D/A Converter, 1 Func, CDSO20
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Maxim(美信半导体) |
零件包装代码 | SOIC |
针数 | 20 |
Reach Compliance Code | _compli |
转换器类型 | D/A CONVERTER |
输入位码 | BINARY, COMPLEMENTARY BINARY, OFFSET BINARY, 2\'S COMPLEMENT BINARY, 1\'S COMPLEMENT BINARY, MODIFIED 1\'S COMPLEMENT BINARY |
JESD-30 代码 | R-XDSO-G20 |
JESD-609代码 | e0 |
标称负供电电压 | -15 V |
位数 | 12 |
功能数量 | 1 |
端子数量 | 20 |
最高工作温度 | 70 °C |
最低工作温度 | |
封装主体材料 | CERAMIC |
封装代码 | SOP |
封装等效代码 | SOP20,.4 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
电源 | +-15 V |
认证状态 | Not Qualified |
标称供电电压 | 15 V |
表面贴装 | YES |
技术 | BIPOLAR |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
AM6012ACWP | AM6012ADC | AM6012APC | AM6012PC | AM6012ADM | AM6012DC | AM6012DM | AM6012C/D | AM6012CWP | |
---|---|---|---|---|---|---|---|---|---|
描述 | D/A Converter, 1 Func, CDSO20 | D/A Converter, 1 Func, CDIP20 | D/A Converter, 1 Func, PDIP20 | D/A Converter, 1 Func, PDIP20, | D/A Converter, 1 Func, CDIP20 | D/A Converter, 1 Func, CDIP20, | D/A Converter, 1 Func, CDIP20 | D/A Converter, 1 Func | D/A Converter, 1 Func, PDSO20 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
零件包装代码 | SOIC | DIP | DIP | DIP | DIP | DIP | DIP | DIE | SOIC |
针数 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 12 | 20 |
Reach Compliance Code | _compli | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
转换器类型 | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
输入位码 | BINARY, COMPLEMENTARY BINARY, OFFSET BINARY, 2\'S COMPLEMENT BINARY, 1\'S COMPLEMENT BINARY, MODIFIED 1\'S COMPLEMENT BINARY | BINARY, COMPLEMENTARY BINARY, OFFSET BINARY, 2\'S COMPLEMENT BINARY, 1\'S COMPLEMENT BINARY, MODIFIED 1\'S COMPLEMENT BINARY | BINARY, COMPLEMENTARY BINARY, OFFSET BINARY, 2\'S COMPLEMENT BINARY, 1\'S COMPLEMENT BINARY, MODIFIED 1\'S COMPLEMENT BINARY | BINARY, COMPLEMENTARY BINARY, OFFSET BINARY, 2\'S COMPLEMENT BINARY, 1\'S COMPLEMENT BINARY, MODIFIED 1\'S COMPLEMENT BINARY | BINARY, COMPLEMENTARY BINARY, OFFSET BINARY, 2\'S COMPLEMENT BINARY, 1\'S COMPLEMENT BINARY, MODIFIED 1\'S COMPLEMENT BINARY | BINARY, COMPLEMENTARY BINARY, OFFSET BINARY, 2\'S COMPLEMENT BINARY, 1\'S COMPLEMENT BINARY, MODIFIED 1\'S COMPLEMENT BINARY | BINARY, COMPLEMENTARY BINARY, OFFSET BINARY, 2\'S COMPLEMENT BINARY, 1\'S COMPLEMENT BINARY, MODIFIED 1\'S COMPLEMENT BINARY | BINARY, COMPLEMENTARY BINARY, OFFSET BINARY, 2\'S COMPLEMENT BINARY, 1\'S COMPLEMENT BINARY, MODIFIED 1\'S COMPLEMENT BINARY | BINARY, COMPLEMENTARY BINARY, OFFSET BINARY, 2\'S COMPLEMENT BINARY, 1\'S COMPLEMENT BINARY, MODIFIED 1\'S COMPLEMENT BINARY |
标称负供电电压 | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V |
位数 | 12 | 12 | 12 | 12 | 12 | 12 | 12 | 12 | 12 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 125 °C | 70 °C | 125 °C | 70 °C | 70 °C |
封装等效代码 | SOP20,.4 | DIP20,.3 | DIP20,.3 | DIP20,.3 | DIP20,.3 | DIP20,.3 | DIP20,.3 | DIE OR CHIP | SOP20,.4 |
电源 | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V |
标称供电电压 | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL |
JESD-30 代码 | R-XDSO-G20 | R-XDIP-T20 | R-PDIP-T20 | R-PDIP-T20 | R-XDIP-T20 | R-XDIP-T20 | R-XDIP-T20 | - | R-PDSO-G20 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | - | e0 |
端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | - | 20 |
封装主体材料 | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | - | PLASTIC/EPOXY |
封装代码 | SOP | DIP | DIP | DIP | DIP | DIP | DIP | - | SOP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
封装形式 | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | - | SMALL OUTLINE |
表面贴装 | YES | NO | NO | NO | NO | NO | NO | - | YES |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | - | GULL WING |
端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | - | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | - | DUAL |
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