
Digital Signal Processors & Controllers - DSP, DSC Floating-Pt Dig Signal Proc
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | BGA |
| 包装说明 | BGA, BGA256,16X16,40 |
| 针数 | 256 |
| Reach Compliance Code | compliant |
| ECCN代码 | 3A001.A.3 |
| 其他特性 | ALSO OPERATES AT 3.3 V NOMINAL SUPPLY |
| 地址总线宽度 | 13 |
| 桶式移位器 | NO |
| 位大小 | 32 |
| 边界扫描 | YES |
| 最大时钟频率 | 50 MHz |
| 外部数据总线宽度 | 16 |
| 格式 | FLOATING POINT |
| 内部总线架构 | MULTIPLE |
| JESD-30 代码 | S-PBGA-B256 |
| 长度 | 17 mm |
| 低功率模式 | YES |
| 端子数量 | 256 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | BGA |
| 封装等效代码 | BGA256,16X16,40 |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY |
| 峰值回流温度(摄氏度) | NOT SPECIFIED |
| 电源 | 1.2,1.8,3.3 V |
| 认证状态 | Not Qualified |
| RAM(字数) | 8192 |
| 座面最大高度 | 2.05 mm |
| 最大供电电压 | 1.32 V |
| 最小供电电压 | 1.14 V |
| 标称供电电压 | 1.2 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | BALL |
| 端子节距 | 1 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 17 mm |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER |
| TMX320C6747AZKB3 | TMX320C6745BPTP3 | TMX320C6745APTP3 | TMX320C6745PTP2 | TMS320C6747DZKBT3R | |
|---|---|---|---|---|---|
| 描述 | Digital Signal Processors & Controllers - DSP, DSC Floating-Pt Dig Signal Proc | Digital Signal Processors & Controllers - DSP, DSC TMS320C674X LOW POWER DSPS - FLOATING-POINT DIGITAL SIGNAL PROCESSOR | Digital Signal Processors & Controllers - DSP, DSC Floating-Point Dig Signal Proc | Digital Signal Processors & Controllers - DSP, DSC Floating-Pt Digital Signal Processor | Digital Signal Processors & Controllers - DSP, DSC Fixed/Floating-Point Digital Signal Processor 256-BGA |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | - |
| 零件包装代码 | BGA | QFP | QFP | QFP | - |
| 包装说明 | BGA, BGA256,16X16,40 | QFP, QFP176,1.0SQ,20 | HLFQFP, QFP176,1.0SQ,20 | HLFQFP, QFP176,1.0SQ,20 | - |
| 针数 | 256 | 176 | 176 | 176 | - |
| Reach Compliance Code | compliant | unknown | compliant | unknown | - |
| ECCN代码 | 3A001.A.3 | - | 3A001.A.3 | 3A001.A.3 | - |
| 其他特性 | ALSO OPERATES AT 3.3 V NOMINAL SUPPLY | - | ALSO OPERATES AT 3.3 V NOMINAL SUPPLY | ALSO OPERATES AT 3.3 V NOMINAL SUPPLY | - |
| 地址总线宽度 | 13 | - | 13 | 13 | - |
| 桶式移位器 | NO | - | NO | NO | - |
| 位大小 | 32 | 32 | 16 | 16 | - |
| 边界扫描 | YES | - | YES | YES | - |
| 最大时钟频率 | 50 MHz | - | 50 MHz | 50 MHz | - |
| 外部数据总线宽度 | 16 | - | 8 | 8 | - |
| 格式 | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | - |
| 内部总线架构 | MULTIPLE | - | MULTIPLE | MULTIPLE | - |
| JESD-30 代码 | S-PBGA-B256 | S-PQFP-G176 | S-PQFP-G176 | S-PQFP-G176 | - |
| 长度 | 17 mm | - | 24 mm | 24 mm | - |
| 低功率模式 | YES | - | YES | YES | - |
| 端子数量 | 256 | 176 | 176 | 176 | - |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | BGA | QFP | HLFQFP | HLFQFP | - |
| 封装等效代码 | BGA256,16X16,40 | QFP176,1.0SQ,20 | QFP176,1.0SQ,20 | QFP176,1.0SQ,20 | - |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | - |
| 封装形式 | GRID ARRAY | FLATPACK | FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH | FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH | - |
| 电源 | 1.2,1.8,3.3 V | 1.2,1.8,3.3 V | 1.2,1.8,3.3 V | 1.2,1.8,3.3 V | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| RAM(字数) | 8192 | 8192 | 16384 | 16384 | - |
| 座面最大高度 | 2.05 mm | - | 1.6 mm | 1.6 mm | - |
| 最大供电电压 | 1.32 V | - | 1.32 V | 1.32 V | - |
| 最小供电电压 | 1.14 V | - | 1.14 V | 1.14 V | - |
| 标称供电电压 | 1.2 V | - | 1.2 V | 1.2 V | - |
| 表面贴装 | YES | YES | YES | YES | - |
| 技术 | CMOS | CMOS | CMOS | CMOS | - |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | - |
| 端子形式 | BALL | GULL WING | GULL WING | GULL WING | - |
| 端子节距 | 1 mm | 0.5 mm | 0.5 mm | 0.5 mm | - |
| 端子位置 | BOTTOM | QUAD | QUAD | QUAD | - |
| 宽度 | 17 mm | - | 24 mm | 24 mm | - |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | - |
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