Low Energy are the standards established by Bluetooth Special Interest Group (SIG).
Please be sure to request delivery specifications that provide further details on the features and specifications of the products for proper and safe use.
Please note that the contents may change without any prior notice due to reasons such as upgrading.
For product inquiries: SESUB_Support@tdk.co.jp
Th
e
pr
od
uc
st ts
op w
pe il
d lb
pr e
od or
uc ha
tio ve
n
be
en
Texas Instruments
CC2541F256
Filter
to RF ANT
Crystal
32MHz
20171026 / sesub-pan-t2541_en.fm
The products in this catalog will be or have been stopped production
(3/4)
Micro Modules (Substrates with Built-in ICs, Products Utilizing with SESUB)
SESUB-PAN-T2541
SHAPE & DIMENSIONS
4.6 (nom.)
ø0.28 (nom.)
0.5 (nom.)
ELECTRICAL CHARACTERISTICS
Communication standards
Wireless output power (dBm)typ.
Communication range (m)
Interface
CHARACTERISTICS SPECIFICATION TABLE
Line-of-sight distances. Depending on antenna properties.
Please be sure to request delivery specifications that provide further details on the features and specifications of the products for proper and safe use.
Please note that the contents may change without any prior notice due to reasons such as upgrading.
For product inquiries: SESUB_Support@tdk.co.jp
Th
e
pr
od
uc
st ts
op w
pe il
d lb
pr e
od or
uc ha
tio ve
n
be
en
(0.06) (nom.)
5.6 (nom.)
1.0 (nom.)
0.5 (nom.)
Dimensions in mm
2.4GHz Bluetooth
®
V4.0 low energy
0
10
UART/SPI/I2C/GPIO/ADC
20171026 / sesub-pan-t2541_en.fm
The products in this catalog will be or have been stopped production
(4/4)
Micro Modules (Substrates with Built-in ICs, Products Utilizing with SESUB)
SESUB-PAN-T2541
MODULE TERMINAL
1
GND
36
P2_2
35
GND
34
P2_4/32k
33
P2_3/32k
32
P1_7
31
P1_6
30
P1_1
29
P1_2
28
P1_3
27
GND
26
SCL
2
P2_1
3
P2_0
4
5
6
7
8
9
VDO VDA_1 VDA_2 GND
RST_N
GND
10
P0_0
11
P0_1
12
P0_2
13
P0_3
14
P0_4
15
P0_5
16
P0_6
17
P0_7
18
P1_0
19
GND
RF
POWER
Clock
I/O
Cont
GND
GND
GND
GND
GND
GND
GND
GND
25
SDA
EVALUATION BOARD
Based on the IC manufacturer-provided evaluation environment (TDK part number: SP13801）
The product is used by connecting to the IC evaluation kits of IC manufacturers.
All software development environments and programming tools are provided by IC manufacturers.
Various development materials of IC manufacturers are available as they are, which enables smooth development of products.
We also offer evaluation kits which enables to evaluate product functions easily. (TDK part number: SP13808)
For more details, please contact us.
Equipped with
a
program
writing terminal
A chip
antenna
on
the evaluation
board
Equipped with
a
land pattern for
a
crystal
unit
for generating
a sleep
clock
Please be sure to request delivery specifications that provide further details on the features and specifications of the products for proper and safe use.
Please note that the contents may change without any prior notice due to reasons such as upgrading.
据外媒报道，萨里大学（University of Surrey）的研究人员开发出一种无需依赖GPS即可在人口密集的城市地区精确定位设备位置的人工智能系统。该系统可将定位误差从734米缩小到22米以内，这对于自动驾驶汽车和救援车辆等技术的发展意义重大。 图片来源： 萨里大学 在发表于《IEEE Robotics and Automation Letters》的论文中，研究人员介绍了PEn...[详细]
DSP 与 ARM 处理器
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
