BC546,A,B
BC547,A,B,C
BC548,A,B,C
SILICON
NPN TRANSISTORS
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DESCRIPTION:
The CENTRAL SEMICONDUCTOR BC546, BC547,
BC548 series devices are silicon NPN small signal
transistors, manufactured by the epitaxial planar
process, designed for general purpose amplifier
applications.
MARKING: FULL PART NUMBER
TO-92-18R CASE
MAXIMUM RATINGS:
(TA=25°C)
Collector-Base Voltage
Collector-Emitter Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Continuous Collector Current
Peak Collector Current
Peak Base Current
Peak Emitter Current
Power Dissipation
Operating and Storage Junction Temperature
Thermal Resistance
Thermal Resistance
SYMBOL
VCBO
VCES
VCEO
VEBO
IC
ICM
IBM
IEM
PD
TJ, Tstg
Θ
JA
Θ
JC
BC546
80
80
65
6.0
BC547
BC548
50
30
50
30
45
30
6.0
5.0
100
200
200
200
500
-65 to +150
250
150
UNITS
V
V
V
V
mA
mA
mA
mA
mW
°C
°C/W
°C/W
ELECTRICAL CHARACTERISTICS:
(TA=25°C unless otherwise noted)
SYMBOL
TEST CONDITIONS
MIN
ICBO
VCB=30V
ICBO
VCB=30V, TA=150°C
VCE(SAT)
IC=10mA, IB=0.5mA
VCE(SAT)
IC=100mA, IB=5.0mA
VBE(SAT)
IC=10mA, IB=0.5mA
VBE(SAT)
IC=100mA, IB=5.0mA
VBE(ON)
VCE=5.0V, IC=2.0mA
580
VBE(ON)
VCE=5.0V, IC=10mA
hFE
VCE=5.0V, IC=10μA (BC546,A, BC547,A, BC548,A)
hFE
VCE=5.0V, IC=10μA (BC546B, BC547B, BC548B)
hFE
VCE=5.0V, IC=10μA (BC547C, BC548C)
hFE
VCE=5.0V, IC=2.0mA (BC546)
110
hFE
VCE=5.0V, IC=2.0mA (BC546A, BC547A, BC548A) 110
hFE
VCE=5.0V, IC=2.0mA (BC546B, BC547B, BC548B) 200
hFE
VCE=5.0V, IC=2.0mA (BC547, BC548)
110
hFE
VCE=5.0V, IC=2.0mA (BC547C, BC548C)
420
hfe
VCE=5.0V, IC=2.0mA, f=1.0kHz
125
fT
VCE=5.0V, IC=10mA, f=35MHz
Cob
VCB=10V, IE=0, f=1.0MHz
Cib
VEB=0.5V, IC=0, f=1.0MHz
NF
VCE=5.0V, IC=0.2mA, RG=2.0kΩ,
B=200Hz, f=1.0kHz
TYP
MAX
15
5.0
250
600
700
900
700
770
90
150
270
450
220
450
800
800
900
300
2.5
9.0
2.0
10
UNITS
nA
μA
mV
mV
mV
mV
mV
mV
MHz
pF
pF
dB
R1 (13-December 2013)
OUTSTANDING SUPPORT AND SUPERIOR SERVICES
PRODUCT SUPPORT
Central’s operations team provides the highest level of support to insure product is delivered on-time.
• Supply management (Customer portals)
• Custom bar coding for shipments
• Inventory bonding
• Custom product packing
• Consolidated shipping options
DESIGNER SUPPORT/SERVICES
Central’s applications engineering team is ready to discuss your design challenges. Just ask.
• Free quick ship samples (2
nd
day air)
• Special wafer diffusions
• Online technical data and parametric search
• PbSn plating options
• SPICE models
• Package details
• Custom electrical curves
• Application notes
• Environmental regulation compliance
• Application and design sample kits
• Customer specific screening
• Custom product and package development
• Up-screening capabilities
REQUESTING PRODUCT PLATING
1.
2.
If requesting Tin/Lead plated devices, add the suffix “ TIN/LEAD” to the part number when
ordering (example: 2N2222A TIN/LEAD).
If requesting Lead (Pb) Free plated devices, add the suffix “ PBFREE” to the part number
when ordering (example: 2N2222A PBFREE).
CONTACT US
Corporate Headquarters & Customer Support Team
Central Semiconductor Corp.
145 Adams Avenue
Hauppauge, NY 11788 USA
Main Tel: (631) 435-1110
Main Fax: (631) 435-1824
Support Team Fax: (631) 435-3388
www.centralsemi.com
Worldwide Field Representatives:
www.centralsemi.com/wwreps
Worldwide Distributors:
www.centralsemi.com/wwdistributors
For the latest version of Central Semiconductor’s
LIMITATIONS AND DAMAGES DISCLAIMER,
which is part of Central’s Standard Terms and Conditions of sale, visit: www.centralsemi.com/terms
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