Operating Temperature Range ............................-40°C to 125°C
Junction Temperature ......................................................+150°C
Storage Temperature Range ............................ -60°C to +150°C
Soldering Temperature (reflow) .......................................+260°C
Lead Temperature (soldering, 10sec) ............................. +300°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Information
8 SOIC
PACKAGE CODE
Outline Number
Land Pattern Number
Junction-to-Ambient (θ
JA
)
Junction-to-Case (θ
JC
)
Junction-to-Ambient (θ
JA
)
Junction-to-Case (θ
JC
)
21-0041
90-0096
170
40
132
38
S8+4
THERMAL RESISTANCE, SINGLE-LAYER BOARD:
THERMAL RESISTANCE, FOUR-LAYER BOARD:
For the latest package outline information and land patterns (footprints), go to
www.maximintegrated.com/packages.
Note that a “+”,
“#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board.
For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial.
www.maximintegrated.com
Maxim Integrated
│
3
MAX33053E/MAX33054E
+3.3V, 2Mbps CAN Transceiver with ±65V
Fault Protection, ±25V CMR, and ±25KV ESD
Electrical Characteristics
((V
DD
= 3.0V to 3.6V, V
L
= 1.62V to V
DD
, R
L
= 60Ω, C
L
= 15pF, T
A
= T
MIN
to T
MAX
, unless otherwise specified. Typical values are at
V
DD
= 3.3V, V
L
= 1.8V, and T
A
= +25C, unless otherwise specified.) (Note 1))
PARAMETER
POWER
Supply Voltage
Logic Supply Voltage
Dominant Supply Current
V
DD
V
L
I
DD_DOM
I
DD_REC
I
STBY
I
S
I
L
V
UVLO_R
V
UVLO_F
V
DD
= 3.3V, TXD = 0V
V
DD
= TXD = 3.3V
STBY = logic high
S = logic-high
RXD = open
V
DD
rising
V
DD
falling
Human Body Model (HBM)
Air-Gap ISO 10605, IEC 61000-4-2
Contact ISO 10605, IEC 61000-4-2
Human Body Model (HBM)
V
FP
T
SHDN
T
HYST
V
IH
V
IL
R
PU_TXD
R
PU_S
V
OH
V
OL
Sourcing 4mA
Sinking 4mA
t < t
DOM
, TXD = 0V,
R
L
= 60Ω
TXD = V
L
, No load
CANH
CANL
CANH
CANL
2.25
0.5
1
1
2.25V ≤ V
L
≤ 3.6V
1.62V ≤ V
L
≤ 2.25V
100
100
V
L
- 0.5
0.4
V
DD
1.25
2
2
0.7 x V
L
0.8
0.6
250
250
CANH or CANL to GND
-65
+160
+20
1.6
±25
±15
±10
±4
+65
kV
V
°C
°C
kV
V
L
= 3.3V
V
L
= 1.8V
No load
R
L
= 60Ω
No load
Recessive Supply Current
Standby Supply Current
Silent Supply Current
Logic Supply Current
UVLO Threshold Rising
UVLO Threshold Falling
FAULT PROTECTION
ESD Protection
(CANH, CANL to GND)
ESD Protection (All Other
Pins)
Fault Protection Range
Thermal Shutdown
Thermal Shutdown
Hysteresis
Input High Voltage
Input Low Voltage
TXD Input Pullup Resistance
STBY, S Input Pullup
Resistance
Output High Voltage
Output Low Voltage
CAN BUS DRIVER
Bus Output Voltage
(Dominant)
Bus Output Voltage
(Recessive)
V
O_DOM
V
O_REC
V
V
CANH shorted to
CANL
3.0
1.62
4.5
36
3.6
3.6
33
2.5
40
22
2.7
mA
μA
mA
μA
V
V
3.6
V
DD
8
50
V
V
mA
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
LOGIC INTERFACE (RXD, TXD, STBY, S)
V
V
kΩ
kΩ
V
V
www.maximintegrated.com
Maxim Integrated
│
4
MAX33053E/MAX33054E
+3.3V, 2Mbps CAN Transceiver with ±65V
Fault Protection, ±25V CMR, and ±25KV ESD
Electrical Characteristics (continued)
((V
DD
= 3.0V to 3.6V, V
L
= 1.62V to V
DD
, R
L
= 60Ω, C
L
= 15pF, T
A
= T
MIN
to T
MAX
, unless otherwise specified. Typical values are at
射频识别(Radio Frequency Identification，RFID)技术是一种利用无线射频通信实现的非接触式自动识别技术，与目前广泛采用的条形码技术相比，RFID具有容量大、识别距离远、穿透能力强、抗污性强等特点。RFID技术已经发展得比较成熟并获得了大规模商用，但超高频RFID技术相对滞后。本文分析了射频芯片nRF9E5的功能特性，并将其用于RFID系统中，设计了一套有源超高频(...[详细]
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