= 25°C unless otherwise noted; Electricals apply in both directions)
Characteristic
OFF CHARACTERISTICS
Repetitive Peak Off−State Current
(50 to 60 Hz Sine Wave)
ON CHARACTERISTICS
Breakover Voltage
I
BO
= 200
mA
Peak On−State Voltage
(I
TM
= 1 A Peak, Pulse Width
≤
300
ms,
Duty Cycle
≤
2%)
Dynamic Holding Current
(Sine Wave, 50 to 60 Hz, R
L
= 100
W)
Switching Resistance
(Sine Wave, 50 to 60 Hz)
DYNAMIC CHARACTERISTICS
Critical Rate−of−Rise of On−State Current,
Critical Damped Waveform Circuit
(I
PK
= 130 A, Pulse Width = 10
msec)
di/dt
−
120
−
A/ms
V
BO
V
TM
I
H
R
S
150
−
−
0.1
−
1.3
−
−
170
1.5
100
−
V
V
mA
kW
T
J
= 25°C
V
DRM
= 90 V
I
DRM
−
−
5.0
mA
Symbol
Min
Typ
Max
Unit
Voltage Current Characteristic of SIDAC
(Bidirectional Device)
+ Current
Symbol
I
DRM
V
DRM
V
BO
I
BO
I
H
V
TM
I
TM
Parameter
Off State Leakage Current
Off State Repetitive Blocking Voltage
Breakover Voltage
Breakover Current
Holding Current
On State Voltage
Peak on State Current
I
TM
I
H
V
TM
Slope = R
S
I
S
I
DRM
V
DRM
V
S
I
(BO)
+ Voltage
V
(BO)
R
S
+
(V
(BO)
– V
S
)
(I
S
– I
(BO)
)
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2
MKP9V160
TL , MAXIMUM ALLOWABLE LEAD TEMPERATURE (
°
C)
140
IT(RMS) , ON−STATE CURRENT (AMPS)
130
120
110
100
90
80
70
60
50
40
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
0
20
40
60
80
100
120
140
I
T(RMS)
, ON−STATE CURRENT (AMPS)
T
A
, MAXIMUM AMBIENT TEMPERATURE (°C)
T
J
= 125°C
Sine Wave
Conduction Angle = 180°C
T
L
3
/
″
8
3
/
″
8
1.0
T
J
= 125°C
Sine Wave
Conduction Angle = 180°C
Assembled in PCB
Lead Length =
3
/
8
″
0.8
0.6
0.4
0.2
Figure 1. Maximum Lead Temperature
I T , INSTANTANEOUS ON−STATE CURRENT (AMPS)
10
7.0
5.0
3.0
2.0
1.0
0.7
0.5
0.3
0.2
0.1
0
1.0
2.0
3.0
4.0
5.0
0
T
J
= 25°C
125°C
1.25
PRMS , POWER DISSIPATION (WATTS)
Figure 2. Maximum Ambient Temperature
1.00
T
J
= 25°C
Conduction Angle = 180°C
0.75
0.50
0.25
0.2
0.4
0.6
0.8
1.0
V
T
, INSTANTANEOUS ON−STATE VOLTAGE (VOLTS)
I
T(RMS)
, ON−STATE CURRENT (AMPS)
Figure 3. Typical On−State Voltage
Figure 4. Typical Power Dissipation
THERMAL CHARACTERISTICS
r(t), TRANSIENT THERMAL RESISTANCE (NORMALIZED)
1.0
0.7
0.5
0.3
0.2
0.1
0.07
0.05
0.03
0.02
0.01
0.1
0.2
0.5
1.0
2.0
Z
qJL
(t) = R
qJL
•
r(t)
DT
JL
= P
pk
R
qJL
[r(t)]
t
p
TIME
where:
DT
JL
= the increase in junction temperature above the
lead temperature
r(t) = normalized value of transient thermal resistance at
time, t from this figure. For example,
r(t
p
) = normalized value of transient resistance at time t
p
.
5.0
10
20
t, TIME (ms)
50
100
200
The temperature of the lead should be
measured using a thermocouple placed on the
lead as close as possible to the tie point. The
thermal mass connected to the tie point is
normally large enough so that it will not
significantly respond to heat surges generated
in the diode as a result of pulsed operation
once steady−state conditions are achieved.
Using the measured value of T
L
, the junction
temperature may be determined by:
T
J
= T
L
+
DT
JL
500
1.0 k
2.0 k
5.0 k
10 k
Figure 5. Thermal Response
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3
MKP9V160
VBO , BREAKOVER VOLTAGE (NORMALIZED)
1.4
IH , HOLDING CURRENT (NORMALIZED)
1.0
1.2
1.0
0.9
0.8
0.6
0.4
−60
0.8
−60
−40
−20
0
20
40
60
80
100
120
140
−40
−20
0
20
40
60
80
100
120
140
T
J
, JUNCTION TEMPERATURE (°C)
T
J
, JUNCTION TEMPERATURE (°C)
Figure 6. Typical Breakover Voltage
Figure 7. Typical Holding Current
100
IPK, PEAK CURRENT (AMPS)
10
I
PK
10%
tw
1.0
0.1
1.0
t
w
, PULSE WIDTH (ms)
10
100
Figure 8. Pulse Rating Curve
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4
MKP9V160
PACKAGE DIMENSIONS
AXIAL LEAD
CASE 59−10
ISSUE U
B
K
F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. ALL RULES AND NOTES ASSOCIATED WITH
JEDEC DO−41 OUTLINE SHALL APPLY
4. POLARITY DENOTED BY CATHODE BAND.
5. LEAD DIAMETER NOT CONTROLLED WITHIN F
DIMENSION.
DIM
A
B
D
F
K
INCHES
MIN
MAX
0.161 0.205
0.079 0.106
0.028 0.034
−−−
0.050
1.000
−−−
NO POLARITY
MILLIMETERS
MIN
MAX
4.10
5.20
2.00
2.70
0.71
0.86
−−−
1.27
25.40
−−−
D
A
POLARITY INDICATOR
OPTIONAL AS NEEDED
(SEE STYLES)
F
K
STYLE 2:
ON Semiconductor
and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
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