SILICON, VHF-UHF BAND, MIXER DIODE, DO-35
| 参数名称 | 属性值 |
| 包装说明 | O-LALF-W2 |
| Reach Compliance Code | unknow |
| ECCN代码 | EAR99 |
| 其他特性 | MATCHED BATCH AVAILABLE |
| 外壳连接 | ISOLATED |
| 配置 | SINGLE |
| 最大二极管电容 | 2.2 pF |
| 二极管元件材料 | SILICON |
| 二极管类型 | MIXER DIODE |
| 频带 | VERY HIGH FREQUENCY TO ULTRA HIGH FREQUENCY |
| JEDEC-95代码 | DO-35 |
| JESD-30 代码 | O-LALF-W2 |
| 元件数量 | 1 |
| 端子数量 | 2 |
| 最高工作温度 | 200 °C |
| 最低工作温度 | -65 °C |
| 封装主体材料 | GLASS |
| 封装形状 | ROUND |
| 封装形式 | LONG FORM |
| 认证状态 | Not Qualified |
| 表面贴装 | NO |
| 技术 | SCHOTTKY |
| 端子形式 | WIRE |
| 端子位置 | AXIAL |
| Base Number Matches | 1 |
| 1N6263-AZ1 | 1N6263-AZ2 | 1N6263-AR2 | 1N6263-AR1 | 1N6263-B2 | |
|---|---|---|---|---|---|
| 描述 | SILICON, VHF-UHF BAND, MIXER DIODE, DO-35 | SILICON, VHF-UHF BAND, MIXER DIODE, DO-35 | SILICON, VHF-UHF BAND, MIXER DIODE, DO-35 | SILICON, VHF-UHF BAND, MIXER DIODE, DO-35 | SILICON, VHF-UHF BAND, MIXER DIODE, DO-35 |
| 包装说明 | O-LALF-W2 | O-LALF-W2 | O-LALF-W2 | O-LALF-W2 | O-LALF-W2 |
| Reach Compliance Code | unknow | unknow | unknow | unknow | unknow |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 其他特性 | MATCHED BATCH AVAILABLE | MATCHED BATCH AVAILABLE | MATCHED BATCH AVAILABLE | MATCHED BATCH AVAILABLE | MATCHED BATCH AVAILABLE |
| 外壳连接 | ISOLATED | ISOLATED | ISOLATED | ISOLATED | ISOLATED |
| 配置 | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
| 最大二极管电容 | 2.2 pF | 2.2 pF | 2.2 pF | 2.2 pF | 2.2 pF |
| 二极管元件材料 | SILICON | SILICON | SILICON | SILICON | SILICON |
| 二极管类型 | MIXER DIODE | MIXER DIODE | MIXER DIODE | MIXER DIODE | MIXER DIODE |
| 频带 | VERY HIGH FREQUENCY TO ULTRA HIGH FREQUENCY | VERY HIGH FREQUENCY TO ULTRA HIGH FREQUENCY | VERY HIGH FREQUENCY TO ULTRA HIGH FREQUENCY | VERY HIGH FREQUENCY TO ULTRA HIGH FREQUENCY | VERY HIGH FREQUENCY TO ULTRA HIGH FREQUENCY |
| JEDEC-95代码 | DO-35 | DO-35 | DO-35 | DO-35 | DO-35 |
| JESD-30 代码 | O-LALF-W2 | O-LALF-W2 | O-LALF-W2 | O-LALF-W2 | O-LALF-W2 |
| 元件数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 2 | 2 | 2 | 2 | 2 |
| 最高工作温度 | 200 °C | 200 °C | 200 °C | 200 °C | 200 °C |
| 最低工作温度 | -65 °C | -65 °C | -65 °C | -65 °C | -65 °C |
| 封装主体材料 | GLASS | GLASS | GLASS | GLASS | GLASS |
| 封装形状 | ROUND | ROUND | ROUND | ROUND | ROUND |
| 封装形式 | LONG FORM | LONG FORM | LONG FORM | LONG FORM | LONG FORM |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | NO | NO | NO | NO | NO |
| 技术 | SCHOTTKY | SCHOTTKY | SCHOTTKY | SCHOTTKY | SCHOTTKY |
| 端子形式 | WIRE | WIRE | WIRE | WIRE | WIRE |
| 端子位置 | AXIAL | AXIAL | AXIAL | AXIAL | AXIAL |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
