MN101D07G, MN101D07H
Type
Internal ROM type
ROM (byte)
RAM (byte)
Package (Lead-free)
Minimum Instruction
Execution Time
128K
4K
MN101D07G
Mask ROM
160K
5K
MN101D07H
MN101DF07Z
FLASH
224K
6K
0.1397
µs (at
4.0
V to
5.5
V,
14.32
MHz)
71.5
µs (at
3.0
V to
5.5
V,
14.32
MHz
internal frequency di Vision)
61
µs (at
2.5
V to
5.5
V,
32.768
kHz)
LQFP112-P-2020
[With main clock operated]
0.1397
µs (at
4.0
V to
5.5
V,
14.32
MHz)
71.5
µs (at
3.0
V to
5.5
V,
14.32
MHz internal frequency di Vision)
[When sub-clock operated]
61
µs (at
2.2
V to
5.5
V,
32.768
kHz)
Interrupts
RESET, Runaway, External
0
to
4,
key input (P50 to P54), Timer
0
to
4,
Timer
6,
Timer
7,
Capstan FG, Control, HSW,
Cylinder(Drum) FG, Servo V-sync, Synchronous output, OSD, XDS, Serial
0
to
2,
A/D (common with PWM
4
reference frequency),
OSD V-sync
Timer counter
0
:
16-bit
×
1
(timer function, clock function [max.
2
s or max.
36
h at cascade-connecting with timer
6])
Clock source................
1/2,
(1/4,)
1/8,
(1/16) of system clock frequency; overflow of timer counter
6; 1/512
of XI oscillation
clock or OSC oscillation clock frequency
Interrupt source ........... overflow of timer counter
0
Timer counter
1
:
16-bit
×
1
(timer function, linear timer counter function)
Clock source................
1/2,
(1/4,)
1/8,
(1/16) of system clock frequency; CTL signal
Interrupt source ........... overflow of timer counter
1
Timer counter
2
:
16-bit
×
1
(timer function, input capture
(DCTL specified edge), duty judgment of DCTL signal)
Clock source................
1/2,
(1/4,)
1/8,
(1/16,)
1/12,
(1/24) of system clock frequency
Interrupt source ........... overflow of timer counter
2;
input of DCTL specified edge; underflow of timer
2
shift register
4-bit
counter; coincidence of timer
2
shift register with timer
2
shift register compare register
Timer counter
3
:
16-bit
×
1
(timer function, detection of serial indexing, generation of remote control output carrier frequency)
Clock source................
1/2,
(1/4,)
1/8,
(1/16) of system clock frequency; XI oscillation clock
Interrupt source ........... overflow of timer counter
3
Timer counter
4
:
16-bit
×
1
(timer function, event count [P15 input], generation of serial transmission clock)
Clock source................
1/8,
(1/16) of system clock frequency; external clock input
Interrupt source ........... overflow of timer counter
4;
coincidence of timer counter
4
with OCR4
Timer counter
5
:
19-bit
×
1
(watchdog, stable oscillation waiting function)
Clock source................ system clock
Watchdog interrupt source ...
1/2
16
,
1/2
19
of timer counter
5
frequency
Clear by stable oscillation ... after
256
counts by timer counter
5
(218 counts of OSC oscillation clock)
Timer counter
6
:
16-bit
×
1
(clock function [max.
2
s])
Clock source................
1/512
of OSC oscillation clock frequency; XI oscillation clock;
1/4,
(1/8,)
1/64,
(1/128) of system clock
frequency
Interrupt source ...........
1/2
13
,
1/2
14
,
1/2
15
overflow of timer counter
6
Timer counter
7
:
8-bit
×
1
or
4-bit
×
2
(timer function, event count)
Clock source................
1/4,
(1/8,)
1/16,
(1/32) of system clock frequency; external clock input
Interrupt source ........... overflow of timer counter
7
(although when
4-bit
×
2,
there is one interrupt vector. )
Timer Counter
MAD00030GEM
MN101D07G, MN101D07H
Serial interface
Serial
0
:
8-bit
×
1
(synchronous type/start-stop synchronous type) (transfer direction of MSB/LSB selectable)
Synchronous type clock source ....
1/8, 1/16, 1/32, 1/64, 1/128, 1/256
of system clock frequency;
2-division
timer
4
output; NSBT0 pin input
Clock for UART ..........
8-division
of above clock;
2-division
timer
4
output; NSBT0 pin input
Serial
1
:
8-bit
×
1
(synchronous type/remote control transmission/simple remote control receive)
(transfer direction of MSB/LSB selectable, start condition function)
Clock source................
1/8, 1/16, 1/32, 1/64, 1/128, 1/256
of system clock frequency;
2-division
timer
4
output; NSBT1 pin input
Remote control clock......
2-division
timer
4
output
Serial
2
:
8-bit
×
1
(I²C)
(master transmission/reception, slave transmission/reception)
Clock source................
1/144
to
1/252
of system clock, SCK pin input
OSD
OSD mode : Accommodation with menu(internal synchronous) or super impose(external synchronous) display
Applicable broadcasting system.... NTSC, PAL, PAL-M, PAL-N
Screen configuration ................
24
characters
×
2n
rows (n =
1
to
6)
Character type .......................... max.
512
character types (variable)
Character size ...........................
12
×
18
dots
Enlarged characters .................. each
×
2,
×
3
or
×
4
settings in horizontal and vertical
Character interpolation............. none
Line background color .............
8-hue
settable (settable in the row unit at menu display)
Line background intensity........
8
gradations settable in the row unit(at output of composite video signal)
Screen background color..........
8-hue
settable (at output of composite video signal)
Character color ......................... white (at output of composite video signal)
Character intensity ...................
8
gradations settable in the row unit
Frame function .........................
1-dot
frame in
4
or
8
directions (at output of composite video signal)
Frame intensity.........................
4
gradations settable in the row unit
Box shade function .................. settable in the character unit (at output of composite video signal with
129
or more characters
(character types))
Blinking.................................... none (covered by software)
Inverted character..................... settable in the character unit
Halftone.................................... settable in the row unit in
2
intensity gradations (at output of external synchronous composite
video signal)
CCD mode : Supports Closed Caption in the U.S.A.
Screen configuration ................
2
characters
×
16
rows
Character type .......................... max.
128
character types (variable)
Character size ...........................
2
×
26
dots (including
8
dots in the underlined area)
Enlarged characters .................. none
Character interpolation............. none
Line background color .............
8-hue
settable
Line background intensity........
8
gradations settable in the screen unit (at output of composite video signal)
Screen background color..........
8-hue
settable (at output of composite video signal)
Character color .........................
8
colors (at RGB output), White (at output of composite video signal)
Character intensity ...................
8
gradations settable in the screen unit(at output of composite video signal)
Frame function ......................... none
Box shade function .................. none
Inverted character..................... none
Halftone.................................... settable in the row unit in
2
intensity gradations (at output of external synchronous composite
video signal)
Others ....................................... Underline, italic, blinking function and scroll
Common
Input ......................................... composite video signal input (output level :
1
V[p-p] /
2
V[p-p])
Clamp method .......................... sync tip clamp, clamp level in
4
levels
Output ...................................... composite video output, output of Y/C split video signal, digital output (6 pins)
Measure against image fluctuation...... built-in AFC circuit
Dot clock ..................................
1/2
of OSC oscillation clock (automatic phase adjustment)
MAD00030GEM
XDS
Built-in U.S. closed caption data slicer (optional
2
line data can be extracted.)
I/O Pins
I/O
Input
85
2
Common use :
71
Common use :
2
A/D converter
PWM
8-bit
×
14-ch.
(without S/H)
13-bit
×
2-ch.
(at repetition cycle
572
ms at
14.32
MHz),
10-bit
×
2-ch.
(at repetition cycle
71.5
ms at
14.32
MHz),
8-bit
×
1-ch.
(at repetition cycle
71.5
ms,
0.572
ms,
1.14
ms,
2.29
ms at
14.32
MHz)
18-bit
×
6-ch.
16-bit
×
2
(8-bit synchronous output;
4-bit 3-state
synchronous output),
16-bit
×
1
(weak electric field V-sync backup),
16-bit
×
1
(Rec CTL)
Buzzer output;
3-state
output VLP pin; remote control receive;
CTL signal input terminal; Capstan FG inputterminal; Sylinder(Durm) PG/FG input terminals;
HSW output terminal; Head Amp/Rortary control output terminals;
output of
1/2
OSC oscillation clock (2 V[p-p]); output of
1/4
OSC oscillation clock (1 V[p-p])
Correcting address designation : up to
3
addresses possible
Correction method : correction program being saved in internal RAM
ICR
OCR
Special Ports
ROM Correction
Electrical Charactreistics (Supply current)
Parameter
Symbol
IDD1
Operating supply current
IDD2
IDD3
Supply current at STOP
Supply current at HALT
IDSP
IDHT0
IDHT1
Condition
14.32
MHz operation without load, VDD =
5
V
1/1024
of
14.32
MHz operation without load
VDD =
3.0
V
Stop of
14.32
MHz oscillation, VDD =
2.7
V
32
kHz oscillation operation without load
Stop of oscillation without load, VDD =
5
V, Ta =
55
°
C
14.32
MHz oscillation without load, VDD =
5
V
Stop of
14.32
MHz oscillation, VDD =
2.7
V
32
kHz oscillation operation without load
Limit
min
typ
60
2
50
5
5
max
100
5
100
10
15
20
Unit
mA
mA
µA
µA
mA
µA
(Ta =
25
°
C
±
2
°
C , VSS =
0
V)
Electrical Charactreistics (A/D converter characteristics)
Parameter
Conversion relative error
A/D Conversion Time
Analog Input Voltage
Symbol
∆
NLAD
tAD
fosc =
14.32
MHz
8
5
Condition
Limit
min
typ
max
±
3
Unit
LSB
µ
½
V
(Ta =
25
°
C
±
2
°
C , VDD =
5.0
V , VSS =
0
V)
Development tools
In-circuit Emulator
PX-ICE101C/D + PX-PRB101D07-LQFP112-P-2020-M
MAD00030GEM
MN101D07G, MN101D07H
Pin Assignment
RCTLN
RCTLP
AVDD
CTLA
AVSS
VRI
VRO
AFG
FGF
YPG(↔P91)
YFG(PFG)
PGMM(↔P92)
VOW1(↔PA0)
VOW2(↔PA1)
VOW3(↔PA2)
VOW4(↔PA3)
VOB1(↔PA4)
VOB2(↔PA5)
PA6
SCOUT(↔P93)
SECAM(↔PA7)
SYOUT(↔P94)
FSCLPF(↔PB0)
FSCI(↔PB1)
AFCLPG(↔PB2)
AFCC(↔PB3)
VDD2
SCIN(↔P95)
CO
TPZ(↔P90,
AD12)
AD13(↔PC4)
AD11(↔PC3)
AD10(↔PC2)
AD9(↔PC1)
AD8(↔PC0)
AD7(↔P87)
AD6(↔P86)
AD5(↔P85)
AD4(↔P84)
AD3(↔P83)
AD2(↔P82)
AD1(↔P81)
AD0(↔P80)
VDD
P77
P76
P75
P74
P73
P72
P71
P70
VSS
ROTA(↔P67)
HAMP(↔P66)
DENV(↔P65)
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
108
109
110
111
112
84
86
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
MN101D07G
MN101D07H
MAD00030GEM
IRQ0(P64→)
IRQ1(P63↔)
IRQ2(P62↔)
IRQ3(P61↔)
IRQ4(P60↔)
P56
P55
KEYIRQ4(P54↔)
KEYIRQ3(P53↔)
KEYIRQ2(P52↔)
KEYIRQ1(P51↔)
KEYIRQ0(P50↔)
SBT1(P07↔)
SBI1(P06↔)
SBO1(P05↔)
P03
SBT0(P02↔)
SBI0(P01↔)
SBO0(P00↔)
SDA(P27↔)
SCK(P26↔)
HBUFD6, BUZZER(P46↔)
HUBFD4(P44↔)
HUBFD2, DAOUT(P42↔)
HUBFD0(P40↔)
HSW
VLP
NRST(P04←)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
SYIN(P96↔)
CVIN2(PB4↔)
CVIN(PB5↔)
VSS2
CVOUT(PB6↔)
P97
HSYNC(PB7↔)
VSYNC(P20↔)
OSCO2(P21↔)
OSCI2(P22↔)
SXI
XO(P23↔)
XI(P24↔)
VSS
OSCI
OSCO
VDD
SBUFD0, PWM4(P25↔)
PWM0
PWM1
P57
SBUFD1(P11, PWM2↔)
SBUFD2(P12, PWM3↔)
SBUFD3(P13, FF15↔)
SBUFD4(P14, TC3O↔)
SBUFD5(P15, TC4I↔)
SBUFD6(XDSCK, OSDH, P16↔)
SBUFD7(XDSDAT, OSDV, OSCDIV, P17←)
LQFP112-P-2020
Request for your special attention and preca
semiconductors de
(1)
If any of the products or technical information described in thi
regulations of the exporting country, especially, those with regar
(2) The technical information described in this book is intended onl
of the products, and no license is granted under any intellectua
company. Therefore, no responsibility is assumed by our comp
company which may arise as a result of the use of technical info
(3) The products described in this book are intended to be used for s
equipment, communications equipment, measuring instruments
Consult our sales staff in advance for information on the followi
–
Special applications (such as for airplanes, aerospace, automo
systems and safety devices) in which exceptional quality and
ucts may directly jeopardize life or harm the human body.
–
Any applications other than the standard applications intended.
(4) The products and product specifications described in this book
provement. At the final stage of your design, purchasing, or u
Standards in advance to make sure that the latest specifications s
(5) When designing your equipment, comply with the range of a
(operating power supply voltage and operating environment etc
maximum rating on the transient state, such as power-on, powe
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values
mode, possible to occur to semiconductor products. Measures o
or preventing glitch are recommended in order to prevent physic
(6) Comply with the instructions for use in order to prevent breakd
thermal stress and mechanical stress) at the time of handling, m
damp-proof packing is required, satisfy the conditions, such as s
(7) This book may be not reprinted or reproduced whether wholl
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