Development Boards u0026 Kits - PIC / DSPIC PIC32MZEF Development Board
参数名称 | 属性值 |
产品种类 Product Category | Development Boards & Kits - ARM |
制造商 Manufacturer | Atmel (Microchip) |
RoHS | Details |
产品 Product | Evaluation Kits |
Core | ARM Cortex M4 |
工具用于评估 Tool Is For Evaluation Of | ATSAM4E |
系列 Packaging | Bulk |
Data Bus Width | 32 bit |
工厂包装数量 Factory Pack Quantity | 1 |
单位重量 Unit Weight | 3.871988 oz |
ATSAM4E-XPRO | ATSAM4E16EA-CU | ATSAM4E8EA-ANR | ATSAM4E16CA-ANR | ATSAM4E8EA-CU | ATSAM4E16CA-AUR | ATSAM4E8CA-CUR | ATSAM4E8CA-AN | |
---|---|---|---|---|---|---|---|---|
描述 | Development Boards u0026 Kits - PIC / DSPIC PIC32MZEF Development Board | Wireless Charging ICs (WPC) Intg Sec-Side Direct Li-Ion Chgr | ARM Microcontrollers - MCU LQFPGREENEXT | ARM Microcontrollers - MCU LQFPGREENEXT | Buffers u0026 Line Drivers | Board Mount Humidity Sensors | ARM Microcontrollers - MCU LFBGAGREENIND TEMPMRL A | ARM Microcontrollers - MCU LQFPGREENEXT |
是否Rohs认证 | - | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | - | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) |
包装说明 | - | LFBGA-144 | LQFP-144 | LQFP-100 | LFBGA-144 | LQFP-100 | TFBGA-100 | LQFP-100 |
Reach Compliance Code | - | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
ECCN代码 | - | 5A992.C | 5A992.C | 5A992.C | 5A992.C | 5A992.C | 5A992.C | 5A992.C |
具有ADC | - | YES | YES | YES | YES | YES | YES | YES |
地址总线宽度 | - | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
位大小 | - | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
CPU系列 | - | CORTEX-M4F | CORTEX-M4F | CORTEX-M4F | CORTEX-M4F | CORTEX-M4F | CORTEX-M4F | CORTEX-M4F |
最大时钟频率 | - | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz |
DAC 通道 | - | YES | YES | YES | YES | YES | YES | YES |
DMA 通道 | - | YES | YES | YES | YES | YES | YES | YES |
外部数据总线宽度 | - | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
JESD-30 代码 | - | S-PBGA-B144 | S-PQFP-G144 | S-PQFP-G100 | S-PBGA-B144 | S-PQFP-G100 | S-PBGA-B100 | S-PQFP-G100 |
长度 | - | 10 mm | 20 mm | 14 mm | 10 mm | 14 mm | 9 mm | 14 mm |
低功率模式 | - | YES | YES | YES | YES | YES | YES | YES |
DMA 通道数量 | - | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
I/O 线路数量 | - | 117 | 117 | 79 | 117 | 79 | 79 | 79 |
端子数量 | - | 144 | 144 | 100 | 144 | 100 | 100 | 100 |
计时器数量 | - | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
片上数据RAM宽度 | - | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
片上程序ROM宽度 | - | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
最高工作温度 | - | 85 °C | 105 °C | 105 °C | 85 °C | 85 °C | 85 °C | 105 °C |
最低工作温度 | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
PWM 通道 | - | YES | YES | YES | YES | YES | YES | YES |
封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | - | FBGA | QFP | LFQFP | FBGA | LFQFP | FBGA | LFQFP |
封装等效代码 | - | BGA144,12X12,32 | QFP144,.87SQ,20 | QFP100,.55SQ,20 | BGA144,12X12,32 | QFP100,.55SQ,20 | BGA100,10X10,32 | QFP100,.55SQ,20 |
封装形状 | - | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | - | GRID ARRAY, FINE PITCH | FLATPACK | FLATPACK, LOW PROFILE, FINE PITCH | GRID ARRAY, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH |
电源 | - | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
RAM(字节) | - | 131072 | 131072 | 131072 | 131072 | 131072 | 131072 | 131072 |
RAM(字数) | - | 32768 | 32768 | 32768 | 32768 | 32768 | 32768 | 32768 |
ROM(单词) | - | 262144 | 131072 | 262144 | 131072 | 262144 | 131072 | 131072 |
ROM可编程性 | - | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
座面最大高度 | - | 1.4 mm | 1.6 mm | 1.6 mm | 1.4 mm | 1.6 mm | 1.1 mm | 1.6 mm |
速度 | - | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz |
最大供电电压 | - | 1.32 V | 1.32 V | 1.32 V | 1.32 V | 1.32 V | 1.32 V | 1.32 V |
最小供电电压 | - | 1.08 V | 1.08 V | 1.08 V | 1.08 V | 1.08 V | 1.08 V | 1.08 V |
标称供电电压 | - | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
表面贴装 | - | YES | YES | YES | YES | YES | YES | YES |
技术 | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | - | BALL | GULL WING | GULL WING | BALL | GULL WING | BALL | GULL WING |
端子节距 | - | 0.8 mm | 0.5 mm | 0.5 mm | 0.8 mm | 0.5 mm | 0.8 mm | 0.5 mm |
端子位置 | - | BOTTOM | QUAD | QUAD | BOTTOM | QUAD | BOTTOM | QUAD |
宽度 | - | 10 mm | 20 mm | 14 mm | 10 mm | 14 mm | 9 mm | 14 mm |
uPs/uCs/外围集成电路类型 | - | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC |
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