Datasheet> 器件分类 > 半导体> 嵌入式处理器和控制器> BX80662G3900-SR2HV

BX80662G3900-SR2HV: 产品描述CPU - Central Processing Units Boxed Intel Celeron Processor G3900 (2M Cache, 2.80 GHz) FC-LGA14C; 产品类别半导体嵌入式处理器和控制器; 文件大小4MB，共165页; 制造商Intel(英特尔); 官网地址http://www.intel.com/

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BX80662G3900-SR2HV概述

CPU - Central Processing Units Boxed Intel Celeron Processor G3900 (2M Cache, 2.80 GHz) FC-LGA14C

BX80662G3900-SR2HV规格参数

参数名称	属性值
产品种类 Product Category	CPU - Central Processing Units
制造商 Manufacturer	Intel(英特尔)
RoHS	Details
系列 Packaging	Bulk
工厂包装数量 Factory Pack Quantity	5

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6th Generation Intel

Processor

Families for S-Platforms

Datasheet, Volume 1 of 2

Supporting the 6th Generation Intel

Core™ Processor, Intel

Pentium

Processor, and Intel

Celeron

Processor Families based on the Desktop

S-Platform

August 2017

Order Number: 332687-006EN

You may not use or facilitate the use of this document in connection with any infringement or other legal analysis concerning Intel

products described herein. You agree to grant Intel a non-exclusive, royalty-free license to any patent claim thereafter drafted

which includes subject matter disclosed herein.

No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document.

Intel technologies' features and benefits depend on system configuration and may require enabled hardware, software or service

activation. Learn more at Intel.com, or from the OEM or retailer.

No computer system can be absolutely secure. Intel does not assume any liability for lost or stolen data or systems or any

damages resulting from such losses.

The products described may contain design defects or errors known as errata which may cause the product to deviate from

published specifications. Current characterized errata are available on request.

Intel disclaims all express and implied warranties, including without limitation, the implied warranties of merchantability, fitness for

a particular purpose, and non-infringement, as well as any warranty arising from course of performance, course of dealing, or

usage in trade.

Intel technologies' features and benefits depend on system configuration and may require enabled hardware, software or service

activation. Learn more at intel.com, or from the OEM or retailer.

All information provided here is subject to change without notice. Contact your Intel representative to obtain the latest Intel

product specifications and roadmaps.

Copies of documents which have an order number and are referenced in this document may be obtained by calling 1-800-548-

4725 or visit www.intel.com/design/literature.htm.

Intel, Intel Core, Pentium, Celeron, Xeon, the Intel logo, are trademarks of Intel Corporation in the U.S. and/or other countries.

*Other names and brands may be claimed as the property of others.

Datasheet, Volume 1 of 2

Contents

Introduction

............................................................................................................ 10

1.1

Supported Technologies ..................................................................................... 12

1.2

Power Management Support ............................................................................... 12

1.2.1 Processor Core Power Management........................................................... 12

1.2.2 System Power Management ..................................................................... 12

1.2.3 Memory Controller Power Management...................................................... 13

1.2.4 Processor Graphics Power Management ..................................................... 13

1.2.4.1 Memory Power Savings Technologies ........................................... 13

1.2.4.2 Display Power Savings Technologies ............................................ 13

1.2.4.3 Graphics Core Power Savings Technologies................................... 13

1.3

Thermal Management Support ............................................................................ 13

1.4

Package Support ............................................................................................... 14

1.5

Processor Testability .......................................................................................... 14

1.6

Terminology ..................................................................................................... 14

1.7

Related Documents............................................................................................ 17

Interfaces................................................................................................................

2.1

System Memory Interface................................................................................... 18

2.1.1 System Memory Technology Supported ..................................................... 18

2.1.1.1 DDR3L/-RS Supported Memory Modules and Devices ..................... 19

2.1.1.2 DDR4 Supported Memory Modules and Devices ............................. 20

2.1.2 System Memory Timing Support ............................................................... 20

2.1.3 System Memory Organization Modes ......................................................... 21

2.1.4 System Memory Frequency...................................................................... 22

2.1.5 Technology Enhancements of Intel

Fast Memory Access............................. 23

2.1.6 Data Scrambling .................................................................................... 23

2.1.7 DDR I/O Interleaving .............................................................................. 24

2.1.8 Data Swapping....................................................................................... 25

2.1.9 DRAM Clock Generation........................................................................... 25

2.1.10 DRAM Reference Voltage Generation ......................................................... 25

2.2

PCI Express* Graphics Interface (PEG) ................................................................. 25

2.2.1 PCI Express* Support ............................................................................. 25

2.2.2 PCI Express* Architecture ....................................................................... 27

2.2.3 PCI Express* Configuration Mechanism ..................................................... 28

2.2.4 PCI Express* Equalization Methodology ..................................................... 28

2.3

Direct Media Interface (DMI)............................................................................... 29

2.3.1 DMI Error Flow....................................................................................... 29

2.3.2 DMI Link Down ...................................................................................... 29

2.4

Processor Graphics ............................................................................................ 29

2.4.1 Operating Systems Support ..................................................................... 30

2.4.2 API Support (Windows*) ......................................................................... 30

2.4.3 Media Support (Intel

QuickSync & Clear Video Technology HD)................... 30

2.4.3.1 Hardware Accelerated Video Decode ............................................ 30

2.4.3.2 Hardware Accelerated Video Encode ............................................ 31

2.4.3.3 Hardware Accelerated Video Processing ....................................... 32

2.4.3.4 Hardware Accelerated Transcoding .............................................. 32

2.4.4 Camera Pipe Support .............................................................................. 32

2.4.5 Switchable/Hybrid Graphics ..................................................................... 33

2.4.6 GEN 9 Video Analytics ............................................................................. 33

2.4.7 GEN 9 (Generation 9) Block Diagram ........................................................ 34

2.4.8 GT2 Graphics Frequency.......................................................................... 34

Datasheet, Volume 1 of 2

4.3

4.4

4.5

4.6

4.7

Integrated Memory Controller (IMC) Power Management ........................................ 73

4.3.1 Disabling Unused System Memory Outputs ................................................ 73

4.3.2 DRAM Power Management and Initialization ............................................... 73

4.3.2.1 Initialization Role of CKE ............................................................ 74

4.3.2.2 Conditional Self-Refresh............................................................. 75

4.3.2.3 Dynamic Power-Down................................................................ 75

4.3.2.4 DRAM I/O Power Management .................................................... 75

4.3.3 DDR Electrical Power Gating (EPG)............................................................ 76

4.3.4 Power Training ....................................................................................... 76

PCI Express* Power Management ........................................................................ 76

Direct Media Interface (DMI) Power Management................................................... 76

Processor Graphics Power Management ................................................................ 76

4.6.1 Memory Power Savings Technologies ........................................................ 76

4.6.1.1 Intel

Rapid Memory Power Management (Intel

RMPM) ............... 76

4.6.1.2 Intel

Smart 2D Display Technology (Intel

S2DDT) ..................... 77

4.6.2 Display Power Savings Technologies ......................................................... 77

4.6.2.1 Intel

(Seamless & Static) Display Refresh Rate Switching (DRRS)

with eDP* Port ......................................................................... 77

4.6.2.2 Intel

Automatic Display Brightness ............................................ 77

4.6.2.3 Smooth Brightness.................................................................... 77

4.6.2.4 Intel

Display Power Saving Technology (Intel

DPST) 6.0 ............ 77

4.6.2.5 Low-Power Single Pipe (LPSP)..................................................... 78

4.6.3 Processor Graphics Core Power Savings Technologies .................................. 78

4.6.3.1 Intel

Graphics Dynamic Frequency ............................................ 78

4.6.3.2 Intel

Graphics Render Standby Technology (Intel

GRST) ............ 78

4.6.3.3 Dynamic FPS (DFPS) ................................................................. 78

Voltage Optimization.......................................................................................... 79

Thermal Management

.............................................................................................. 80

5.1

Processor Thermal Management .......................................................................... 80

5.1.1 Thermal Considerations........................................................................... 80

5.1.2 Intel

Turbo Boost Technology 2.0 Power Monitoring .................................. 81

5.1.3 Intel

Turbo Boost Technology 2.0 Power Control ....................................... 81

5.1.3.1 Package Power Control .............................................................. 81

5.1.3.2 Platform Power Control .............................................................. 82

5.1.3.3 Turbo Time Parameter (Tau) ...................................................... 83

5.1.4 Configurable TDP (cTDP) and Low-Power Mode ........................................... 83

5.1.4.1 Configurable TDP ...................................................................... 83

5.1.4.2 Low-Power Mode....................................................................... 84

5.1.5 Thermal Management Features ................................................................ 84

5.1.5.1 Adaptive Thermal Monitor .......................................................... 84

5.1.5.2 Digital Thermal Sensor .............................................................. 87

5.1.5.3 PROCHOT# Signal..................................................................... 87

5.1.5.4 Bi-Directional PROCHOT#........................................................... 88

5.1.5.5 Voltage Regulator Protection using PROCHOT# ............................. 88

5.1.5.6 Thermal Solution Design and PROCHOT# Behavior ........................ 88

5.1.5.7 Low-Power States and PROCHOT# Behavior ................................. 89

5.1.5.8 THERMTRIP# Signal .................................................................. 89

5.1.5.9 Critical Temperature Detection.................................................... 89

5.1.5.10 On-Demand Mode ..................................................................... 89

5.1.5.11 MSR Based On-Demand Mode..................................................... 89

5.1.5.12 I/O Emulation-Based On-Demand Mode ....................................... 90

5.1.6 Intel

Memory Thermal Management ........................................................ 90

5.1.7 Scenario Design Power (SDP)................................................................... 90

5.2

S-Processor Line Thermal and Power Specifications ................................................ 91

5.2.1 Thermal Profile for PCG 2015D Processor................................................... 94

5.2.2 Thermal Profile for PCG 2015C Processor ................................................... 95

Datasheet, Volume 1 of 2

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