Changes to the Output Capacitor Selection Section ................. 17
Changes to Table 6, Table 7, and Table 8 ..................................... 18
Changes to Ordering Guide .......................................................... 20
4/2009—Revision 0: Initial Version
Rev. C | Page 2 of 20
Data Sheet
SPECIFICATIONS
ADP2121
V
IN
= EN = 3.6 V; V
OUT
= 1.8 V, 1.82 V, 1.85 V, 1.875 V, and 2.3 V; typical values are at T
A
= 25°C; and minimum/maximum limits
guaranteed for T
J
= −40°C to +125°C,
1
unless otherwise noted.
Table 2.
Parameters
SUPPLY
Input Voltage Range
Quiescent Current
Shutdown Current
UNDERVOLTAGE LOCKOUT
Undervoltage Lockout Threshold
Conditions
V
OUT
= 1.8 V, 1.82 V, 1.85 V, 1.875 V
V
OUT
= 2.3 V
Auto mode, no load, not switching, T
A
= −40°C to 85°C
PWM mode, no load
V
OUT
= 1.8 V, 1.82 V, 1.85 V, 1.875 V, V
EN
= 0 V, T
A
= −40°C to 85°C
V
OUT
= 2.3 V, V
EN
= 0 V, T
A
= −40°C to 85°C
V
OUT
= 1.8 V, 1.82 V, 1.85 V, 1.875 V, V
IN
rising
V
OUT
= 1.8 V, 1.82 V, 1.85 V, 1.875 V, V
IN
falling
V
OUT
= 2.3 V, V
IN
rising
V
OUT
= 2.3 V, V
IN
falling
OUTPUT
Maximum Continuous Output Current
2
V
OUT
= 1.8 V, 1.82 V, 1.85 V, 1.875 V, V
IN
= 2.3 V
V
OUT
= 1.8 V, 1.82 V, 1.85 V, 1.875 V, V
IN
= 2.5 V
V
OUT
= 1.8 V, 1.82 V, 1.85 V, 1.875 V, V
IN
= 2.7 V to 5.5 V
V
OUT
= 2.3 V, V
IN
= 2.9 V to 5.5 V
Auto mode, V
IN
= 3.6 V, T
A
= 25°C, no load, with respect to V
OUT
PWM mode, V
IN
= 2.5 V to 4.5 V, no load, with respect to V
OUT
PWM mode, I
LOAD
= 1 mA to 600 mA
V
OUT
= 1.8 V, V
FB
= 1.8 V and V
OUT
= 1.82 V, V
FB
= 1.82 V
V
OUT
= 1.85, V
FB
= 1.85 V and V
OUT
= 1.875 V, V
FB
= 1.875 V
V
OUT
= 2.3 V, V
FB
= 2.3 V
P-channel switch
N-channel synchronous rectifier
V
IN
= 5.5 V, V
SW
= 0 V and 5.5 V
P-channel switch, open loop, T
A
= −40°C to 125°C
P-channel switch, open loop, T
A
= −40°C to 85°C
V
IN
= 2.3 V to 5.5 V
1.3
V
IN
= V
EN
= V
MODE
= 5.5 V
Time from EN ≥ 1.2 V to stable V
OUT
V
OUT
= 1.82 V, R
LOAD
= 5.1 Ω
V
OUT
= 1.8 V, 1.85 V, 1.875 V, R
LOAD
= 5.1 Ω
V
OUT
= 2.3 V, R
LOAD
= 5.1 Ω
0.01
275
75
100
1.24
150
15
0.4
1
310
85
115
V
V
µA
µs
µs
µs
V
°C
°C
1.9
300
500
600
600
−3
−3
−0.2
3.8
4.1
6.4
220
260
790
828
5.36
1000
1000
6
1.6
Min
2.3
2.9
36
10
0.3
0.4
2.1
2.0
2.4
2.3
2.6
Typ
Max
5.5
5.5
56
1
1.5
2.3
Unit
V
V
µA
mA
µA
µA
V
V
V
V
mA
mA
mA
mA
%
%
%/A
µA
µA
µA
mΩ
mΩ
µA
mA
mA
MHz
Output Voltage Accuracy
3
Load Regulation
4
Feedback Bias Current
+3
+3
8
8
8
440
550
5
1222
1222
6.64
SWITCHING CHARACTERISTICS
SW On Resistance (R
DSon
)
SW Leakage Current
SW Current Limit
Oscillator Frequency
EN/MODE INPUT LOGIC
High Threshold Voltage
Low Threshold Voltage
Leakage Current
SOFT START
Soft Start Period
5
SHORT-CIRCUIT THRESHOLD
THERMAL SHUTDOWN
Thermal Shutdown Threshold
Thermal Shutdown Hysteresis
1
2
All limits at temperature extremes are guaranteed via correlation using standard statistical quality control (SQC); typical values are at T
A
= 25°C.
Guaranteed by design. The maximum output current guarantee for 2.3 V to 2.5 V increases linearly from 300 mA to 500 mA. The maximum output current guarantee for 2.5 V to
2.7 V increases linearly from 500 mA to 600 mA. For greater than 2.7 V, the maximum output current guarantee is 600 mA.
3
Transients not included in voltage accuracy specifications. For PFM mode, the VOUT accuracy specification is for the upper point of the ripple.
4
5
The load regulation typical value includes all voltage options. The typical value is different for each voltage option, but can be up to −0.2%/A.
Typical value characterized on bench. Maximum specification guaranteed by design.
C
IN
= 2.2 µF (GRM155R60J225M), L = 0.47 µH
(LQM2HPNR47MG0L),
C
OUT
= 4.7 µF
(GRM155R60J475ME87D).
Rev. C | Page 3 of 20
ADP2121
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
VIN to GND
EN, MODE to GND
FB, SW to GND
Operating Ambient Temperature Range
(I
LOAD
≤ 600 mA)
Operating Junction Temperature Range
Storage Temperature
Soldering Conditions
ESD (Electrostatic Discharge)
Human Body Model
Rating
−0.3 V to +6 V
−0.3 V to VIN
−0.3 V to VIN + 0.2 V
–40°C to +85°C
–40°C to + 125°C
–45°C to +150°C
JEDEC J-STD-020
±4 kV
Data Sheet
The junction temperature (T
J
) of the device is dependent on the
ambient temperature (T
A
), the power dissipation of the device
(P
D
), and the junction-to-ambient thermal resistance of the
package (θ
JA
). Maximum junction temperature (T
J
) is calculated
from the ambient temperature (T
A
) and power dissipation (P
D
)
using the following formula:
T
J
=
T
A
+ (P
D
×
θ
JA
)
The junction-to-ambient thermal resistance (θ
JA
) of the package
is based on modeling and calculation using a 2- and 4-layer
board. The junction-to-ambient thermal resistance is highly
dependent on the application and board layout. In applications
where high maximum power dissipation exists, close attention
to thermal board design is required.
The value of θ
JA
may vary, depending on PCB material, layout,
and environmental conditions. Refer to JEDEC JESD51-9 for
detailed information about board construction.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
The junction-to-ambient thermal resistance of the system (θ
JA
)
is specified for worst-case conditions, that is, a device soldered
in a circuit board for surface-mount packages.
Table
4
.
Package Type
6-Ball WLCSP
2-Layer Board
4-Layer Board
θ
JA
198
105
Unit
°C/W
°C/W
THERMAL DATA
Absolute maximum ratings apply individually only, not in
combination. The ADP2121 can be damaged when the junction
temperature limits are exceeded. Monitoring ambient tempera-
ture does not guarantee that the junction temperature (T
J
) is
within the specified temperature limits. In applications with
high power dissipation and poor PCB thermal resistance, the
maximum ambient temperature may need to be derated. In
applications with moderate power dissipation and low PCB
thermal resistance, the maximum ambient temperature can
exceed the maximum limit as long as the junction temperature
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