TYPE
NUMBER
PRODUCT SPECIFICATION
TITLE
PAGE
GS-12-316
REVISION
1 of 7
C
DATE
Low Profile Smart Card Connectors
AUTHORIZED BY
Miao SH
01/21/09
1.0 OBJECTIVE
1.1 This specification defines the performance, test, quality and reliability requirements of the
smart card connector product.
2.0 SCOPE
This specification is applicable to the termination characteristics of the smart card connector
family of products which provides interconnection between a smart card and a 1.57 mm rigid
PCB.
3.0 GENERAL
This document is composed of the following sections:
1.0 Objective
2.0 Scope
3.0 General
4.0 Applicable Documents
5.0 Requirements
5.1 Qualification
5.2 Mechanical performance
5.3 Electrical performance
5.4 Environmental Conditions
6.0 Quality assurance provisions
6.1 Equipment Calibration
6.2 Inspection Conditions
7.0 Revision history
Copyright 20XX FCI Taiwan, INC.
Form E-3334
Rev A 02/12/01
V20603
GS-12-234
PDM: Rev:C
STATUS:
Released
Printed: Nov 28, 2010
.
TYPE
NUMBER
PRODUCT SPECIFICATION
TITLE
PAGE
GS-12-316
REVISION
2 of 7
C
DATE
Low Profile Smart Card Connectors
4.0 APPLICABLE DOCUMENTS
4.1 Specifications
4.1.1 FCI engineering drawing.
AUTHORIZED BY
Miao SH
01/21/09
4.2 Other Standards and Specifications
4.2.1 UL94-V0: Flammability
4.2.2 IEC 512: Testing procedures & measurement methods for electrical products.
4.2.3 ISO 7816: Smart card standard
4.3 FCI Specifications
BUS-02-056: Metal Selection
BUS-02-057: Plating Selection Guidelines
5.0 REQUIREMENT
5.1 Qualification
Connectors produced under this specification shall be capable of meeting the qualification test
requirements specified herein.
5.1.1 Material
The material for each component shall be as specified herein or equivalent. Reference:
BUS-02-055; BUS-02-056; and BUS-02-058.
5.1.1.1 Terminal: The base material shall be phosphor bronze.
5.1.1.2 Cover: PA46 or PBT
5.1.1.3 Base: PC or PBT
5.1.2 Terminal finish
5.1.2.1 Under plating: 50µ” nickel over all
5.1.2.2 Signal terminal: 80µ” gold minimum on mating area; 120µ” tin/lead on solder tail.
5.1.2.3 Sensor terminal: 15µ” gold minimum on mating area; 120µ” tin/lead on solder tail,
5.1.3 Design and Construction
Connectors shall be of the design, construction, and physical dimensions specified in the
applicable product drawing and the card standard described in ISO 7816, GSM 11.11
The connection between the smart card and the connector is accomplished by cantilever
contacts.
The detection of the card end position is obtained by a blade switch,normally open or
closed.
Copyright 20XX FCI Taiwan, INC.
Form E-3334
Rev A 02/12/01
V20603
GS-12-234
PDM: Rev:C
STATUS:
Released
Printed: Nov 28, 2010
.
TYPE
NUMBER
PRODUCT SPECIFICATION
TITLE
PAGE
GS-12-316
REVISION
3 of 7
C
DATE
Low Profile Smart Card Connectors
AUTHORIZED BY
Miao SH
01/21/09
5.2 Mechanical performance
Para. Test Description
5.2.1
Durability
Test condition
Mate&unmate smart card for 100,000
cycles at a rate of 500±50 cycles per
hour.
Requirement
No defect that would impair
normal operation.
Contact resistance 100mΩ MAX
Mating force: 10N Max.
Unmating force: 3N Min.
No physical or mechanical
damage or disassociation of parts.
No discontinuity greater than 1µ
seconds.
No physical or mechanical
damage or disassociation of parts.
No discontinuity greater than 1µ
seconds.
5.2.2
Mating/unmating Mate and unmate a smart card with
force
connector at a maximum speed of
100mm/min.
Vibration
10-150-10Hz 0.15mm or 2g,total 5
cycles in X,Y,Z axes, full
duration=40minutes
50g/11ms,1/2-sine,3 shocks each in
X,Y,Z axes(total 18 shocks).
5.2.3
5.2.4
Shock Test
5.3 Electrical performance
Para.
Test Description
Test condition
Mated connector with dry circuit
of 20mV,100mA max.
Requirement
100 mΩ maximum.
5.3.1 Contact Resistance
5.3.2 Insulation Resistance
5.3.3 Dielectric Withstand
Voltage
Unmated connector with 500VDC 1000MΩ
between adjacent contacts.
Unmated connector with
1000Vrms for 1 minute between
adjacent contacts.
No flashover, sparkover, or
breakdown allowed
5.4 Environmental Conditions
Para.
5.4.1
5.4.2
5.4.3
Test Description
Thermal shock
Damp Heat
Mixed flowing gas
Test condition
-40°C to +85°C,1 cycles per hour,
total 5 cycles.
40°C-95%( relative
humidity)-56days.
10days.
Requirement
No physical damage.
100mΩ max contact resistance.
100mΩ max contact resistance.
100mΩ max contact resistance.
Copyright 20XX FCI Taiwan, INC.
Form E-3334
Rev A 02/12/01
V20603
GS-12-234
PDM: Rev:C
STATUS:
Released
Printed: Nov 28, 2010
.
TYPE
NUMBER
PRODUCT SPECIFICATION
TITLE
PAGE
GS-12-316
REVISION
4 of 7
C
DATE
Low Profile Smart Card Connectors
AUTHORIZED BY
Miao SH
01/21/09
5.4.4
5.4.5
Temperature life
Solderability
85°C/1000hours.
Manual 350°C/2s
No defect that would impair normal
operation.
No physical damage.
100mΩ max contact resistance.
95% of immersed area must show
no voids, pin holes and etc.
(plastic material:
Wave 260°C/5s
Cover: PA46+Base:PC)
Infrared 230°C /50s
Vapor-phase 215°C/60s
Solderability
Manual: 350°C/2s
(plastic material:
Wave: 260°C/5s with the protection
Cover: PBT+Base:PBT) ( use protective adhesive tape
(Kapton or Telflon) or protective
metallic devices)
6.0 QUALITY ASSURANCE PROVISIONS
6.1 Equipment Calibration
95% of immersed area must show
no voids, pin holes and etc.
All test equipment and inspection facilities used in the performance of any test shall be
maintained in a calibration system in accordance with MIL-C-45662 and QS 9000.
6.2 Inspection Conditions
Unless otherwise specified herein, all inspections shall be performed under the following
ambient conditions:
a. Temperature: 25±5°C
b. Relative Humidity: 30% to 60%
c. Barometric Pressure: Local ambient
6.3 Sample Quantity and Description
See Table 1
6.4 Acceptance
6.4.1 Electrical and mechanical requirements placed on test samples as indicated in
paragraphs 6.0 and 7.0 shall be established from test data using appropriate statistical
techniques or shall otherwise be customer specified, and all samples tested in
accordance with this product specification shall meet the stated requirements.
6.4.2 Failures attributed to equipment, test setup, or operator error shall not disqualify the
product. If product failure occurs, corrective action shall be taken and samples
resubmitted for qualification.
6.5 Qualification Testing
Qualification testing shall be performed on sample units produced with equipment and
procedures normally used in production. The test sequence shall be as shown in Table I.
Copyright 20XX FCI Taiwan, INC.
Form E-3334
Rev A 02/12/01
V20603
GS-12-234
PDM: Rev:C
STATUS:
Released
Printed: Nov 28, 2010
.
TYPE
NUMBER
PRODUCT SPECIFICATION
TITLE
PAGE
GS-12-316
REVISION
5 of 7
C
DATE
Low Profile Smart Card Connectors
AUTHORIZED BY
Miao SH
01/21/09
6.6 Re-qualification Testing
If any of the following conditions occur, the responsible product engineer shall initiate
re-qualification testing consisting of all applicable parts of the qualification test matrix Table I.
a. A significant design change is made to the existing product which impacts the product form,
fit or function. Examples of significant changes shall include but not be limited to, changes
in the plating material composition or thickness contact force, contact surface geometry,
insulator design, contact base material, or contact lubrication requirements.
b. A significant change is made to the manufacturing process which impacts the product form,
fit or function.
c. A significant event occurs during production or end use requiring corrective action to be
taken relative to the product design or manufacturing process.
Copyright 20XX FCI Taiwan, INC.
Form E-3334
Rev A 02/12/01
V20603
GS-12-234
PDM: Rev:C
STATUS:
Released
Printed: Nov 28, 2010
.
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