150mA UCap Dual LDO Regulator
| MIC5264-2.8 | MIC5264-PGYML | MIC5264-PPYML | MIC5264-MMYML | MIC5264-PMYML | MIC5264-NNYML | MIC5264-MFYML | MIC5264-3.0 | MIC5264 | MIC5264-2.85 | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | 150mA UCap Dual LDO Regulator | 150mA UCap Dual LDO Regulator | 150mA UCap Dual LDO Regulator | 150mA UCap Dual LDO Regulator | 150mA UCap Dual LDO Regulator | 150mA UCap Dual LDO Regulator | 150mA UCap Dual LDO Regulator | 150mA UCap Dual LDO Regulator | 150mA UCap Dual LDO Regulator | 150mA UCap Dual LDO Regulator |
| Reach Compliance Code | - | compli | compli | compli | compli | compli | compli | - | - | - |
| 可调性 | - | FIXED | FIXED | FIXED | FIXED | FIXED | FIXED | - | - | - |
| 标称回动电压 1 | - | 0.21 V | 0.21 V | 0.21 V | 0.21 V | 0.21 V | 0.21 V | - | - | - |
| 最大绝对输入电压 | - | 7 V | 7 V | 7 V | 7 V | 7 V | 7 V | - | - | - |
| JESD-30 代码 | - | R-PDSO-N10 | R-PDSO-N10 | S-PDSO-N10 | R-PDSO-N10 | R-PDSO-N10 | R-PDSO-N10 | - | - | - |
| 最大电网调整率 | - | 0.006% | 0.006% | 0.0056% | 0.006% | 0.0057% | 0.0056% | - | - | - |
| 最大负载调整率 | - | 0.09% | 0.09% | 0.084% | 0.09% | 0.0855% | 0.084% | - | - | - |
| 输出次数 | - | 2 | 2 | 2 | 2 | 2 | 2 | - | - | - |
| 端子数量 | - | 10 | 10 | 10 | 10 | 10 | 10 | - | - | - |
| 工作温度TJ-Max | - | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | - | - | - |
| 工作温度TJ-Mi | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | - | - | - |
| 最大输出电流 1 | - | 0.15 A | 0.15 A | 0.15 A | 0.15 A | 0.15 A | 0.15 A | - | - | - |
| 标称输出电压 1 | - | 3 V | 3 V | 2.8 V | 3 V | 2.85 V | 2.8 V | - | - | - |
| 标称输出电压 2 | - | 1.8 V | 3 V | 2.8 V | 2.8 V | 2.85 V | 1.5 V | - | - | - |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - | - |
| 封装代码 | - | SON | SON | HVSON | SON | SON | SON | - | - | - |
| 封装等效代码 | - | SOLCC10,.11,20 | SOLCC10,.11,20 | SOLCC10,.11,20 | SOLCC10,.11,20 | SOLCC10,.11,20 | SOLCC10,.11,20 | - | - | - |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | - | - |
| 封装形式 | - | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | - | - | - |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | - | - |
| 表面贴装 | - | YES | YES | YES | YES | YES | YES | - | - | - |
| 技术 | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | - | - | - |
| 端子形式 | - | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | - | - | - |
| 端子节距 | - | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | - | - | - |
| 端子位置 | - | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | - | - | - |
| 最大电压容差 | - | 3% | 3% | 3% | 3% | 3% | 3% | - | - | - |
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