DS1336
Afterburner Chip
www.dalsemi.com
FEATURES
§
Provides power switching of up to 1.5 amps at
voltages between 3.0 and 5.0 volts
§
Five separate power switches
§
Selectable battery switches for use with
§
battery-backed systems
§
Very low on impedance of 0.7O
§
Battery backup current of 4 mA
§
Diode-isolated battery path
§
Available in 16-pin DIP or 16-pin SOIC
surface
§
mount package
§
Low voltage drop battery path
§
Connects directly to a variety of Dallas
Semiconductor devices, adding increased
switching capability for large battery backup
current applications
PIN ASSIGNMENT
OUT5
PF
IN5
IN2
IN4
VBATIN
VBAT02
OUT4
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
V
CC
/IN1
PF
GND
OUT1
OUT2
OUT3
VBAT01
IN3
16-Pin DIP (300-mil)
See Mach. Drawings
Section
OUT5
PF
IN5
IN2
IN4
VBATIN
VBAT02
OUT4
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
V
CC
/IN1
PF
GND
OUT1
OUT2
OUT3
VBAT01
IN3
16-Pin DIP SOIC (300-mil)
See Mach. Drawings
Section
PIN DESCRIPTION
V
CC
/IN1
IN2 - IN5
OUT1 - 5
V
BATIN
V
BAT01
V
BAT02
PF,
PF
GND
- +5V Input and Input 1
- Inputs 2 - 5
- Outputs 1 - 5
- External Battery Input
- Diode Protected Battery Output
- Low Voltage Drop Battery
Output
- Power-fail Inputs
- Ground
DESCRIPTION
The DS1336 Afterburner Chip is designed to provide power switching between a primary power supply
(V
CC
) and a backup battery power supply (V
BAT
). Five V
CC
and two battery paths are provided which can
be used individually or in parallel to supply uninterrupted power in applications such as SRAM networks.
When used with one of the Dallas power monitoring devices listed in Table 1, the DS1336 allows a load
to be switched from its main power supply V
CC
to a battery backup supply when V
CC
falls out of
tolerance. A user may selectively tie together any combination of the output pins to provide the desired
high current supply, providing up to 300 mA per OUT pin or a maximum of 1.5A. Depending upon the
user’ backup supply load requirements, either of the V
BAT
outputs may be tied to the OUT pins to supply
s
1 of 6
050699
DS1336
current when V
CC
is out of tolerance. The DS1336 switches back to the higher current V
CC
from battery
current when PF and
PF
become inactive.
OPERATION
The required PF or
PF
input which controls the switching between the main V
CC
and backup battery can
be supplied by any of the devices listed in Table 1. All of the devices provide the DS1336 with a PF or
PF
signal, switching between a main supply V
CC
and backup supply V
BAT
when V
CC
falls out of
tolerance. For applications requiring switching from the V
CC
supply inputs to V
BAT
, the required PF or
PF
input to the DS1336 can be provided by the DS1236, DS1239, DS5001, or DS5340. For applications
requiring switching from the V
CC
inputs to the V
BAT
input when V
CC
begins falling out of tolerance, any
of the Dallas Semiconductor devices listed in Table 1 can provide the DS1336 with the required
switching input. A typical application is shown in Figure 1. For applications where switching between
V
CC
and V
BAT
must occur at a voltage level such that V
CC
is still greater than V
BAT
, the OUT5 pin is
recommended as it provides a diode path which will provide for a gradual transition between V
CC
and
V
BAT
. OUT5 can be tied to the other OUTPUT pins to provide a gradual transition for all five current
paths. In applications where tri-state switching is desired, OUT5 should be omitted. Only the PF/
PF
pin
is required for switching. In cases where the PF input will not be used, it should be connected to GND.
When either PF or
PF
is active, either of the V
BAT0X
outputs is available, although they should not be tied
together (Figure 2, “DS1336 Block Diagram”). V
BAT01
is recommended for sensitive applications such as
providing backup current to timekeepers, because its diode isolated path provides for increased
protection. V
BAT02
is not recommended for applications where it would be tied to an OUTPUT pin
supplying a voltage greater than that of the backup battery because V
BAT02
is not a diode isolated current
path.
TYPICAL APPLICATION
Figure 1
2 of 6
DS1336
DS1336 BLOCK DIAGRAM
Figure 2
3 of 6
DS1336
DALLAS SEMICONDUCTOR DEVICES WHICH PROVIDE PF OR
PF
INPUT
TO NIL
Table 1
DEVICE
DS1211
DS1212
DS1231
DS1232
DS1233
DS1233A
DS1233D
DS1234
DS1236
DS1237
X
X
X
X
X
SWITCH >
V
BAT
X
X
X
X
X
X
SWITCH AT
V
BAT
DEVICE
DS1238
DS1239
DS1259
DS1260
DS1610
DS1632
DS1833
DS5001
DS5340
SWITCH >
V
BAT
X
X
X
X
X
X
X
X
X
X
X
SWITCH AT
V
BAT
X
X
4 of 6
DS1336
ABSOLUTE MAXIMUM RATINGS*
Voltage on Any Pin Relative to Ground
Operating Temperature
Storage Temperature
Soldering Temperature
-0.3V to +7.0V
0° to 70°
C
C
-55° to +125°
C
C
260°C for 10 seconds
∗
This is a stress rating only and functional operation of the device at these or any other conditions
above those indicated in the operation sections of this specification is not implied. Exposure to
absolute maximum rating conditions for extended periods of time may affect reliability.
DC OPERATING CONDITIONS
PARAMETER
Supply Voltage
Supply Current
Supply Current
Input Low Voltage
Input High Voltage
Current Output
V
CC
=V
CC1
, PF=0,
PF
=1
Current Output
V
CC
=0, PF=1,
PF
=0
Current, Forward Bias of
V
CC5
Diode
Off Impedance
Off Impedance
On Impedance
On Impedance
SYMBOL
V
CC1
I
CC1
I
CC2
V
IL
V
IH
I
CCO
I
BAT01-2
I
FB
R
OFF1
R
OFF2
R
ON1
R
ON2
5.0
10
MIN
3.0
(t
A
= 0°C to 70°C; V
CC
= 5V ± 10%)
TYP
5.0
0.25
50
MAX
5.5
1.0
100
0.8
V
CC
300
4.0
20
UNITS
V
mA
nA
V
V
mA
mA
mA
MΩ
MΩ
Ω
Ω
5
6
7
8
NOTES
1
3
1
1
2
4
2.0
0.7
50
AC CHARACTERISTICS
PARAMETER
Propagation Delay
Switch Delay Power-fail
Switch Delay Power-on
Capacitance PF,
PF
SYMBOL
t
PD
t
PF
t
PON
C
I
MIN
(t
A
= 0°C to 70°C; V
CC
= 5V ± 10%)
TYP
10
100
MAX
UNITS
ns
ns
ns
pF
NOTES
9
100
7
NOTES:
1. All voltages referenced to ground.
2. I
CCO
with a voltage drop of 0.2 volts from any V
CCO
output.
3. V
CC
=0, V
BATIN
=3.0 volts.
4. V
BAT01
with a voltage drop of 1.0 volts.
5. R
OFF1
applies to V
CCO1, 2, 3, 4
.
6. R
OFF2
applies to V
BATO1, 2
.
5 of 6
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
