NUMBER
TYPE
BUS-12-050
PRODUCT SPECIFICATION
TITLE
PAGE
REVISION
1 of 8
BERGSTIK® /BERGSTIK™ Headers
AUTHORIZED BY
DATE
L
07 JUL 16
M.Zhou
CLASSIFICATION
UNRESTRICTED
1.0
GENERAL
1.1
SCOPE
This specification covers the Bergstik® and Bergstrip™ Headers, designed for use in low-power
applications requiring a printed wiring -board mounted straight or right angle disconnect. The header
provides only the pin half of the interconnection, using any 0.025” square pin mateable receptacle to
complete the connection. This product is Lead Free and meets the requirement of the European
Union Directive of Restrictions for Hazardous Substances (Directive 2002/95/EC). The specification
is composed of the following sections:
Paragraph
1.0
1.1
1.2
2.0
3.0
3.1
3.2
3.3
3.4
3.5
3.6
3.7
4.0
4.1
4.2
4.3
4.4
Title
GENERAL
Scope
Type
APPLICABLE DOCUMENTS
REQUIREMENTS
Qualification
Material
Finish
Design and construction
Electrical Characteristics
Mechanical characteristics
Environmental Conditions
QUALITY ASSURANCE PROVISIONS
Equipment Calibration
Inspection Conditions
Qualification Inspection
Acceptance Inspection
1.2
Working parameter
current rating: 5A
voltage : 110V
operating temperature: -65 o to 105o C - Nylon
-65o to 130o C - PCT,PPS & LCP
This document is the property of and embodies CONFIDENTIAL and PROPRIETARY information of FCI. No part of the information shown on the
document may be used in any way or disclosed to others without the written consent of FCI. Copyright FCI.
Form E-3005
Rev F
PDS: Rev :L
GS-01-001
STATUS:Released
Printed: Jul 21, 2016
NUMBER
TYPE
BUS-12-050
PRODUCT SPECIFICATION
TITLE
PAGE
REVISION
2 of 8
BERGSTIK® /BERGSTIK™ Headers
AUTHORIZED BY
DATE
L
07 JUL 16
M.Zhou
CLASSIFICATION
UNRESTRICTED
2.0
APPLICABLE DOCUMENTS
The following documents, of the issue in effect on the date of the latest revision of this specification, shall
form a part of this specification to the extent specified herein.
Military Specifications
MIL-F-14256
Flux, Soldering, Liquid (Rosin Base), Activated
MIL-G-45204
Gold Plating, Electrodeposited
MIL-P-45209
Palladium Plating, Electrodeposited
MIL-P-55110
Printer Wiring Boards
MIL-P81728
Plating, Tin-Leaded (Electrodeposited)
Federal Specifications
QQ-N-290
QQ-W-343
QQ-S-571
Military Standards
MIL-STD-105
MIL-STD-202
MIL-STD-275
MIL-STD-1344
ISO-9000
Sampling Procedures & Tables for Inspection by Attributes
Test Methods for Electrical and Electronic Component Parts
Printed Wiring for Electronic Equipment
Test Methods for Electrical Connectors
Calibration System Requirements
Nickel Plating (Electrodeposited)
Wire, Electrical and Nonelectrical, Copper (Uninsulated)
Solder: Lead Alloy, Tin-Lead Allow, and Tin Alloy, Flux Cored
Ribbon and Wire, and Solid Form
Industry Specifications/Standards
UL-94
ASTM B-159
ASTM D-2897
Tests for Flammability of Plastic Materials
Phosphor Bronze Wire
Reinforced & Filled Nylon Injection Molding & Extrusion
Materials
FCI Labs Reports- Supporting Data
ZA5-2625
3.0
REQUIREMENTS
3.1
Qualification
Headers furnished under this specification shall be products capable of meeting or exceeding the
qualification test requirements specified herein.
3.2
Material
Lead Free Plating Investigation
This document is the property of and embodies CONFIDENTIAL and PROPRIETARY information of FCI. No part of the information shown on the
document may be used in any way or disclosed to others without the written consent of FCI. Copyright FCI.
Form E-3005
Rev F
PDS: Rev :L
GS-01-001
STATUS:Released
Printed: Jul 21, 2016
NUMBER
TYPE
BUS-12-050
PRODUCT SPECIFICATION
TITLE
PAGE
REVISION
3 of 8
BERGSTIK® /BERGSTIK™ Headers
AUTHORIZED BY
DATE
L
07 JUL 16
M.Zhou
CLASSIFICATION
UNRESTRICTED
The material for each part shall be specified herein, or equivalent. Substitute material shall meet or
exceed the performance requirements of this specification.
3.2.1
Contact. The contact shall be Phosphor Bronze Alloy UNS C51000 in accordance with
ASTM B-159 or other copper alloy as specified on the product drawing.
3.2.2
Insulator. The insulator shall be glass- or mineral-filled nylon in accordance with ASTM
D-2897, polyphenylene sulfide (PPS) ,PCT or LCP. All plastic material shall be
rated V-0 in accordance with UL-94.
3.3
Finish
The finish of the contact shall be specified herein for the particular type of header under
consideration.
3.3.1
Solder tails. As defined by product drawings, will be plated with the specified thickness of
pure tin for Lead Free. Or 93/7 tin-lead per MIL-P-81728 option. Or gold per MIL-G-45204
Type II, Grade C option. Or palladium alloy per MIL-P-45209 option.
Tin plated “LF” product has 100% tin plating in the interface and has not been tested for
whisker growth in all interconnect environments
Contact Area. As defined by product drawings, will be plated with the specified thickness
of pure tin for Lead Free. Or 93/7 tin-lead per MIL-P-81728 option. Or gold per MIL-G-
45204 Type II, Grade C option. Or palladium alloy per MIL-P-45209 option.
Tin plated “LF” product has 100% tin plating in the interface and has not been tested for
whisker growth in all interconnect environments
All other areas. Will be plated with 50 microinches of nickel per QQ-N-290, Class 2.
3.3.2
3.3.3
3.4
Design and Construction
The header shall be a multi-piece assembly having one or two rows of contacts with solderable tail
ends for installation in .040 inch diameter holes in printed wiring boards of standard thickness. The
Bergstik® header contacts shall be insert molded or post-inserted in the insulator on rectangular
grids of .100, .125, or .150 inches or multiples thereof and shall be available in straight or right angle
configurations. The Bergstrip™ header contacts shall be post-inserted into the insulator on
rectangular grids of .100 inch and shall be available in straight configurations. The contacts shall be
available in various above- and below-board lengths suitable for use as 0.025 inch square male
disconnects or as similarly configured wrapposts for solderless wrapped connections in accordance
with MIL-STD-1130.
This document is the property of and embodies CONFIDENTIAL and PROPRIETARY information of FCI. No part of the information shown on the
document may be used in any way or disclosed to others without the written consent of FCI. Copyright FCI.
Form E-3005
Rev F
PDS: Rev :L
GS-01-001
STATUS:Released
Printed: Jul 21, 2016
NUMBER
TYPE
BUS-12-050
PRODUCT SPECIFICATION
TITLE
PAGE
REVISION
4 of 8
BERGSTIK® /BERGSTIK™ Headers
AUTHORIZED BY
DATE
L
07 JUL 16
M.Zhou
CLASSIFICATION
UNRESTRICTED
3.4.1
Polarization (Optional). Removal or omission of individual contact(s) shall provide
polarization/keying to insure correct orientation of the header and an appropriately
configured mating part.
Workmanship. Headers shall be uniform in quality and shall be free from burrs, voids,
chips, blisters, holes, sharp edges, or other defects that will adversely affect life or
serviceability.
3.4.2
3.5
Electrical Characteristics
3.5.1
Insulation Resistance. The insulation resistance of the unmated and unsoldered headers
shall be not less than 5000 megohms when measured in accordance with MIL-STD-1344,
Method 3003. The following details shall apply:
a. Test Condition - 500 volts DC applied for l minute.
b. Points of Measurement - Between individually paired
adjacent and opposing contacts.
3.5.2
Dielectric Withstanding Voltage. There shall be no evidence of arc-over, insulation
breakdown, or excessive leakage current (>1 milliampere) when the unmated and
unsoldered header is tested in accordance with MIL-STD-1344, Method 3001. The
following details shall apply:
a. Test Potential - See Table I.
b. Test Duration - 50 seconds.
c. Test Condition - I (760 Torr - sea level).
d. Points of Measurement - Between individually paired adjacent and opposing contacts.
TABLE I - DIELECTRIC WITHSTANDING VOLTAGE
Contact Spacing
( inch )
.100
.125
.150
Test Voltage
VRMS
1500
1500
1500
This document is the property of and embodies CONFIDENTIAL and PROPRIETARY information of FCI. No part of the information shown on the
document may be used in any way or disclosed to others without the written consent of FCI. Copyright FCI.
Form E-3005
Rev F
PDS: Rev :L
GS-01-001
STATUS:Released
Printed: Jul 21, 2016
NUMBER
TYPE
BUS-12-050
PRODUCT SPECIFICATION
TITLE
PAGE
REVISION
5 of 8
BERGSTIK® /BERGSTIK™ Headers
AUTHORIZED BY
DATE
L
07 JUL 16
M.Zhou
CLASSIFICATION
UNRESTRICTED
3.6
Mechanical Characteristics
3.6.1
Contact Retention. Individual contacts in an unsoldered header shall withstand a load
applied in either direction, along the contact axis, without dislodgement from the insulator,
of 5.0 pounds in the case of insert molded contacts and 2.0 pounds in the case of post
inserted contacts.
3.7
Environmental Conditions
3.7.1
Thermal Shock. After exposure of an unmated and unsoldered header to alternate
periods of extreme high and low temperature, there shall be no evidence of cracking or
crazing of the insulator（not include open knit line） or other physical damage to the
header. The dielectric withstanding voltage shall be not less than 750 volts RMS 60 HZ
(see Paragraph 3.5.2). The following details shall apply:
a. Test Conditions - B (1 hour cycles).
b. Temperature Range - -65o to 105o C - Nylon
-65o to 130o C - PCT,PPS & LCP
3.7.2
High Temperature Life. After exposure of an unmated and unsoldered header to a high
temperature operating environment, the insulation resistance of the header shall be not
less than 5,000 megohms (see Paragraph 3.5.1). The test shall be in accordance with
MIL-STD-202, Method 108. The following details shall apply:
a. Test Chamber Temperature -105o C ( + 2o)-Nylon;130oC( + 2o) PCT,PPS & LCP
b. Test Condition (Duration) B (250 hours).
c. Operating Conditions - No Current
3.8
Solderability
Plated pins shall be capable of passing BUS-19-002.
3.9
Re-Qualification product
If either of the following conditions occurs, the responsible product engineer shall initiate re-
qualification testing, consisting of all applicable parts of the qualification test matrix, table II
a. A significant design change is made to the existing product. A significant change shall
include, but is not limited to, changes in the contact material composition, contact material
thickness, contact force, contact surface geometry, underlying material composition,
underlying material thickness, insulation design, contact base material or contact lubrication
requirements.
b. A significant change is made to the manufacturing process which impacts the product form,
fit or function.
c.
A significant event occurs during the production or end use requiring corrective action to be
taken relative to the product design or manufacturing process.
This document is the property of and embodies CONFIDENTIAL and PROPRIETARY information of FCI. No part of the information shown on the
document may be used in any way or disclosed to others without the written consent of FCI. Copyright FCI.
Form E-3005
Rev F
PDS: Rev :L
GS-01-001
STATUS:Released
Printed: Jul 21, 2016
FPGA/CPLD
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