Analog Switch ICs
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | TSSOP |
| 包装说明 | 4.40 MM, 0.65 MM PITCH, TSSOP-16 |
| 针数 | 16 |
| Reach Compliance Code | not_compliant |
| 模拟集成电路 - 其他类型 | SPST |
| JESD-30 代码 | R-PDSO-G16 |
| JESD-609代码 | e0 |
| 长度 | 5 mm |
| 湿度敏感等级 | 1 |
| 负电源电压最大值（Vsup） | -5.5 V |
| 负电源电压最小值（Vsup） | -2.7 V |
| 标称负供电电压 (Vsup) | -5 V |
| 正常位置 | NO/NC |
| 信道数量 | 1 |
| 功能数量 | 4 |
| 端子数量 | 16 |
| 标称断态隔离度 | 65 dB |
| 通态电阻匹配规范 | 0.2 Ω |
| 最大通态电阻 (Ron) | 1.6 Ω |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出 | SEPARATE OUTPUT |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装等效代码 | TSSOP16,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 240 |
| 电源 | 2.7/5/+-5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.1 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 2.7 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 最长断开时间 | 150 ns |
| 最长接通时间 | 350 ns |
| 切换 | BREAK-BEFORE-MAKE |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 20 |
| 宽度 | 4.4 mm |
| MAX4679EUE | MAX4678EPE | MAX4677EPE | MAX4678EUE | MAX4679EUE-T | MAX4677EUE-T | MAX4679EPE | MAX4677EUE | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Analog Switch ICs | Analog Switch ICs 2Ohm, Quad, SPST, CMOS Analog Switches | Analog Switch ICs 2 Ohm, Quad, SPST, CMOS Analog Switches | Analog Switch ICs | Analog Switch ICs | Analog Switch ICs | Analog Switch ICs | Analog Switch ICs 2Ohm, Quad, SPST, CMOS Analog Switches |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
| 零件包装代码 | TSSOP | DIP | DIP | TSSOP | TSSOP | TSSOP | DIP | TSSOP |
| 包装说明 | 4.40 MM, 0.65 MM PITCH, TSSOP-16 | DIP, DIP16,.3 | 0.300 INCH, PLASTIC, DIP-16 | TSSOP, TSSOP16,.25 | 4.40 MM, 0.65 MM PITCH, TSSOP-16 | 4.40 MM, 0.65 MM PITCH, TSSOP-16 | 0.300 INCH, PLASTIC, DIP-16 | 4.40 MM, 0.65 MM PITCH, TSSOP-16 |
| 针数 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| 模拟集成电路 - 其他类型 | SPST | SPST | SPST | - | SPST | SPST | SPST | SPST |
| JESD-30 代码 | R-PDSO-G16 | R-PDIP-T16 | R-PDIP-T16 | - | R-PDSO-G16 | R-PDSO-G16 | R-PDIP-T16 | R-PDSO-G16 |
| JESD-609代码 | e0 | e0 | e0 | - | e0 | e0 | e0 | e0 |
| 长度 | 5 mm | 19.175 mm | 19.175 mm | - | 5 mm | 5 mm | 19.175 mm | 5 mm |
| 湿度敏感等级 | 1 | 1 | 1 | - | 1 | - | 1 | 1 |
| 负电源电压最大值（Vsup） | -5.5 V | -5.5 V | -5.5 V | - | -5.5 V | -5.5 V | -5.5 V | -5.5 V |
| 负电源电压最小值（Vsup） | -2.7 V | -2.7 V | -2.7 V | - | -2.7 V | -2.7 V | -2.7 V | -2.7 V |
| 标称负供电电压 (Vsup) | -5 V | -5 V | -5 V | - | -5 V | -5 V | -5 V | -5 V |
| 正常位置 | NO/NC | NO | NC | - | - | - | NO/NC | NC |
| 信道数量 | 1 | 1 | 1 | - | 1 | 1 | 1 | 1 |
| 功能数量 | 4 | 4 | 4 | - | 4 | 4 | 4 | 4 |
| 端子数量 | 16 | 16 | 16 | - | 16 | 16 | 16 | 16 |
| 标称断态隔离度 | 65 dB | 65 dB | 65 dB | - | 65 dB | 65 dB | 65 dB | 65 dB |
| 通态电阻匹配规范 | 0.2 Ω | 0.2 Ω | 0.2 Ω | - | 0.2 Ω | 0.2 Ω | 0.2 Ω | 0.2 Ω |
| 最大通态电阻 (Ron) | 1.6 Ω | 1.6 Ω | 1.6 Ω | - | 1.6 Ω | 1.6 Ω | 1.6 Ω | 1.6 Ω |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | - | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出 | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | - | - | - | SEPARATE OUTPUT | SEPARATE OUTPUT |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | DIP | DIP | - | TSSOP | TSSOP | DIP | TSSOP |
| 封装等效代码 | TSSOP16,.25 | DIP16,.3 | DIP16,.3 | - | - | - | DIP16,.3 | TSSOP16,.25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | IN-LINE | IN-LINE | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 240 | 240 | 240 | - | 240 | NOT SPECIFIED | 240 | 240 |
| 电源 | 2.7/5/+-5 V | 2.7/5/+-5 V | 2.7/5/+-5 V | - | - | - | 2.7/5/+-5 V | 2.7/5/+-5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.1 mm | 4.572 mm | 4.572 mm | - | 1.1 mm | 1.1 mm | 4.572 mm | 1.1 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | - | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | - | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | NO | - | YES | YES | NO | YES |
| 最长断开时间 | 150 ns | 150 ns | 150 ns | - | 150 ns | 150 ns | 150 ns | 150 ns |
| 最长接通时间 | 350 ns | 350 ns | 350 ns | - | 350 ns | 350 ns | 350 ns | 350 ns |
| 切换 | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | - | - | - | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
| 技术 | CMOS | CMOS | CMOS | - | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | - | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) |
| 端子形式 | GULL WING | THROUGH-HOLE | THROUGH-HOLE | - | GULL WING | GULL WING | THROUGH-HOLE | GULL WING |
| 端子节距 | 0.65 mm | 2.54 mm | 2.54 mm | - | 0.65 mm | 0.65 mm | 2.54 mm | 0.65 mm |
| 端子位置 | DUAL | DUAL | DUAL | - | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 20 | 20 | 20 | - | 20 | NOT SPECIFIED | 20 | 20 |
| 宽度 | 4.4 mm | 7.62 mm | 7.62 mm | - | 4.4 mm | 4.4 mm | 7.62 mm | 4.4 mm |
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