®
RF360 Europe GmbH
A Qualcomm – TDK Joint Venture
SAW Components
Low-Loss Filter for Mobile Communication
Data Sheet B4926
Series/type:
Ordering code:
Date:
Version:
B4926
Apr 02, 2003
RF360 products mentioned within this document are offered by RF360 Europe GmbH and other subsidiaries of
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is a joint venture of Qualcomm Global Trading Pte. Ltd. and EPCOS AG. References in this documentation to
EPCOS AG should properly reference, and shall be read to reference, the RF360 Subsidiaries.
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SAW Components
Data Sheet B4926
EPCOS AG 2015. Reproduction, publication and dissemination of this publication, enclosures hereto and the information
contained therein without EPCOS' prior express consent is prohibited.
EPCOS AG is a TDK Group Company.
SAW Components
Low-Loss Filter for Mobile Communication
Data Sheet
B4926
133,2 MHz
Ceramic package
QCC12C
Features
2,54
q
q
q
q
q
Low-loss IF filter for mobile telephone
Channel selection in GSM systems
Hermetically sealed ceramic SMD package
Balanced and unbalanced operation possible
No coupling coil required
1
2
3
1,4
12
4
1,0
2,54
11
bottom view
10
9
8
0,6
7
Terminals
q
Gold-plated Ni
1,48
6
5
side view
5,0
top view
7,0
Dimensions in mm, approx. weight 0,25 g
Pin configuration
10
12
4
6
3, 9
1, 2, 7, 8
Input
Input ground or balanced input
Output
Output ground or balanced output
Case ground
To be grounded
Type
B4926
Ordering code
B39131-B4926-H310
Marking and Package
according to
C61157-A7-A95
Packing
according to
F61074-V8710-Z000
Electrostatic Sensitive Device
(ESD)
Maximum ratings
Operable temperature range
Storage temperature range
DC voltage
Source power
ESD
T
T
stg
V
DC
P
s
V
ESD
– 30/+ 85
– 40/+ 85
5
10
50
˚C
˚C
V
dBm
V
Human Body Model
2
Apr 02, 2003
SAW Components
Low-Loss Filter for Mobile Communication
Data Sheet
Characteristics
Operating temperature range:
Terminating source impedance:
Terminating load impedance:
B4926
133,2 MHz
T
= -30 ˚C ... +80 ˚C
Z
S
= 1000
Ω
|| 135 nH
Z
L
= 1300
Ω
|| 170 nH
min.
typ.
133,20
max.
—
MHz
Nominal frequency
Minimum insertion attenuation
(excluding losses in matching circuit)
Amplitude ripple
(p-p)
f
N
- 100,0 kHz
...
f
N
+ 100,0 kHz
Group delay ripple
(p-p)
f
N
- 100,0 kHz
...
f
N
+ 100,0 kHz
Relative attenuation
(relative to
α
min
)
f
N
- 30,00 MHz
...
f
N
- 7,00 MHz
f
N
- 7,00 MHz
...
f
N
- 3,00 MHz
f
N
- 3,00 MHz
...
f
N
- 0,80 MHz
f
N
- 0,80 MHz
...
f
N
- 0,60 MHz
f
N
- 0,60 MHz
...
f
N
- 0,40 MHz
f
N
- 0,40 MHz
...
f
N
- 0,25 MHz
f
N
α
min
—
4,5
∆α
—
∆τ
—
α
rel
40
35
29
20
15
3
3
15
20
29
35
40
—
—
48
42
32
29
19
6,5
6,5
17
27
31
39
46
1000 ||10,3.
1300 || 8,2
– 0,042
25
0,3
0,4
6,0
1,0
1,0
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
dB
dB
µs
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
Ω
|| pF
Ω
|| pF
ppm/K
2
˚C
f
N
+ 0,25 MHz
f
N
+ 0,40 MHz
f
N
+ 0,60 MHz
f
N
+ 0,80 MHz
f
N
+ 3,00 MHz
f
N
+ 7,00 MHz
...
...
...
...
...
...
f
N
+ 0,40 MHz
f
N
+ 0,60 MHz
f
N
+ 0,80 MHz
f
N
+ 3,00 MHz
f
N
+ 7,00 MHz
f
N
+ 30,00 MHz
Impedance
within pass band
Input:
Z
IN
=
R
IN
||
C
IN
Output:
Z
OUT
=
R
OUT
||
C
OUT
Temperature coefficient of frequency
1)
Frequency inversion point
1)
Temperature
TC
f
T
0
—
—
dependence of
f
c
:
f
c
(T) =
f
c
(T
0
)(1 +
TC
f
(T –
T
0
)
2
L
p1
L
s2
L
s3
L
p4
= 82 nH
= 27 nH
= 43 nH
= 82 nH
Test matching network to 50
Ω
(element values depend on PCB layout):
3
Apr 02, 2003
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