Processor Specific Clock Generator, 533.3MHz, PDSO24, 0.150 INCH, SSOP-24
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | IDT (Integrated Device Technology) |
零件包装代码 | SSOP |
包装说明 | 0.150 INCH, SSOP-24 |
针数 | 24 |
Reach Compliance Code | not_compliant |
ECCN代码 | EAR99 |
JESD-30 代码 | R-PDSO-G24 |
JESD-609代码 | e0 |
长度 | 8.6868 mm |
湿度敏感等级 | 1 |
端子数量 | 24 |
最高工作温度 | 70 °C |
最低工作温度 | |
最大输出时钟频率 | 533.3 MHz |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SSOP |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, SHRINK PITCH |
峰值回流温度(摄氏度) | 225 |
主时钟/晶体标称频率 | 66.66 MHz |
认证状态 | Not Qualified |
座面最大高度 | 1.7272 mm |
最大供电电压 | 3.465 V |
最小供电电压 | 3.135 V |
标称供电电压 | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn85Pb15) |
端子形式 | GULL WING |
端子节距 | 0.635 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 3.937 mm |
uPs/uCs/外围集成电路类型 | CLOCK GENERATOR, PROCESSOR SPECIFIC |
Base Number Matches | 1 |
ICS9212AF-13 | 9212AF-13 | ICS9212AF-13T | 9212AF-13T | |
---|---|---|---|---|
描述 | Processor Specific Clock Generator, 533.3MHz, PDSO24, 0.150 INCH, SSOP-24 | Processor Specific Clock Generator, 533.3MHz, PDSO24, 0.150 INCH, SSOP-24 | Processor Specific Clock Generator, 533.3MHz, PDSO24, 0.150 INCH, SSOP-24 | Processor Specific Clock Generator, 533.3MHz, PDSO24, 0.150 INCH, SSOP-24 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
零件包装代码 | SSOP | SSOP | SSOP | SSOP |
包装说明 | 0.150 INCH, SSOP-24 | 0.150 INCH, SSOP-24 | 0.150 INCH, SSOP-24 | 0.150 INCH, SSOP-24 |
针数 | 24 | 24 | 24 | 24 |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
JESD-30 代码 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 |
JESD-609代码 | e0 | e0 | e0 | e0 |
长度 | 8.6868 mm | 8.6868 mm | 8.6868 mm | 8.6868 mm |
湿度敏感等级 | 1 | 1 | 1 | 1 |
端子数量 | 24 | 24 | 24 | 24 |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C |
最大输出时钟频率 | 533.3 MHz | 533.3 MHz | 533.3 MHz | 533.3 MHz |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SSOP | SSOP | SSOP | SSOP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH |
峰值回流温度(摄氏度) | 225 | 240 | NOT SPECIFIED | 240 |
主时钟/晶体标称频率 | 66.66 MHz | 66.66 MHz | 66.66 MHz | 66.66 MHz |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.7272 mm | 1.7272 mm | 1.7272 mm | 1.7272 mm |
最大供电电压 | 3.465 V | 3.465 V | 3.465 V | 3.465 V |
最小供电电压 | 3.135 V | 3.135 V | 3.135 V | 3.135 V |
标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.635 mm | 0.635 mm | 0.635 mm | 0.635 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | 30 | 20 | NOT SPECIFIED | 20 |
宽度 | 3.937 mm | 3.937 mm | 3.937 mm | 3.937 mm |
uPs/uCs/外围集成电路类型 | CLOCK GENERATOR, PROCESSOR SPECIFIC | CLOCK GENERATOR, PROCESSOR SPECIFIC | CLOCK GENERATOR, PROCESSOR SPECIFIC | CLOCK GENERATOR, PROCESSOR SPECIFIC |
Base Number Matches | 1 | 1 | 1 | 1 |
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