Connection to telephone line Tip connected through an external fuse.
Connection to telephone line Ring conductor.
Driving this pin high asserts the off-hook condition. The hook switch
LED is current limited by an internal 300 resistor
Active LOW indicates an incoming ring signal. This is pulsed LOW by
the AC ring signal, and is not a steady state LOW during ringing.
Provides the analog output signal from the 2-4 wire converter of the
CYG2218. RCV uses a 2.5 volt reference signal, and therefore must be
capacitively coupled to host equipment that uses a ground reference.
No
Connection
Provides power to the CYG2218. Typically +5V, V
CC
should not exceed
20V.
Provides the analog input signal from the 2-4 wire converter of the
CYG2218. XMIT+ uses a 2.5 volt reference signal, and therefore must
be capacitively coupled to host equipment that uses a ground reference.
Connection to host system ground.
www.ixysic.com
R02
5
14
15
RCV
NC
V
CC
Top
View
16
17
18
XMIT+
GND
3
I
NTEGRATED
C
IRCUITS
D
IVISION
2 Manufacturing Information
2.1 Handling and Assembly Recommendations
CYG2218
The CYG2218 is not hermetically sealed, and should not be exposed to any liquid-based rinsing processes. IXYS
Integrated Circuits Division recommends two (2) approaches: (1) the modem should be installed in a wave-soldering
process that uses a no-clean soldering flux that will mostly evaporate during the normal wave-soldering processes,
(2) the modem should be soldered in by hand after the rest of the card is wave-soldered.
2.2 Reflow Profile
This product has a maximum solder temperature as shown below.
Device
CYG2218
Maximum Temperature
260°C
2.3 Mechanical Dimensions
2.3.1 CYG2218
1.91
(0.075)
27.18
(1.070)
10.16
(0.400)
21.59
(0.850)
TIP
RING
GND
XMIT+
+V
CC
3.43
(0.135)
2.54
(0.100)
27.18
(1.070)
OH
RI
NC
RCV
0.634 SQ.
(0.025)
TYP.
1.09 DIA.
(0.043)
TYP.
3.18
(0.125)
TOP VIEW
SIDE VIEW
PCB Pattern
(Top View)
Dimensions
mm
(inches)
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice.
Neither
circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
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