Building interconnection combinations of variable and transformable
composition under a compact size.
Versatility
Contacts: size 22 or 20.
Sealed and unsealed version.
Many layouts available.
Termination modules are easily installed on a
mounting rail.
Used on major airframer programs.
NSA937901 qualified.
Developed in accordance with EN3708.
Two new modules #20: layouts 12 & 13.
Use some features of CAN bus technology.
RoHS compliant
Easy to install
Flight proven
Standards
NEW
Integrated
components
8559 Series
|
Modular Junction Blocks
Description
• Two types of modules
• Contacts: size 22 or 20
• Sealed and unsealed version
• Standards: NSA937901 qualified
• Developed in accordance with EN3708
Technical features
Mechanical
• Module:
thermoplastic
• Grommet:
silicone elastomer (for sealed version)
• Module clamp:
stainless steel
• Contact:
copper alloy
• Contact plating:
gold over nickel
• Vibration:
to EN3708 - 10 to 2000 Hz - 10 g
• Shock:
to EN3708 - 100g peak during 6 m/s
• Contact retention:
size 22 - 40 N
size 20 - 67 N
Electrical
• Test voltage:
1500 Vrms (all layouts, except 12 & 13)
750 Vrms (layouts 12 & 13 only)
• Contact resistance:
size 22 - 5 mΩ
size 20 - 4 mΩ
• Insulation resistance:
≥ 5000 MΩ (under 500 Vdc)
• Working current per contact:
size 22 - 5 A
size 20 - 7.5 A
Environmental
• Temperature range:
-55°C +175°C (all layouts, except 12 & 13)
-55°C +125°C (layouts 12 & 13 only)
• Damp heat:
to EN3708 - 21 days
• Salt spray:
48 hours
• Resistance to fluids:
JP5
Skydrol 500 B4
Skydrol LD 4
MIL-PRF-7870C
MIL-PRF-23699F
AMS 1424
2
8559 Series
|
Modular Junction Blocks
Contact layouts
Contact #22
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
S
T
U
V
X
Z
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
S
T
U
V
X
Z
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
S
T
U
V
X
Z
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
S
T
U
V
X
Z
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
S
T
U
V
X
Z
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
S
T
U
V
X
Z
01
02
03
04
05
06
Note: Module delivered without contact. Contact #22 Part Number: EN3155016M2222.
Contact #20
A
B
C
D
E
F
G
H
J
K
A
B
C
D
E
F
G
H
J
K
A
B
C
D
E
F
G
H
J
K
A
B
C
D
E
F
G
H
J
K
A
B
C
D
E
F
G
H
J
K
A
B
C
D
E
F
G
H
J
K
A
B
C
D
E
F
G
H
J
K
A
B
C
D
E
F
G
H
J
K
A
B
C
D
E
F
G
H
J
K
01
02
03
04
06
07
08
09
11
Note: Module delivered without contact. Contact #20 Part Number: EN3155016M2018.
Module with integrated components
Contact #20
A
B
C
D
E
F
G
H
J
K
A
B
C
D
E
F
G
H
J
K
D
J
D
J
A
A
NEW
12
R=120Ω
13
R= 60Ω 0.5W
C= 47nF 50V
Note: Module delivered with contacts. For other electrical layouts, please consult us.
3
8559 Series
|
Modular Junction Blocks
Ordering information
Module part numbers
Basic Series
8559
N
20
01
B
Class:
N:
unsealed module
(not available for layout 13)
E:
sealed module
Module type:
22:
size 22 contact
20:
size 20 contact
Contact layouts:
see tables next page
Last version:
B
Dimensions
Module & Module clamp
Module
3
+0
0 .2
Module clamp
1.5
8
6
A
1.5
27
10
±1
9.5
24.9 Max
A
Max.
Unsealed
module
19 mm
Sealed module
All layouts,
except layout 13
Layout 13
20 mm
22 mm
Part Number:
8559 S
Note: All dimensions are in millimeters (mm)
4
8559 Series
|
Modular Junction Blocks
Contacts
Contact size
Part Numbers
Admissible wire section
mm²
AWG
Ø over insulator (mm)
Min
0.75
0.15
0.25
0.40
26
24
22
Max
1.09
All information in this document presents only general particulars and shall not form part of any contract. All rights reserved to SOURIAU for changes without prior notification or public announcement. Any duplication is prohibited, unless approved in writing.
ABI Research最近评选并公布了全球超高频无源和高频无源 RFID芯片的前十大制造商。 前十大超高频无源芯片制造商是: 前十大高频无源芯片制造商是: 超高频的得奖名单并不出人意外,因为实际上似乎总是前三家公司获得大订单。ABI分析家 Mike Liard称,ABI很容易就评选出 Alien、Avery,和 Raflatac为全球...[详细]
便携式医疗设备的特殊性决定了它们应该是对用户友好的、必须工作在无菌环境下,并且空间占用小、耗能低。 同时,便携式医疗设备还需要足够的计算能力以便处理医疗数据,能够连接到无线或有线接口以便记录和发送数据。从设计人员的角度考虑,上述需求需要低功耗的单片机(MCU)和数字信号控制器(Digital Signal Controller,DSC)。 正是有了嵌入式处理器,设计人员才有可能设...[详细]