LDO Voltage Regulators 150-mA Low-Noise 1.5% tolerance
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 厂商名称 | Vishay(威世) |
| 零件包装代码 | TSSOP |
| 包装说明 | TSSOP, TSSOP8,.19 |
| 针数 | 8 |
| Reach Compliance Code | unknown |
| Samacsys Description | Low-Voltage CMOS Analog Switches |
| 其他特性 | VIDEO APPLICATION |
| 模拟集成电路 - 其他类型 | SPDT |
| JESD-30 代码 | S-PDSO-G8 |
| JESD-609代码 | e3 |
| 长度 | 3 mm |
| 湿度敏感等级 | 1 |
| 负电源电压最大值（Vsup） | -6 V |
| 负电源电压最小值（Vsup） | -3 V |
| 标称负供电电压 (Vsup) | -5 V |
| 信道数量 | 1 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 标称断态隔离度 | 71 dB |
| 最大通态电阻 (Ron) | 18.5 Ω |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装等效代码 | TSSOP8,.19 |
| 封装形状 | SQUARE |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | +-3/+-6/3/12 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.1 mm |
| 最大供电电压 (Vsup) | 6 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 最长断开时间 | 33 ns |
| 最长接通时间 | 44 ns |
| 切换 | BREAK-BEFORE-MAKE |
| 技术 | BICMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 40 |
| 宽度 | 3 mm |
| DG419LDQ-T1-E3 | DG419LDY-T1-E3 | DG419LAK-883 | FP52SER-2083-DB50W | DG419LDY-E3 | DG419LDQ-T1 | DG417LDY-E3 | DG459DJ | DG418LDY-T1-E3 | DG458DJ | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | LDO Voltage Regulators 150-mA Low-Noise 1.5% tolerance | Audio Amplifiers SoundPlus Hi-Perf Aud Oper Amp | Analog Switch ICs Low Voltge CMOS SPDT Analog Switch | Fixed Resistor, Metal Film, 0.4W, 208000ohm, 200V, 0.5% +/-Tol, 50ppm/Cel, | Analog Switch ICs SPDT Analog Switch | Analog Switch ICs SPDT Analog Switch | Analog Switch ICs SPST Analog Switch | Analog Switch ICs Diff 4:1 w/Fault Prt Multiplexer/MUX | Real Time Clock Serial real-time clocks with alarm | Analog Switch ICs Sgl 8:1 w/Fault Prot Multiplexer/MUX |
| 是否无铅 | 不含铅 | 不含铅 | - | - | 不含铅 | - | 不含铅 | 含铅 | 不含铅 | 含铅 |
| 厂商名称 | Vishay(威世) | Vishay(威世) | - | - | Vishay(威世) | - | Vishay(威世) | Vishay(威世) | Vishay(威世) | Vishay(威世) |
| Reach Compliance Code | unknown | unknown | - | compliant | unknown | - | unknown | unknown | unknown | compliant |
| 模拟集成电路 - 其他类型 | SPDT | SPDT | - | - | SPDT | - | SPST | DIFFERENTIAL MULTIPLEXER | SPST | SINGLE-ENDED MULTIPLEXER |
| JESD-30 代码 | S-PDSO-G8 | R-PDSO-G8 | - | - | R-PDSO-G8 | - | R-PDSO-G8 | R-PDIP-T16 | R-PDSO-G8 | R-PDIP-T16 |
| JESD-609代码 | e3 | e3 | - | e3 | e3 | - | e3 | e0 | e3 | e0 |
| 标称负供电电压 (Vsup) | -5 V | -5 V | - | - | -5 V | - | -5 V | -15 V | -5 V | -15 V |
| 信道数量 | 1 | 1 | - | - | 1 | - | 1 | 4 | 1 | 8 |
| 功能数量 | 1 | 1 | - | - | 1 | - | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | - | 2 | 8 | - | 8 | 16 | 8 | 16 |
| 最大通态电阻 (Ron) | 18.5 Ω | 18.5 Ω | - | - | 18.5 Ω | - | 18.5 Ω | 1800 Ω | 18.5 Ω | 1800 Ω |
| 最高工作温度 | 85 °C | 85 °C | - | 160 °C | 85 °C | - | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | - | -55 °C | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | SOP | - | - | SOP | - | SOP | DIP | SOP | DIP |
| 封装等效代码 | TSSOP8,.19 | SOP8,.25 | - | - | SOP8,.25 | - | SOP8,.25 | DIP16,.3 | SOP8,.25 | DIP16,.3 |
| 封装形状 | SQUARE | RECTANGULAR | - | CYLINDRICAL PACKAGE | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | - | Axial | SMALL OUTLINE | - | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | IN-LINE |
| 峰值回流温度（摄氏度） | 260 | 260 | - | - | 260 | - | 260 | NOT SPECIFIED | 260 | NOT SPECIFIED |
| 电源 | +-3/+-6/3/12 V | +-3/+-6/3/12 V | - | - | +-3/+-6/3/12 V | - | +-3/+-6/3/12 V | +-15 V | +-3/+-6/3/12 V | +-15 V |
| 认证状态 | Not Qualified | Not Qualified | - | - | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 标称供电电压 (Vsup) | 5 V | 5 V | - | - | 5 V | - | 5 V | 15 V | 5 V | 15 V |
| 表面贴装 | YES | YES | - | - | YES | - | YES | NO | YES | NO |
| 最长接通时间 | 44 ns | 44 ns | - | - | 44 ns | - | 44 ns | 250 ns | 44 ns | 250 ns |
| 切换 | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | - | - | BREAK-BEFORE-MAKE | - | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
| 技术 | BICMOS | BICMOS | - | METAL FILM | BICMOS | - | BICMOS | CMOS | BICMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | - | - | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) | MATTE TIN | - | Matte Tin (Sn) | MATTE TIN | - | MATTE TIN | Tin/Lead (Sn/Pb) | MATTE TIN | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | GULL WING | - | - | GULL WING | - | GULL WING | THROUGH-HOLE | GULL WING | THROUGH-HOLE |
| 端子节距 | 0.65 mm | 1.27 mm | - | - | 1.27 mm | - | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | - | - | DUAL | - | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 40 | 40 | - | - | 40 | - | 40 | NOT SPECIFIED | 40 | NOT SPECIFIED |
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