.55 - 1.8 V
-10 mV to + 10 mV
20 mV pk-pk
30 µs settling time
µs settling time
Overshoot/undershoot 30 mV typ.
Rev. 3.23.09_73
PTHxx010Y Series
2 of 5
General Specifications
Efficiency:
lo = 10 A
Insulation voltage:
Switching frequency:
PTH03010Y
PTH05010Y
PTH12010Y
PTH03010Y
PTH05010Y
PTH12010Y
88% typ.
88% typ.
85% typ.
Non-isolated
300 - 400 kHz
300 - 400 kHz
200 - 300 kHz
EN60950
UL/cUL60950
UL94V-0
(L x W x H)
34.80 x 15.75 x 9.00 mm
1.370 x 0.620 x 0.354 in
3.7 g (0.13 oz)
Telcordia SR-332
Operating ambient, temperature
Non-operating
JEDEC J-STD-020C
PTH03010Y & PTH05010Y
PTH12010Y
6,000,000 hours
-40 °C to +85 °C
-40 °C to +125 °C
Level 3
27.5 A typ.
20.0 A typ.
Approvals and standards:
Material flammability:
Dimensions:
Weight:
MTBF:
Environmental Specifications
Thermal Performance:
(See Note 2, page 3)
MSL (‘Z’ suffix only):
Protection
Overcurrent threshold (auto reset):
Embedded Power for
Business-Critical Continuity
Rev. 3.23.09_73
PTHxx010Y Series
3 of 5
Ordering Information
Output Power
(max)
27 W
27 W
21.6 W
Input
Voltage
2.95 - 3.65 Vdc
4.5 - 5.5 Vdc
10.8 - 13.2 Vdc
V
TT
Range
0.55 - 1.8 Vdc
0.55 - 1.8 Vdc
0.55 - 1.8 Vdc
Output Currents
Min
0 A
0 A
0 A
Max
± 15 A
± 15 A
± 15 A
Efficiency
(max)
88%
88%
85%
Model Numbers
(8, 9)
odel Numbers
PTH03010Y
PTH05010Y
PTH12010Y
Part Number System with Options
PTH05010YAST
Product Family
Point of Load Alliance
Compatible
Input Voltage
03 = 3.3 V, 05 = 5 V
and 12 = 12 V
Output Current
01 = 15 A
Mechanical Package
Always 0
Packaging Options
No Suffix = Trays
T = Tape and Reel
(7)
Mounting Option
(8)
D = Horizontal Through-Hole (RoHS 6/6)
H = Horizontal Through-Hole (RoHS 5/6)
S = Surface-Mount Solder Ball (RoHS 5/6)
Z = Surface-Mount Solder Ball (RoHS 6/6)
Pin Option
A = Through-Hole Std. Pin Length (0.140”)
A = Surface-Mount Tin/Lead Solder Ball
Output Voltage Code
Y = DDR Module
Notes
1 Rating is conditional on the module being soldered to a 4 layer PCB
with 1 oz. copper. See the SOA curves or contact the factory for
appropriate derating.
2 This control pin has an internal pull-up to the input voltage Vin. If
it is left open-circuit the module will operate when input power is
applied. A small low-leakage (< 100 nA) MOSFET is recommended
for control. For further information, consult Application Note 177.
3 An input capacitor is required for proper operation. The capacitor
must be rated for a minimum of 800 mA rms of ripple current.
4
The typical value of external output capacitance value ensures that
V
TT
meets the specified transient performance requirements for
the memory bus terminations. Lower values of capacitance may
be possible when the measured peak change in output current is
consistently less than 3 A. Test conditions were 15 A/µs load step,
-1.5 A to +1.5 A.
5 This is the calculated maximum. The minimum ESR limitation will
often result in a lower value. Consult Application Note 177 for
further details.
6
This is the typical ESR for all the electrolytic (non-ceramic) output
capacitance. Use 7 mΩ as the minimum when using max-ESR
values to calculate.
7 Tape and reel packaging only available on the surface-mount
versions.
8
To order Pb-free (RoHS compatible) surface-mount parts replace
the mounting option ‘S’ with ‘Z’, e.g. PTHXX010YAZ. To order Pb-
free (RoHS compatible) through-hole parts replace the mounting
option ‘H’ with ‘D’, e.g. PTHXX010YAD.
9 NOTICE: Some models do not support all options. Please contact
your local Emerson Network Power representative or use the on-line
model number search tool at http://www.PowerConversion.com to
find a suitable alternative.
Embedded Power for
Business-Critical Continuity
Characteristic Data
Rev. 3.23.09_73
PTHxx010Y Series
4 of 5
16
14
OUTPUT CURRENT (A)
14
12
10
8
6
4
2
0
0
10
20
30
40
50
60
70
80
Nat conv
100 LFM
200 LFM
OUTPUT CURRENT (A)
12
10
8
6
4
2
0
0
10
20
30
40
50
60
70
80
Nat conv
100 LFM
200 LFM
AMBIENT TEMPERATURE (ºC)
Figure 1 - Safe Operating Area
Vin = 3.3 V, VREF = 1.25 V, Iout = 15 A (See Note A)
AMBIENT TEMPERATURE (ºC)
Figure 2 - Safe Operating Area
Vin = 12 V, VREF = 1.25 V, Iout = 12 A (See Note A)
V
in
100
90
Vin
V
DDQ
1k
1%
10 9
8
VREF
1
7
V
TT
EFFICIENCY (%)
80
70
60
50
0
3
6
9
12
15
3.3V
5.0V
12.0V
1k
1%
PTHxx010Y
(Top View)
2
3 4
5
6
Co
n
hf-Ceramic
V
TT
Termination Island
C
in
(Required)
+
Co
1
+
Co
2
Low-ESR
(Required) Ceramic
(Optional)
Standby
GND
Q
1
BSS138
(Optional)
SSTL-2
Data/
Address/
Bus
OUTPUT CURRENT (A)
Figure 3 - Efficiency vs Load Current
VREF = 1.25 V (See Note B)
Figure 4 - Standard Application
Notes
A SOA curves represent the conditions at which internal components are within
the Emerson Network Power derating guidelines.
B
Characteristic data has been developed from actual products tested at 25 °C.
This data is considered typical data for the converter.
Embedded Power for
Business-Critical Continuity
Mechanical Drawings
1.370 (34.80)
0.125 (3.18)
0.125 (3.18)
0.375
(9.52)
1
10
9
8
0.060
(1.52)
7
0.620
0.500 (15.75)
(12.70)
0.070 (1.78)
(Standoff Shoulder)
Lowest Component
0.010 min. (0.25)
Bottom side Clearance
Americas
0.140
(3.55)
0.625 (15.88)
ø0.040
(1.02)
5 Places
Rev. 3.23.09_73
PTHxx010Y Series
5 of 5
0.060
(1.52)
5810 Van Allen Way
Carlsbad, CA 92008
USA
Telephone: +1 760 930 4600
Facsimile: +1 760 930 0698
Europe (UK)
2
3
4
5
TOP VIEW
6
Waterfront Business Park
Merry Hill, Dudley
West Midlands, DY5 1LX
United Kingdom
Telephone: +44 (0) 1384 842 211
Facsimile: +44 (0) 1384 843 355
Asia (HK)
Host Board
0.354 (9.00)
MAX.
SIDE VIEW
Dimensions in Inches (mm)
Tolerances (unless otherwise specified)
2 Places 0.030 (0.76)
3 Places 0.010 (0.25)
14/F, Lu Plaza
2 Wing Yip Street
Kwun Tong, Kowloon
Hong Kong
Telephone: +852 2176 3333
Facsimile: +852 2176 3888
Figure 5 - Plated Through-Hole
For global contact, visit:
www.PowerConversion.com
techsupport.embeddedpower
@emerson.com
1.370 (34.80)
0.125 (3.18)
0.125 (3.18)
0.375
(9.52)
1
10
9
8
0.060
(1.52)
7
0.500 0.620
(12.70) (15.75)
0.354 (9.00)
max.*
*After solder reflow
on customer board
0.060
(1.52)
0.625 (15.88)
While every precaution has been taken to ensure
accuracy and completeness in this literature, Emerson
Network Power assumes no responsibility, and disclaims
all liability for damages resulting from use of this
information or for any errors or omissions.
Solder Ball
ø0.040 (1.02)
10 Places
Lowest Component
0.010 min. (0.25)
Bottom side Clearance
Emerson Network Power.
The global leader in enabling
business-critical continuity.
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service marks of Emerson Electric Co.
©2008 Emerson Electric Co.
2
3
4
5
TOP VIEW
6
SIDE VIEW
Host Board
Dimensions in Inches (mm)
Tolerances (unless otherwise specified)
2 Places 0.030 (0.76)
3 Places 0.010 (0.25)
Figure 6 - Surface-Mount
Pin Connections
Pin No.
Pin 1
Pin 2
Pin 3
Pin 4
Pin 5
Pin Connections cont.
Pin No.
Pin 6
Pin 7
Pin 8
Pin 9
Pin 10
Function
Ground
Vin
Inhibit*
N/C
Vo sense
Function
V
TT
Ground
V
REF
N/C
N/C
* Denotes negative logic:
Open = Normal operation
Ground = Function active
FPGA/CPLD
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