Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics
(Note 1)
TDFN
Junction-to-Ambient Thermal Resistance (θ
JA
)...........41°C/W
Junction-to-Case Thermal Resistance (θ
JC
)..................9°C/W
TSSOP
Junction-to-Ambient Thermal Resistance (θ
JA
)........38.3°C/W
Junction-to-Case Thermal Resistance (θ
JC
)..................3°C/W
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial.
Electrical Characteristics
(V
SUP
= +14V, T
A
= T
J
= -40°C to +125°C, unless otherwise noted. Typical values are at T
A
= +25°C, unless otherwise noted.)
PARAMETER
Supply Voltage Range
SYMBOL
V
SUP
(Note 2)
t < 1s
EN = low
Supply Current
I
SUP
EN = high, no load
3.3V and 5V output
1.8V output
40
2.8
4
25
65
1
3
0.4
5
10
3.2
CONDITIONS
MIN
3.5
TYP
MAX
28
42
8
35
90
mA
V
V
mA
µA
UNITS
V
EN = high, continuous, no switching
UV Lockout
Bias Voltage
Bias Current Limit
V
UVLO
V
BIAS
I
BIAS
Bias rising
+5.5V ≤ V
SUP
≤ +42V
V
UVLO,HYS
Hysteresis
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Maxim Integrated
│
3
MAX16903
2.1MHz, High-Voltage,
1A Mini-Buck Converter
Electrical Characteristics (continued)
(V
SUP
= +14V, T
A
= T
J
= -40°C to +125°C, unless otherwise noted. Typical values are at T
A
= +25°C, unless otherwise noted.)
BUCK CONVERTER
V
OUT,5V
V
OUT,3.3V
V
OUT,1.8V
Voltage Accuracy
V
OUT,5V
V
OUT,3.3V
V
OUT,1.8V
Skip-Mode Peak Current
High-Side DMOS RDS
ON
Low-Side DMOS RDS
ON
DMOS Peak Current-Limit
Threshold
Soft-Start Ramp Time
LX Rise Time
Minimum On-Time
PWM Switching Frequency
SYNC Input Frequency
Range
Spread-Spectrum Range
I
SKIP
R
ON,HS
R
ON,LS
I
MAX
t
SS
t
RISE,LX
t
ON
f
SW
f
SYNC
SS
Spread-spectrum option only
Internally generated
1.925
1.8
+6
1.275
7
V
BIAS
= 5V
V
OUT
= 5V, fixed frequency
V
OUT
= 5V, SKIP mode (Note 3)
6V ≤ V
SUP
≤ 18V,
V
OUT
= 3.3V, fixed frequency
I
LOAD
= 0 to 1A,
V
OUT
= 3.3V, SKIP mode (Note 3)
T
A
= 0°C to
+125°C
V
OUT
= 1.8V, fixed frequency
V
OUT
= 1.8V, SKIP mode (Note 3)
V
OUT
= 5V, fixed frequency
V
OUT
= 5V, SKIP mode (Note 3)
6V ≤ V
SUP
≤ 18V,
V
OUT
= 3.3V, fixed frequency
I
LOAD
= 0 to 1A,
V
OUT
= 3.3V, SKIP mode (Note 3)
T
A
= -40°C to
+125°C
V
OUT
= 1.8V, fixed frequency
V
OUT
= 1.8V, SKIP mode (Note 3)
-2.0%
-2.0%
-2.0%
-2.0%
-2.0%
-2.0%
-3.0%
-3.0%
-3.0%
-3.0%
-3.0%
-3.0%
5
5
3.3
3.3
1.8
1.8
5
5
3.3
3.3
1.8
1.8
350
400
250
1.5
8
5
80
2.1
2.275
2.6
800
450
1.75
9
+2.5%
+4%
+2.5%
+4%
+2.5%
+4.0%
+2.5%
+4%
+2.5%
+4%
+2.5%
+4%
mA
mΩ
mΩ
A
ms
ns
ns
MHz
MHz
%
V
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Maxim Integrated
│
4
MAX16903
2.1MHz, High-Voltage,
1A Mini-Buck Converter
Electrical Characteristics (continued)
(V
SUP
= +14V, T
A
= T
J
= -40°C to +125°C, unless otherwise noted. Typical values are at T
A
= +25°C, unless otherwise noted.)
PARAMETER
PGOOD
PGOOD Threshold
PGOOD Debounce
PGOOD HIGH Leakage
Current
PGOOD Output Low Level
LOGIC LEVELS
EN Level
EN Input Current
SYNC Switching Threshold
SYNC Internal Pulldown
THERMAL PROTECTION
Thermal Shutdown
Thermal Shutdown
Hysteresis
T
SHDN
T
SHDN,HYS
175
15
°C
°C
V
IH,EN
V
IL,EN
I
IN,EN
V
IH,SYNC
V
IL,SYNC
R
PD,SYNC
200
V
EN
= V
SUP
= +42V, T
A
= +25°C
1.4
0.4
2.4
0.6
1
V
µA
V
kΩ
V
THR,PGD
V
THF,PGD
t
DEB
I
LEAK,PGD
V
OUT,PGD
T
A
= +25°C, V
PGD
≤ V
OUT
Sinking 1mA
V
OUT
rising
V
OUT
falling
88
88
93
91
10
1
0.4
98
94
%
µs
µA
V
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Note 2:
When the typical minimum on-time of 80ns is violated, the device skips pulses.
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