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SI5504DC-T1

产品描述MOSFET 30V 3.9/2.8A
产品类别分立半导体    晶体管   
文件大小132KB,共8页
制造商Vishay(威世)
官网地址http://www.vishay.com
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SI5504DC-T1概述

MOSFET 30V 3.9/2.8A

SI5504DC-T1规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称Vishay(威世)
Reach Compliance Codecompliant
ECCN代码EAR99
最大漏极电流 (Abs) (ID)2.1 A
FET 技术METAL-OXIDE SEMICONDUCTOR
工作模式ENHANCEMENT MODE
最高工作温度150 °C
极性/信道类型N-CHANNEL AND P-CHANNEL
最大功率耗散 (Abs)2.1 W

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Si5504DC
Vishay Siliconix
Complementary 30 V (D-S) MOSFET
PRODUCT SUMMARY
V
DS
(V)
N-Channel
P-Channel
30
- 30
R
DS(on)
(Ω)
0.085 at V
GS
= 10 V
0.143 at V
GS
= 4.5 V
0.165 at V
GS
= - 10 V
0.290 at V
GS
= - 4.5 V
I
D
(A)
± 3.9
± 3.0
± 2.8
± 2.1
FEATURES
Halogen-free According to IEC 61249-2-21
Definition
• TrenchFET
®
Power MOSFETs
• Compliant to RoHS Directive 2002/95/EC
1206-8 ChipFET
®
1
S
1
D
1
D
1
D
2
D
2
G
1
S
2
G
2
D
1
S
2
G
2
Marking Code
EA XX
Lot Traceability
and Date Code
Part # Code
G
1
Bottom View
Ordering Information:
Si5504DC-T1-E3 (Lead (Pb)-free)
Si5504DC-T1-GE3 (Lead (Pb)-free and Halogen-free)
S
1
N-Channel MOSFET
D
2
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS
T
A
= 25 °C, unless otherwise noted
N-Channel
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (T
J
= 150 °C)
a
Pulsed Drain Current
Continuous Source Current (Diode Conduction)
a
Maximum Power Dissipation
a
T
A
= 25 °C
T
A
= 85 °C
T
A
= 25 °C
T
A
= 85 °C
Symbol
V
DS
V
GS
I
D
I
DM
I
S
P
D
T
J
, T
stg
1.8
2.1
1.1
0.9
1.1
0.6
260
± 3.9
± 2.8
± 2.9
± 2.1
± 10
- 1.8
2.1
1.1
- 55 to 150
- 0.9
1.1
0.6
W
°C
5s
Steady State
30
± 20
± 2.8
± 2.0
± 2.1
± 1.5
A
5s
P-Channel
Steady State
- 30
Unit
V
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
b, c
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambient
a
Maximum Junction-to-Foot (Drain)
t
5s
Steady State
Steady State
Symbol
R
thJA
R
thJF
Typical
50
90
30
Maximum
60
110
40
°C/W
Unit
Notes:
a. Surface mounted on 1" x 1" FR4 board.
b. See reliability manual for profile. The ChipFET/PowerPAK is a leadless package. The end of the lead terminal is exposed copper (not plated)
as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to
ensure adequate bottom side solder interconnection.
c. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
Document Number: 71056
S10-0547-Rev. C, 08-Mar-10
www.vishay.com
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