Freescale Semiconductor
Data Sheet: Technical Data
Document Number MKE04P24M48SF0
Rev 3, 3/2014
KE04 Sub-Family Data Sheet
MKE04P24M48SF0
Supports the following:
MKE04Z8VTG4(R), MKE04Z8VWJ4(R),
and MKE04Z8VFK4(R)
Key features
• Operating characteristics
– Voltage range: 2.7 to 5.5 V
– Flash write voltage range: 2.7 to 5.5 V
– Temperature range (ambient): -40 to 105°C
• Performance
– Up to 48 MHz ARM® Cortex-M0+ core
– Single cycle 32-bit x 32-bit multiplier
– Single cycle I/O access port
• Memories and memory interfaces
– Up to 8 KB flash
– Up to 1 KB RAM
• Clocks
– Oscillator (OSC) - supports 32.768 kHz crystal
or 4 MHz to 24 MHz crystal or ceramic
resonator; choice of low power or high gain
oscillators
– Internal clock source (ICS) - internal FLL with
internal or external reference, 37.5 kHz pre-
trimmed internal reference for 48 MHz system
clock
– Internal 1 kHz low-power oscillator (LPO)
• System peripherals
– Power management module (PMC) with three
power modes: Run, Wait, Stop
– Low-voltage detection (LVD) with reset or
interrupt, selectable trip points
– Watchdog with independent clock source
(WDOG)
– Programmable cyclic redundancy check module
(CRC)
– Serial wire debug interface (SWD)
– Aliased SRAM bitband region (BIT-BAND)
– Bit manipulation engine (BME)
• Security and integrity modules
– 80-bit unique identification (ID) number per chip
• Human-machine interface
– Up to 22 general-purpose input/output (GPIO)
– Two 8-bit keyboard interrupt modules (KBI)
– External interrupt (IRQ)
• Analog modules
– One 12-channel 12-bit SAR ADC, operation in
Stop mode, optional hardware trigger (ADC)
– Two analog comparators containing a 6-bit
DAC and programmable reference input
(ACMP)
• Timers
– One 6-channel FlexTimer/PWM (FTM)
– One 2-channel FlexTimer/PWM (FTM)
– One 2-channel periodic interrupt timer (PIT)
– One pulse width timer (PWT)
– One real-time clock (RTC)
• Communication interfaces
– One SPI module (SPI)
– One UART module (UART)
– One I2C module (I2C)
• Package options
– 24-pin QFN
– 20-pin SOIC
– 16-pin TSSOP
Freescale reserves the right to change the detail specifications as may be
required to permit improvements in the design of its products.
© 2013-2014 Freescale Semiconductor, Inc.
Table of Contents
1 Ordering parts...........................................................................3
1.1 Determining valid orderable parts......................................3
2 Part identification......................................................................3
2.1 Description.........................................................................3
2.2 Format...............................................................................3
2.3 Fields.................................................................................3
2.4 Example............................................................................4
3 Parameter classification............................................................4
4 Ratings......................................................................................4
4.1 Thermal handling ratings...................................................4
4.2 Moisture handling ratings..................................................5
4.3 ESD handling ratings.........................................................5
4.4 Voltage and current operating ratings...............................5
5 General.....................................................................................6
5.1 Nonswitching electrical specifications...............................6
5.1.1
5.1.2
5.1.3
DC characteristics.................................................6
Supply current characteristics...............................13
EMC performance.................................................14
5.2.2
FTM module timing...............................................16
5.3 Thermal specifications.......................................................17
5.3.1
Thermal characteristics.........................................17
6 Peripheral operating requirements and behaviors....................19
6.1 Core modules....................................................................19
6.1.1
SWD electricals ....................................................19
6.2 External oscillator (OSC) and ICS characteristics.............20
6.3 NVM specifications............................................................22
6.4 Analog...............................................................................23
6.4.1
6.4.2
ADC characteristics...............................................23
Analog comparator (ACMP) electricals.................25
6.5 Communication interfaces.................................................26
6.5.1
SPI switching specifications..................................26
7 Dimensions...............................................................................29
7.1 Obtaining package dimensions.........................................29
8 Pinout........................................................................................29
8.1 Signal Multiplexing and Pin Assignments..........................29
8.2 Device pin assignment......................................................31
9 Revision history.........................................................................32
5.2 Switching specifications.....................................................15
5.2.1
Control timing........................................................15
KE04 Sub-Family Data Sheet, Rev3, 3/2014.
2
Freescale Semiconductor, Inc.
Ordering parts
1 Ordering parts
1.1 Determining valid orderable parts
Valid orderable part numbers are provided on the web. To determine the orderable part
numbers for this device, go to
freescale.com
and perform a part number search for the
following device numbers: KE04Z.
2 Part identification
2.1 Description
Part numbers for the chip have fields that identify the specific part. You can use the
values of these fields to determine the specific part you have received.
2.2 Format
Part numbers for this device have the following format:
Q KE## A FFF R T PP CC N
2.3 Fields
This table lists the possible values for each field in the part number (not all combinations
are valid):
Field
Q
KE##
A
FFF
R
T
PP
Description
Qualification status
Kinetis family
Key attribute
Program flash memory size
Silicon revision
Temperature range (°C)
Package identifier
Values
• M = Fully qualified, general market flow
• P = Prequalification
• KE04
• Z = M0+ core
• 8 = 8 KB
• (Blank) = Main
• A = Revision after main
• V = –40 to 105
• TG = 16 TSSOP (4.5 mm x 5 mm)
Table continues on the next page...
KE04 Sub-Family Data Sheet, Rev3, 3/2014.
Freescale Semiconductor, Inc.
3
Parameter classification
Field
Description
Values
• WJ = 20 SOIC (7 mm x 12 mm)
• FK = 24 QFN (4 mm x 4 mm)
CC
N
Maximum CPU frequency (MHz)
Packaging type
• 4 = 48 MHz
• R = Tape and reel
• (Blank) = Trays
2.4 Example
This is an example part number:
MKE04Z8VFK4
3 Parameter classification
The electrical parameters shown in this supplement are guaranteed by various methods.
To give the customer a better understanding, the following classification is used and the
parameters are tagged accordingly in the tables where appropriate:
Table 1. Parameter classifications
P
C
T
D
Those parameters are guaranteed during production testing on each individual device.
Those parameters are achieved by the design characterization by measuring a statistically relevant sample size
across process variations.
Those parameters are achieved by design characterization on a small sample size from typical devices under
typical conditions unless otherwise noted. All values shown in the typical column are within this category.
Those parameters are derived mainly from simulations.
NOTE
The classification is shown in the column labeled “C” in the
parameter tables where appropriate.
4 Ratings
4.1 Thermal handling ratings
Symbol
T
STG
Description
Storage temperature
Min.
–55
Table continues on the next page...
Max.
150
Unit
°C
Notes
1
KE04 Sub-Family Data Sheet, Rev3, 3/2014.
4
Freescale Semiconductor, Inc.
Ratings
Symbol
T
SDR
Description
Solder temperature, lead-free
Min.
—
Max.
260
Unit
°C
Notes
2
1. Determined according to JEDEC Standard JESD22-A103,
High Temperature Storage Life.
2. Determined according to IPC/JEDEC Standard J-STD-020,
Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices.
4.2 Moisture handling ratings
Symbol
MSL
Description
Moisture sensitivity level
Min.
—
Max.
3
Unit
—
Notes
1
1. Determined according to IPC/JEDEC Standard J-STD-020,
Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices.
4.3 ESD handling ratings
Symbol
V
HBM
V
CDM
I
LAT
Description
Electrostatic discharge voltage, human body model
Electrostatic discharge voltage, charged-device model
Latch-up current at ambient temperature of °C
Min.
–6000
–500
–100
Max.
+6000
+500
+100
Unit
V
V
mA
Notes
1
2
3
1. Determined according to JEDEC Standard JESD22-A114,
Electrostatic Discharge (ESD) Sensitivity Testing Human Body
Model (HBM).
2. Determined according to JEDEC Standard JESD22-C101,
Field-Induced Charged-Device Model Test Method for
Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components.
3. Determined according to JEDEC Standard JESD78D,
IC Latch-up Test.
• Test was performed at 105 °C case temperature (Class II).
• I/O pins pass ±100 mA I-test with I
DD
current limit at 200 mA.
• I/O pins pass +30/-100 mA I-test with I
DD
current limit at 1000 mA.
• Supply groups pass 1.5 Vccmax.
• RESET pin was only tested with negative I-test due to product conditioning requirement.
4.4 Voltage and current operating ratings
Absolute maximum ratings are stress ratings only, and functional operation at the
maxima is not guaranteed. Stress beyond the limits specified in the following table may
affect device reliability or cause permanent damage to the device. For functional
operating conditions, refer to the remaining tables in this document.
This device contains circuitry protecting against damage due to high static voltage or
electrical fields; however, it is advised that normal precautions be taken to avoid
application of any voltages higher than maximum-rated voltages to this high-impedance
KE04 Sub-Family Data Sheet, Rev3, 3/2014.
Freescale Semiconductor, Inc.
5
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