UPD1002
Programmable USB Power Delivery Controller
Highlights
Integrated USB Power Delivery (PD) PHY
Support for Power Delivery Message Protocol
Integrated Voltage and Current ADC Inputs
Configuration Profile Selection
On-chip Microcontroller
SPI Interface
Commercial, Industrial, and Automotive Grade
Temperature Support
• Available in 32-SQFN Package
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Key Benefits
• Integrated USB Power Delivery (PD) PHY
- Integrated receive termination
- Requires minimal external components
• Support for Power Delivery Message Protocol
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Message Generation/Consumption
Retry Generation
Error Handling
State Behavior
• Cable Detect Logic
- Cable attachment type
Target Applications
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Notebooks
Ultrabooks
Desktop PCs
Docking Stations
Monitors
Printers
Automotive
• CFG_SEL pins allow selection of multiple profiles
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Provider
Provider/Consumer
Consumer
Consumer/Provider
• Integrated Voltage (VMON) and Current (IMON)
ADC Inputs
• Dead Battery Support
• On-chip Microcontroller
- Manages I/Os and other signals
- Implements power delivery policy engine and
device policy manager
• Configuration Programming via OTP, or Vendor
Defined Messaging
• Supports Low Power Modes
• Serial Peripheral Interface (SPI) Bus
• Internal 3.3 V and 1.8 V Voltage Regulators
• Integrated Oscillator Reduces BOM Costs
• Package
- 32-pin SQFN (5 x 5 mm)
• Environmental
- Commercial temperature range (0°C to +70°C)
- Industrial temperature range (-40°C to +85°C)
- Automotive temperature range (-40°C to +105°C)
2014 Microchip Technology Inc.
DS00001689B-page 1
UPD1002
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DS00001689B-page 2
2014 Microchip Technology Inc.
UPD1002
1.0
1.1
INTRODUCTION
General Description
The UPD1002 is a programmable USB Power Delivery (PD) controller designed to adhere to the
USB Power Delivery
Specification.
USB Power Delivery allows a host (or device) to provide or consume up to 5 Amps and/or up to 20 Volts
of power from a USB PD capable partner device on the other end of the USB cable. USB PD capable standard and
custom cables/connectors are supported, which in most cases are backward compatible with standard USB connec-
tions.
The UPD1002 provides a complete USB Power Delivery solution for notebooks/ultrabooks, desktop PCs, monitors,
docking stations, and automotive applications. The functionality of the UPD1002 is selected via two configuration selec-
tion pins,
CFG_SEL0
and
CFG_SEL1,
which can be used to select unique PD and system configurations. Designing the
UPD1002 into a system can be as simple as selecting a configuration, with no external EEPROM required. Advanced
programmability options exist with an external EEPROM installed.
The integrated USB Power Delivery MAC and PHY support provider and consumer operation via the PD communication
protocol, as specified in Revision 1.0 (Version 1.2) of the
USB Power Delivery Specification.
Monitoring of VBUS and
battery charging is accomplished via the integrated voltage and current ADC inputs. The PHY supports cable ID detec-
tion/identification and loopback modes. The PHY includes a 24MHz FSK modulator/demodulator and provides inte-
grated terminations. The USB PD MAC supports both USB PD insertion detection (cold socket) and dead battery cases.
The device provides an integrated voltage switch which is used to detect whether the VBUS or VTR (battery) power
supply is active, enabling selection of the appropriate power supply at any given time.
The on-chip microcontroller manages the IOs and implements the power delivery local policy engine and device man-
ager. The SPI ROM controller is used by the microcontroller for optional external code execution from ROM. A One Time
Programmable (OTP) ROM is integrated in the UPD1002. Integrated 3.3 V and 1.8 V regulators allow device operation
from a single power supply. The UPD1002 is available in commercial (0°C to +70°C), industrial (-40°C to +85°C), and
automotive (-40°C to +105°C) temperature ranges. An internal block diagram of the UPD1002 is shown in
Figure 1-1.
2014 Microchip Technology Inc.
DS00001689B-page 3
UPD1002
FIGURE 1-1:
INTERNAL BLOCK DIAGRAM
DS00001689B-page 4
2014 Microchip Technology Inc.
2.1
32-SQFN
2.0
FIGURE 2-1:
2014 Microchip Technology Inc.
PACKAGE OUTLINES
32-SQFN PACKAGE
Note: For the most current package drawings,
see the Microchip Packaging Specification at
http://www.microchip.com/packaging
UPD1002
DS00001689B-page 5
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