HIGHEST PERFORMANCE
conga-BP77
-
Highest Performance COM Express Type 2
-
3rd Generation Intel
®
Core
™
processor-based
platform
-
Better transcode HD-HD, HD Video Conferencing
-
Improved Graphics Performance, DirectX
®
11
Formfactor
CPU
Formfactor COM Express
™
Basic | (95 x 125 mm) | Type II Connector Layout
Intel
®
Core
™
i7-3612QE
Intel
®
Core
™
i7-3555LE
Intel
®
Core
™
i7-3517UE
Intel
®
Core
™
i5-3610ME
Intel
®
Core
™
i3-3120ME
4x 2.1 GHz 6MB cache
2x 2.5 GHz 4MB cache
2x 1.7 GHz 4MB L2 cache
2x 2.7 GHz 3MB cache
2x 2.4 GHz 3MB L2 Cache
TDP 35W
TDP 25W
TDP 17W
TDP 35W
TDP 35W
Integrated dual channel memory controller | up to 25,6 GByte/sec. memory bandwidth
Integrated Intel
®
HD Graphics with dynamic frequency up to 1100 MHz | Intel
®
Clear Video HD Technology
DRAM
Chipset
Ethernet
I/O Interfaces
Sound
Graphics
LVDS
(eDP optional)
PEG
CRT Interface
SDVO
congatec Board Controller
Embedded BIOS Features
Security
2 Sockets | SO-DIMM DDR3 1600 MT/s | up to 16 GByte
Mobile Intel
®
7 Series Chipset: Intel
®
QM77
Intel
®
82579 GbE LAN Controller with AMT 8.0 support (optional)
6x PCI Express
™
GEN 2.0 lanes | 4x Serial ATA
®
(AHCI) with RAID support | 1x EIDE (UDMA-66/100) optional | 8x USB 2.0 (EHCI)
PCI Bus 33 MHz Rev. 2.3 | LPC bus | I²C bus (fast mode | 400 kHz | multi-master)
Digital High Definition Audio Interface with support for multiple audio codecs
Intel
®
Flexible Display Interface (FDI) | OpenGL 3.1 and DirectX11 support | Three simultaneous independet displays. High performance hardware
MPEG-2 decoding | WMV9 (VC-1) and H.264 (AVC) support Blu-ray support @ 40 MBit/s | hardware motion compensation
Dual channel LVDS transmitter | Supports flat panels 2x24 Bit interface | VESA mappings | resolutions up to 1920x1200 | Automatic Panel
Detection via EDID/EPI
PCI Express Graphic Generation 3.0 (8GT/s)
350 MHz RAMDAC | resolutions up to QXGA (2048x1536)
1 x Intel compliant SDVO ports with 200MPixel/sec. Supports external DVI
Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | BIOS Setup Data Backup
I²C bus (fast mode | 400 kHz | multi-master) | Power Loss Control
AMI Aptio
®
UEFI 2.x firmware | 8 MByte serial SPI firmware flash
The conga-BS77 can be optionally equipped with a discrete ”Trusted Platform Module” (TPM). It is capable of calculating efficient hash and
RSA algorithms with key lengths up to 2,048 bits and includes a real random number generator. Security sensitive applications such as gaming and
e-commerce will benefit also with improved authentication | integrity and confidence levels.
ACPI 3.0 with battery support
Microsoft
®
Windows 8 | Microsoft
®
Windows7 | Microsoft
®
Windows
®
embedded Standard | Microsoft
®
Windows XP | Linux
Typ. application: Processor TDP: 17 .. 25 W | see manual for full details
Operating: 0 .. +60°C | Storage: -20 .. +80°C
Operating: 10 - 90% r. H. non cond. | Storage: 5 - 95% r. H. non cond.
95 x 125 mm (3.74” x 4.92”)
Power Management
Operating Systems
Power Consumption
Temperature
Humidity
Size
www.congatec.com
conga-BP77
| Block diagram
A-B
Power Management and Control Signals
High Definition Audio (HDA) I/F
Gbit Ethernet
GPIs/GPOs
4x SATA
SM Bus
I2C
LCD I/F
(LVDS)
8x USB 2.0
CRT
6 PCIe Lanes
Intel®
(optional)
TPM
Gigabit Ethernet
PHY 82579LM
LPC Bus
BIOS
(Flash)
Processor
RTC
1x x1 PCIe Link
Watchdog
Board Controller
STMicroelectronics
STM32
CORE
DMI x4
(Direct Media
Interface)
Intel® FDI
(Flexible Display
Interface)
CORE
CORE
SPI
8 PCIe Lanes
1x x1 PCIe Link
Mobile Intel® QM77
Express Chipset
Intel® BD82QM77 PCH
CORE
3rd Generation
Intel® Core™ i7
Intel® Core™ i5
Intel® Core™ i3
Memory
Controller
BC SPI
SDVO/HDMI/DP (only on conga-BS77 variants)
Graphics
CORE
1x SATA
PEG x16 (only on conga-BP77 variants)
Hardware Monitoring
1x IDE
Fan
Control
PCI Bus
1x SDVO
SATA to IDE
Chip
3x DisplayPort (DP)
PI7C9X113SL
3x HDMI/DVI OR
and Fan Control Circuitry
PCIe to PCI Bridge
Intel® certified Pericom
Digital Display
Interface
Memory Types
(1066 or 1333 or 1600MTs)
DDR3-SODIMM
Socket (top)
16 GByte Max. Total
DDR3-SODIMM
Socket (bottom)
C-D
conga-BP77
| Order Information
Article
conga-BP77/i7-3612QE
conga-BP77/i5-3610ME
conga-BP77/i7-3555LE
conga-BP77/i3-3120ME
conga-BP77/i7-3517UE
conga-BS67/HSP-HP-B
conga-BS67/HSP-HP-T
conga-BS67/CSP-HP-B
conga-BS67/CSP-HP-T
conga-BS67/CSA-HP-B
PN
046700
046701
046702
046703
046704
046170
046171
046172
046173
046174
Description
Intel
®
Core
™
i7-3612QE quad core processor with 2.1GHz | 6MB L3 cache and 1600MT/s dual channel DDR3 memory interface.
Features PCI Express Graphics port
Intel
®
Core
™
i5-3610ME dual core processor with 2.7GHz | 3MB L3 cache and 1600MT/s dual channel DDR3 memory interface.
Features PCI Express Graphics port
Intel
®
Core
™
i7-3555LE dual core processor with 2.5GHz | 4MB L3 cache and 1600MT/s dual channel DDR3 memory interface.
Features PCI Express Graphics port
Intel
®
Core
™
i3-3120ME dual core processor with 2.4GHz | 3MB L3 cache and 1600MT/s dual channel DDR3 memory interface.
Features PCI Express Graphics port
Intel
®
Core
™
i7-3517UE dual core processor with 1.7GHz | 4MB L3 cache and 1600MT/s dual channel DDR3 memory interface.
Features PCI Express Graphics port
Standard heatspreader for high performance COM Express modules conga-BS67 | BS77 and BP77 with integrated heat pipes.
All standoffs are with 2.7mm bore hole
Standard heatspreader for high performance COM Express modules conga-BS67 | BS77 and BP77 with integrated heat pipes.
All standoffs are M2.5mm thread
Standard passive cooling solution for high performance COM Express modules conga-BS67 | BS77 and BP77 with integrated
heat pipes | 15mm silver fins and 20mm overall heat sink height. All standoffs are with 2.7mm bore hole
Standard passive cooling solution for high performance COM Express modules conga-BS67 | BS77 and BP77 with integrated
heat pipes | 15mm silver fins and 20mm overall heat sink height. All standoffs are M2.5mm thread
Standard active cooling solution for high performance COM Express modules conga-BS67 | BS77 and BP77 with integrated heat
pipes
| 15mm silver fins | 20mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole
Standard active cooling solution for high performance COM Express module conga-BS67 | BS77 and BP77 with integrated heat
pipes 15mm silver fins | 20mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread
DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 2GB RAM
DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 4GB RAM
DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 8GB RAM
conga-BS67/CSA-HP-T
DDR3L-SODIMM-1600 (2GB)
DDR3L-SODIMM-1600 (4GB)
DDR3L-SODIMM-1600 (8GB)
Accessories
conga-CEVAL
conga-Cdebug
conga-LDVI/EPI
conga-HDMI/Display Port adapter
conga-FPA2
046175
068755
068756
068757
065749
047854
011115
500014
047250
Evaluation Carrier Board for COM Express Type 2 modules
COM-Express debugging platform. Including cable for COM | PS/2 and VGA.
LVDS to DVI converter board for digital flat panels with onboard EEPROM
The conga-HDMI/DisplayPort adapter is used fo convert the chipset graphic ports Port-B | Port-C and Port-D to the HDMI or
DisplayPort Interface
Flatpanel prototype adapter to develop your own flatpanel adapter Including cables set.
© 2016 congatec AG. All rights reserved.
All data is for information purposes only. Although all the information contained within this document is carefully checked, no guarantee
of correctness is implied or expressed. Product names, logos, brands, and other trademarks featured or referred are the property of their
respective trademark holders. These trademark holders are not affiliated with congatec AG. Rev. December 12, 2016 MR
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