conditions, it can deliver output power greater than
90 W, with 30 dB typical associated gain and 60%
typical power added efficiency.
Flexible design allows for gate and/or drain pulsing.
Additional features include a gate voltage sense port
for use in temperature compensation or pulse droop
compensation. The overall package size is very
small, only 14x24 mm
2
. The module’s compact size,
combined with excellent RF performance makes this
product an ideal solution for pulsed RADAR
applications where small size, light weight and
performance (SWaP) are the key.
Pin Configuration
Pin No.
1
2
Function
RF IN
VG
3
VD1
NC
4
VG sense
5
Ground
VD2
RF OUT
NC
4
Ordering Information
1
Part Number
MAMG-000912-090PSM
MAMG-0T0912-090PSM
MAMG-A00912-090PSM
Package
Bulk Packaging
100 Piece Reel
Evaluation Board
2
3
4
5
6
7
8
9
1. Reference Application Note M513 for reel size information.
2. Includes one module surface mounted onto board.
* Restrictions on Hazardous Substances, European Union
Directive 2002/95/EC.
1
3. One common gate voltage for both stages in the module.
4. Do not connect.
5. Do not connect to ground if not used.
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macomtech.com for additional data sheets and product information.
For further information and support please visit:
https://www.macomtech.com/content/customersupport
MAMG-000912-090PSM
960-1215 MHz 90 W 2-Stage GaN Module
Surface Mount Laminate Package
Electrical Specifications
6
Parameter
Symbol
Min.
Typ.
Max.
Typ.
Typ.
Units
RF FUNCTIONAL TESTS: Freq. = 960-1215 MHz, V
DD
= 50 V, I
DQ
= 300 mA, T
A
= 25°C, Z
L
= 50 Ω, Pulse Width = 300 us,
Duty Cycle = 10%, P
IN
= 19 dBm
Frequency
Peak Output Power
7
Power Gain
Power Added Efficiency
Pulse Droop
8
2
nd
Harmonic
3
rd
Harmonic
Load Mismatch Stability
Load Mismatch Tolerance
f
P
OUT
G
P
PAE
Droop
2F0
3F0
VSWR-S
VSWR-T
90
-
55
-
-
-
-
-
960
95
30
58
0.2
-30
-40
5:1
6:1
-
-
-
0.3
-
-
-
-
1090
105
31
63
0.2
-30
-40
5:1
6:1
1215
105
31
63
0.2
-30
-40
5:1
6:1
MHz
W
dB
%
dB
dBc
dBc
-
-
Rev. V2
6. Typical RF performance measured in RF evaluation board (see layout on page 3).
7. Peak output power measured at center of pulse.
8. Pulse droop measured between 10% and 90% of pulse.
Absolute Maximum Ratings
9,10,11,12,13
Parameter
Input Power
Drain Supply Voltage (pulsed), V
DD
Gate Supply Voltage Range, V
GG
Supply Current, I
DD
Power Dissipation, Pulsed Mode @ 85ºC
Junction Temperature
14
Operating Temperature
Storage Temperature
ESD Maximum - Human Body Model (HBM)
ESD Maximum - Charged Device Model (CDM)
9.
10.
11.
12.
13.
Absolute Maximum
24 dBm
+55 V
-9 V to -2.5 V
4.0 A
80 W
200 °C
-40°C to +85°C
-65°C to +150°C
600 V
300 V
Exceeding any one or combination of these limits may cause permanent damage to this device.
MACOM does not recommend sustained operation near these survivability limits.
For saturated performance it is recommended that the sum of (3 * V
DD
+ abs (V
GG
)) < 175 V.
CW operation is not recommended.
Operating at nominal conditions with T
J
≤ 200°C will ensure MTTF > 1 x 10
6
hours. Junction temperature directly affects device MTTF
and should be kept as low as possible to maximize lifetime.
14. Junction Temperature (T
J
) = T
C
+
Ө
JC
* ((V * I) - (P
OUT
- P
IN
)).
Typical Transient Thermal Resistance
Ө
JC
= 1.6 °C/W (50V, 600 μs pulses, 10% duty cycle)
2
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macomtech.com for additional data sheets and product information.
For further information and support please visit:
https://www.macomtech.com/content/customersupport
MAMG-000912-090PSM
960-1215 MHz 90 W 2-Stage GaN Module
Surface Mount Laminate Package
Evaluation Board Outline
Parts List
Part
C1
C2
Value
100
F
10 nF
Case Style
Radial
0603
Rev. V2
Parts are measured and sampled in the evaluation
board shown on the left. The board is made of
8-mil thick RO4003C and is bolted onto a Ni-plated
Aluminum plate. Electrical and thermal ground is
provided using a Cu-filled via-hole array (pictured
below). Very few external components are used, as
DC blocks are not required.
Bias Sequencing
Turning the device ON
1. Set V
G
to the pinch-off value (V
P
), typically -6 V.
2. Turn on V
D
to nominal voltage (50 V).
3. Increase V
G
to desired quiescent current.
4. Apply RF power to desired level.
Turning the device OFF
1. Turn off RF power.
2. Decrease V
G
down to V
P.
3. Turn off V
D
.
4. Turn off V
G
.
3
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macomtech.com for additional data sheets and product information.
For further information and support please visit:
https://www.macomtech.com/content/customersupport
MAMG-000912-090PSM
960-1215 MHz 90 W 2-Stage GaN Module
Surface Mount Laminate Package
Applications Section
Typical Large-Signal Performance Curves Over Temperature:
Pulsed RF, 300 μs Pulses, 10% Duty Cycle, V
DD
= 45 V, I
DQ
= 300 mA, P
IN
= 19 dBm
Output Power vs. Frequency
125
120
115
-40
0
+25
+50
+85
Rev. V2
Power Added Efficiency vs. Frequency
70
68
66
64
Peak Output Power (W)
110
105
100
95
90
85
80
75
Power Added Eff (%)
62
60
58
56
54
52
50
-40
0
+25
+50
+85
Freq (MHz)
Freq (MHz
)
Pulse Droop vs. Frequency
0.50
-40
0.40
0
+25
+50
+85
Pulse Droop (dB)
0.30
0.20
0.10
0.00
Freq (MHz)
4
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macomtech.com for additional data sheets and product information.
For further information and support please visit:
https://www.macomtech.com/content/customersupport
MAMG-000912-090PSM
960-1215 MHz 90 W 2-Stage GaN Module
Surface Mount Laminate Package
Applications Section
Maximum Transient Channel Temperature (Based on IR-Scan Measurements)
Pulsed RF, I
DQ
= 300 mA, P
IN
= 19 dBm, T
C
= 80°C
Max. Transient Channel Temp. vs. Pulse Width
(V
DD
= 35 V)
Max. Transient Channel Temp. vs. Pulse Width
(V
DD
= 45 V)
Rev. V2
130
125
120
115
110
105
100
95
90
85
80
5% duty
10% duty
20% duty
170
165
160
155
150
145
140
135
130
125
120
115
110
105
100
Channel Temperature (°C)
Channel Temperature (°C)
5% duty
10% duty
20% duty
Pulse Duration (s)
Pulse Duration (s)
Max. Transient Channel Temp. vs. Pulse Width
(V
DD
= 50 V)
200
195
190
185
180
175
170
165
160
155
150
145
140
135
130
125
120
115
Channel Temperature (°C)
5% duty
10% duty
Pulse Duration (s)
5
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macomtech.com for additional data sheets and product information.
我最近在《华尔街日报》看到一篇题为“我们需要能维修自己的电子小玩意儿的权利(We need the right to repair our gadgets)”的文章(参考原文：)，作者对于众多电子产品看来是“有计画的废弃(planned obsolescence)”之现象非常愤怒，认为大众应该要求电子产品可以被维修。 但实际的情况是，举例来说，家家都有的电视机如果故障了，修理费用可能...[详细]
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