NUMBER
TYPE
GS-12-622
TITLE
Product Specification
PAGE
REVISION
1 of 19
QSFP+ Cable to Board Connector System
AUTHORIZED BY
DATE
N
Jul-13-2016
Michael Zhou
CLASSIFICATION
UNRESTRICTED
1.0
2.0
2.1
2.2
2.3
3.0
3.1
3.2
4.0
5.0
5.1
5.2
5.3
6.0
6.1
6.2
6.3
6.4
6.5
6.6
6.7
7.0
7.1
7.2
7.3
7.4
7.5
7.6
8.0
9.0
SCOPE
PRODUCT DESCRIPTION
Product Name and Series Number(s)
Dimensions, Materials, Plating and Markings
Additional General Specifications
REFERENCE DOCUMENTS
FCI Documents
Industrial Documents
QUALIFICATION
RATINGS
Voltage
Current
Temperature
PERFORMANCE
Electrical Characteristics
ESD Requirements
EMI Protection
QSFP+ Pin Assignment
2 Wire Interface EEPROM ( Lower and Upper Page )
Mechanical Characteristics
Environmental Requirements
QUALITY ASSURANCE PROVISIONS
Equipment Calibration
Inspection Conditions
Sample Quantity and Description
Acceptance
Qualification Testing
Requalification Testing
SUPPORTING INFORMATION
REVISION RECORD
Copyright FCI
Form E-3334
Rev F
PDS: Rev :P
STATUS:Released
GS-01-001
Printed: Jul 13, 2016
NUMBER
TYPE
GS-12-622
TITLE
Product Specification
PAGE
REVISION
2 of 19
QSFP+ Cable to Board Connector System
AUTHORIZED BY
DATE
N
Jul-13-2016
Michael Zhou
CLASSIFICATION
UNRESTRICTED
1.0
SCOPE
This specification is applicable to the performance characteristics of QSFP+ cable to board connector
system.
2.0
PRODUCT DESCRIPTION
2.1
PRODUCT NAME AND SERIES NUMBER(S)
Product
10G QSFP Cable Assembly
14G QSFP+ Cable Assembly
28G QSFP+ Cable Assembly
QSFP SMT Board Connector
QSFP Cage
QSFP Heat Sink
QSFP Heat Sink Clip
QSFP Cage with Sink and Clip Assembly
Custom QSFP Cable Assembly
Custom QSFP Cable Assembly
10G QSFP+ to 4xSFP+ Cable Assembly QSFP
End
28G QSFP+ to 4xSFP+ Cable Assembly QSFP
End
Series P/N
10093084
10119239
10121178
10099113/10132344
10099114/10128765/10130975
10099115
10099116
10116015/10128764
10110113
10111727
10114734
10130795
Test Sections
Do Not Apply
3.2, 6.4, 6.5
3.2, 6.4, 6.5
2.2
DIMENSIONS, MATERIALS, PLATING AND MARKINGS
Refer to the applicable customer drawing for the related dimensional, material, plating, and marking
information.
2.3
ADDITIONAL GENERAL SPECIFICATIONS
Plug PCB:
•
Material: FR4
•
Overall thickness: 1.0mm ±0.1(over pads)
•
Mating interface plating: Hard gold over nickel
Bulk Cable:
•
As listed on the cable specification drawings.
Copyright FCI
Form E-3334
Rev F
PDS: Rev :P
STATUS:Released
GS-01-001
Printed: Jul 13, 2016
NUMBER
TYPE
GS-12-622
TITLE
Product Specification
PAGE
REVISION
3 of 19
QSFP+ Cable to Board Connector System
AUTHORIZED BY
DATE
N
Jul-13-2016
Michael Zhou
CLASSIFICATION
UNRESTRICTED
3.0
REFERENCE DOCUMENTS
3.1
FCI DOCUMENTS
GS-14-1272
GS-14-1400
GS-20-126
SI-2009-09-004
SI-VG-2012-04-001
SI-VG-2012-11-013
SI-VG-2012-11-021
GS-29-622
EL-2012-05-033
EL-2012-12-023
Cable Assembly Packaging Specification
Board Connector, Cage, and Heat Sink Packaging Specification
Board Connector, Cage, and Heat Sink Product Application Specification.
10G QSFP+ Signal Integrity Performance Report (This Applies Only To
Standard Part Number)
14G QSFP+ Signal Integrity Performance Report (This only applies to the 14G
QSFP+ Part Number)
4x28G QSFP+ Signal Integrity Performance Reports (This applies only to
the 28G P/N)
10G Qualification Test Report Summary
14G Qualification Test Report
28G Qualification Test Report
3.2
INDUSTRY DOCUMENTS
FIT, FORM AND FUNCTION
SFF-8436
QSFP+ Copper and Optical Modules
SFF-8661
QSFP+ 28 Gb/s 4X Pluggable Module (Style A)
SFF-8662
QSFP+ 28 Gb/s 4X Connector (Style A) or
SFF-8672
QSFP+ 28 Gb/s 4X Connector (Style B)
SFF-8663
QSFP+ 28 Gb/s 4X Cage (Style A)
IEEE 802.3
Gigabit Ethernet Standard
Infiniband IBTA FDR (This applies only to the 14G QSFP+ P/N)
InfiniBand IBTA EDR (This applies only to the 4x28G QSFP+ P/N)
ITU-T G.957
Synchronous Digital Hierarchy Standard
Telcordia Technologies GR-253-CORE
JEDEC JESD22-A-114B ESD Specification
TEST SPECIFICATON(S)
EIA 364 Series
Procedure
Electrical Connector Test Procedures Including Environmental Classifications with Test
Copyright FCI
Form E-3334
Rev F
PDS: Rev :P
STATUS:Released
GS-01-001
Printed: Jul 13, 2016
NUMBER
TYPE
GS-12-622
TITLE
Product Specification
PAGE
REVISION
4 of 19
QSFP+ Cable to Board Connector System
AUTHORIZED BY
DATE
N
Jul-13-2016
Michael Zhou
CLASSIFICATION
UNRESTRICTED
4.0
QUALIFICATION
Connector and cable assemblies furnished under this specification shall be capable of meeting the
qualification test requirements specified herein and shall be uniform in quality, and void of all defects that
would adversely affect life or serviceability.
5.0
RATINGS
5.1
VOLTAGE
30 Volts AC per Contact (RMS)/DC Max.
5.2
CURRENT
0.5 Amps Max (per contact)
1.0 Amp Max (per power pin)
5.3
TEMPERATURE
Operating: -40ºC to +85ºC
6.0
PERFORMANCE
6.1
ELECTRICAL CHARACTERISTICS
DESCRIPTION
TEST CONDITION
REQUIREMENT
ITEM
6.1.1
LLCR
Mate connectors: apply a maximum voltage
of
320
mV and a current of
10
mA. (EIA 364-6)
After
100
VDC for 1 minute, measure the
insulation resistance between adjacent mated
contacts. (EIA 364-21)
Apply a voltage of
300
VDC for
1
minute hold
between adjacent mated terminals.
(EIA 364-20, method B)
Mate connectors: measure the temperature
rise at the rated current after
96
hours
(45 minutes ON and
15
minutes OFF per
hour). Testing as required.
20
milliohm maximum
change from initial after
environmental exposure
1000 mΩ Minimum
between adjacent
contacts
6.1.2
Insulation
Resistance
6.1.3
Dielectric
Withstanding
Voltage
Temperature Rise
(via Current
Cycling)
No defect between
adjacent contacts
6.1.4
Temperature rise:
+30°C
MAX.
Copyright FCI
Form E-3334
Rev F
PDS: Rev :P
STATUS:Released
GS-01-001
Printed: Jul 13, 2016
NUMBER
TYPE
GS-12-622
TITLE
Product Specification
PAGE
REVISION
5 of 19
QSFP+ Cable to Board Connector System
AUTHORIZED BY
DATE
N
Jul-13-2016
Michael Zhou
CLASSIFICATION
UNRESTRICTED
6.1.5
Differential
Impedance
Rise time of 70ps (20% to 80%)
(EIA 364-108)
No significant electrical
change
6.1.6
Continuity
Verify the continuous electrical path of all
expected connections
No unexpected opens,
shorts, or high
resistance areas.
6.2 ESD Requirements
The module shall meet ESD requirements given in EN61000-4-2, criterion B test specification such that
when installed in a properly grounded cage and chassis the units are subjected to 15KV air discharges
during operation and 8KV direct contact discharges to the case.
The QSFP+ module and host SFI contacts (High Speed Contacts) shall withstand 1000V electrostatic
discharge based on human body model per JEDEC JESD22-A114-B.
The QSFP+ module and host SFI contacts with the exception of the SFI contacts (High Speed Contacts)
shall withstand 2kV electrostatic discharge based on human body model per JEDEC JESD22-A114-B.
The QSFP+ module shall meet ESD requirements given in EN61000-4-2, criterion B test specification such
that units are subjected to 15kV air discharges during operation and 8kv direct contact discharges to the
case.
6.3 EMI Protection
The chassis ground of the QSFP+ module is isolated from the modules circuit ground to provide the
equipment designer flexibility regarding connections between external electromagnetic interference shields
and circuit ground of the module.
Copyright FCI
Form E-3334
Rev F
PDS: Rev :P
STATUS:Released
GS-01-001
Printed: Jul 13, 2016
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