SPRING-LOADED CONNECTORS
Through Hole Mount
Single and Double Row Strips
•
Modular contacts for use on 2,54 grid, available in
five heights from 3,48 to 5,99, supplied in single
and double row contact strips.
•
Precision-machined piston / base and gold plated
components assure a 1,000,000 min. cycle life.
•
Pistons have a long stroke relative to the low pro-
file of the assembly.
•
Low resistance, high current contacts are rated at
2 amps continuous, 3 amps peak.
•
High temperature thermoplastic insulators are suit-
able for surface mount processes.
•
821
&
823
series contact strips are designed for
manual placement into Ø0,56±0,08 plated-thru-
holes in the circuit board prior to hand, wave or
reflow soldering.
Series 821, 823
SINGLE ROW Series 821
Number of Pins X 2,54
2,54
2,54
Ordering Information
Single Row Series 821
821-22-0XX-10-00X-101
Specify contact style
0-4
Specify # of contacts
02-64
Double Row Series 823
823-22-0XX-10-00X-101
Specify contact style
0-4
Specify # of contacts
04-72
CONTACT STYLE
0
1
2
3
4
INITIAL HEIGHT
A
3,48
4,5
5,0
5,51
5,99
MAX. STROKE
B
0,99
1,14
1,39
1,39
1,39
Stroke
1,07 DIA.
Stroke
B
A
1,8
2,79
B
A
0,41
1,75
0,43 DIA.
1,83 DIA.
Style 0 only
DOUBLE ROW Series 823
Number of Pins X 2,54 / 2
2,54
5,08
2,54
Stroke
Technical Specifications
1,80
B
A
Style 0 only
Stroke
2,54
1,07 DIA.
B
A
2,79
0,41
1,75
0,43 DIA.
1,83 DIA.
Materials:
Contact piston & Base: Machined copper alloy plated 0,51µm
gold over 2,54µm nickel
Spring: Beryllium copper plated 0,25µm gold
Insulator: High temp. thermoplastic rated UL94 V-0
Mechanical:
Spring force @ initial height (A): 25 grams
Spring force @ mid stroke (B/2): 60 grams
Durability: 1,000,000 cycles min.
Electrical:
Voltage rating: 100Vrms/150Vdc
Current rating: 2A (continous), 3A (peak) per contact
Contact resistance: 20mΩ max.
Insulation resistance: 10,000MΩ min.
Dielectric strength: 700Vrms min.
RoHS
2002/95/EC
Capacitance: 1pF max.
w w w. m i l l - m a x . c o m
10
516-922-6000
微控制器 MCU
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
