Power Management IC Development Tools Eval Kit MAX732 (+12V/+15V Step-Up Current-Mode PWM Regulators)
| 参数名称 | 属性值 |
| 产品种类 Product Category | Power Management IC Development Tools |
| 制造商 Manufacturer | Maxim(美信半导体) |
| Output Voltage | 12 V |
| Output Current | 200 mA |
| MAX732EVKIT-SO | MAX732MJA- | MAX732EPA | MAX732EWE-T | MAX732MJA | |
|---|---|---|---|---|---|
| 描述 | Power Management IC Development Tools Eval Kit MAX732 (+12V/+15V Step-Up Current-Mode PWM Regulators) | Switching Voltage Regulators | Switching Voltage Regulators +12V/+15V Step-Up Current-Mode PWM Regulators | Switching Voltage Regulators 12/15V Step-Up | Switching Voltage Regulators +12V/+15V Step-Up Current-Mode PWM Regulators |
| 是否无铅 | - | - | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | - | - | 不符合 | 不符合 | 不符合 |
| 厂商名称 | - | - | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
| 零件包装代码 | - | - | DIP | SOIC | DIP |
| 包装说明 | - | - | DIP, DIP8,.3 | SO-16 | DIP, DIP8,.3 |
| 针数 | - | - | 8 | 16 | 8 |
| Reach Compliance Code | - | - | not_compliant | not_compliant | not_compliant |
| ECCN代码 | - | - | EAR99 | EAR99 | EAR99 |
| 模拟集成电路 - 其他类型 | - | - | SWITCHING REGULATOR | SWITCHING REGULATOR | SWITCHING REGULATOR |
| 控制模式 | - | - | CURRENT-MODE | CURRENT-MODE | CURRENT-MODE |
| 控制技术 | - | - | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION |
| 最大输入电压 | - | - | 9.3 V | 9.3 V | 9.3 V |
| 最小输入电压 | - | - | 4 V | 4 V | 4 V |
| JESD-30 代码 | - | - | R-PDIP-T8 | R-PDSO-G16 | R-GDIP-T8 |
| JESD-609代码 | - | - | e0 | e0 | e0 |
| 湿度敏感等级 | - | - | 1 | 1 | 1 |
| 功能数量 | - | - | 1 | 1 | 1 |
| 端子数量 | - | - | 8 | 16 | 8 |
| 最高工作温度 | - | - | 85 °C | 85 °C | 125 °C |
| 最低工作温度 | - | - | -40 °C | -40 °C | -55 °C |
| 最大输出电流 | - | - | 1.5 A | 1.5 A | 1.5 A |
| 标称输出电压 | - | - | 12 V | 12 V | 12 V |
| 封装主体材料 | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED |
| 封装代码 | - | - | DIP | SOP | DIP |
| 封装等效代码 | - | - | DIP8,.3 | SOP16,.4 | DIP8,.3 |
| 封装形状 | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | - | IN-LINE | SMALL OUTLINE | IN-LINE |
| 峰值回流温度（摄氏度） | - | - | 245 | 245 | 245 |
| 认证状态 | - | - | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | - | - | 4.572 mm | 2.65 mm | 5.08 mm |
| 最大供电电流 (Isup) | - | - | 3 mA | 3 mA | 3 mA |
| 表面贴装 | - | - | NO | YES | NO |
| 切换器配置 | - | - | BOOST | BOOST | BOOST |
| 最大切换频率 | - | - | 170 kHz | 170 kHz | 170 kHz |
| 技术 | - | - | CMOS | CMOS | CMOS |
| 温度等级 | - | - | INDUSTRIAL | INDUSTRIAL | MILITARY |
| 端子面层 | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | - | - | THROUGH-HOLE | GULL WING | THROUGH-HOLE |
| 端子节距 | - | - | 2.54 mm | 1.27 mm | 2.54 mm |
| 端子位置 | - | - | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | - | - | 7.62 mm | 7.5 mm | 7.62 mm |
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