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BR24S32FVJ-WE2

产品描述EEPROM I2C 32K BIT 4K X 8 2.5V/3.3V/5V 8PIN
产品类别存储    存储   
文件大小691KB,共37页
制造商ROHM(罗姆半导体)
官网地址https://www.rohm.com/
标准
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BR24S32FVJ-WE2概述

EEPROM I2C 32K BIT 4K X 8 2.5V/3.3V/5V 8PIN

BR24S32FVJ-WE2规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称ROHM(罗姆半导体)
零件包装代码SOIC
包装说明ROHS COMPLIANT, TSSOP-8
针数8
Reach Compliance Codecompliant
ECCN代码EAR99
Factory Lead Time16 weeks
最大时钟频率 (fCLK)0.4 MHz
数据保留时间-最小值40
耐久性1000000 Write/Erase Cycles
I2C控制字节1010DDDR
JESD-30 代码S-PDSO-G8
长度3 mm
内存密度32768 bit
内存集成电路类型EEPROM
内存宽度8
功能数量1
端子数量8
字数4096 words
字数代码4000
工作模式SYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织4KX8
封装主体材料PLASTIC/EPOXY
封装代码TSSOP
封装等效代码TSSOP8,.19
封装形状SQUARE
封装形式SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
并行/串行SERIAL
峰值回流温度(摄氏度)NOT SPECIFIED
电源1.8/5 V
认证状态Not Qualified
座面最大高度1.1 mm
串行总线类型I2C
最大待机电流0.000002 A
最大压摆率0.002 mA
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)1.7 V
标称供电电压 (Vsup)2.5 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子形式GULL WING
端子节距0.65 mm
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度3 mm
最长写入周期时间 (tWC)5 ms
写保护HARDWARE

文档预览

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Datasheet
Serial EEPROM series Standard EEPROM
I
2
C BUS EEPROM (2-Wire)
BR24Sxxx-W
(8K 16K 32K 64K 128K 256K)
●General
Description
2
BR24Sxxx-W is a serial EEPROM of I C BUS interface method
●Features
2
Completely conforming to the world standard I C
BUS.
All controls available by 2 ports of serial clock
(SCL) and serial data (SDA)
Other devices than EEPROM can be connected to
the same port, saving microcontroller port
1.7V to 5.5V single power source action most suitable
for battery use
FAST MODE 400kHz at 1.7V to 5.5V
Page write mode useful for initial value write at
factory shipment
Highly reliable connection by Au pad and Au wire
Auto erase and auto end function at data rewrite
Low current consumption
At write operation (5V)
: 0.5mA (Typ.)
At read operation (5V)
: 0.2mA (Typ.)
At standby operation (5V) : 0.1μA (Typ.)
Write mistake prevention function
Write (write protect) function added
Write mistake prevention function at low voltage
Data rewrite up to 1,000,000 times
Data kept for 40 years
Noise filter built in SCL / SDA terminal
Shipment data all address FFh
●Packages
W(Typ.) x D(Typ.) x H(Max.)
SOP8
5.00mm x 6.20mm x 1.71mm
TSSOP-B8
3.00mm x 6.40mm x 1.20mm
SOP- J8
4.90mm x 6.00mm x 1.65mm
TSSOP-B8J
3.00mm x 4.90mm x 1.10mm
SSOP-B8
3.00mm x 6.40mm x 1.35mm
MSOP8
2.90mm x 4.00mm x 0.90mm
VSON008X2030
2.00mm x 3.00mm x 0.60mm
●Page
write
Number of pages
Product number
●BR24Sxxx-W
Capacity
8Kbit
16Kbit
32Kbit
64Kbit
128Kbit
256Kbit
Bit
format
1K×8
2K×8
4K×8
8K×8
16K×8
32K×8
Type
BR24S08-W
BR24S16-W
BR24S32-W
BR24S64-W
16Byte
BR24S08-W
BR24S16-W
32Byte
BR24S32-W
BR24S64-W
64Byte
BR24S128-W
BR24S256-W
Power source
voltage
1.7V
to
5.5V
1.7V
to
5.5V
1.7V
to
5.5V
1.7V
to
5.5V
1.7V
to
5.5V
1.7V
to
5.5V
SOP8
SOP-J8
SSOP-B8 TSSOP-B8
MSOP8
TSSOP-B8J
VSON008
X2030
BR24S128-W
BR24S256-W
○Product
structure:Silicon monolithic integrated circuit
www.rohm.com
©2012 ROHM Co., Ltd. All rights reserved.
TSZ22111½14½001
○This
product is not designed protection against radioactive rays
1/33
TSZ02201-0R2R0G100320-1-2
20.AUG.2012 Rev.001

BR24S32FVJ-WE2相似产品对比

BR24S32FVJ-WE2 BR24S64FV-WE2 BR24S32FVT-WE2 BR24S128FVT-WE2 BR24S08FV-WE2 BR24S64FJ-WE2 BR24S256FJ-WE2 BR24S64FVJ-WE2 BR24S32FV-WE2 BR24S128FJ-WE2
描述 EEPROM I2C 32K BIT 4K X 8 2.5V/3.3V/5V 8PIN EEPROM I2C 64K BIT 8K X 8 2.5V/3.3V/5V 8PIN EEPROM IC BUS 32KBIT (4096X8BIT) EEPROM I2C 8K BIT 1K X 8 2.5V/3.3V/5V 8PIN EEPROM IC EEPROM 64KBIT 400KHZ EEPROM I2C BUS 256Kbit 1.7-5.5V Supply EEPROM I2C 64K BIT 8K X 8 2.5V/3.3V/5V 8PIN EEPROM I2C 32K BIT 4K X 8 2.5V/3.3V/5V 8PIN EEPROM I2C BUS 128K BIT 16KX8, 1.7V/5.5V.
是否无铅 不含铅 不含铅 不含铅 不含铅 不含铅 不含铅 不含铅 不含铅 不含铅 不含铅
是否Rohs认证 符合 符合 符合 符合 符合 符合 符合 符合 符合 符合
零件包装代码 SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC
包装说明 ROHS COMPLIANT, TSSOP-8 LSSOP, TSSOP8,.25 ROHS COMPLIANT, TSSOP-8 ROHS COMPLIANT, TSSOP-8 ROHS COMPLIANT, SSOP-8 ROHS COMPLIANT, SOP-8 ROHS COMPLIANT, SOP-8 ROHS COMPLIANT, TSSOP-8 ROHS COMPLIANT, SSOP-8 ROHS COMPLIANT, SOP-8
针数 8 8 8 8 8 8 8 8 8 8
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant compliant compliant compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Factory Lead Time 16 weeks 16 weeks 16 weeks 16 weeks 16 weeks 16 weeks 16 weeks 16 weeks 16 weeks 16 weeks
最大时钟频率 (fCLK) 0.4 MHz 0.4 MHz 0.4 MHz 0.4 MHz 0.4 MHz 0.4 MHz 0.4 MHz 0.4 MHz 0.4 MHz 0.4 MHz
数据保留时间-最小值 40 40 40 40 40 40 40 40 40 40
耐久性 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles
I2C控制字节 1010DDDR 1010DDDR 1010DDDR 1010DDDR 1010DMMR 1010DDDR 1010DDDR 1010DDDR 1010DDDR 1010DDDR
JESD-30 代码 S-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDSO-J8 R-PDSO-J8 S-PDSO-G8 R-PDSO-G8 R-PDSO-J8
长度 3 mm 4.4 mm 4.4 mm 4.4 mm 4.4 mm 4.9 mm 4.9 mm 3 mm 4.4 mm 4.9 mm
内存密度 32768 bit 65536 bit 32768 bit 131072 bit 8192 bit 65536 bit 262144 bit 65536 bit 32768 bit 131072 bit
内存集成电路类型 EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM
内存宽度 8 8 8 8 8 8 8 8 8 8
功能数量 1 1 1 1 1 1 1 1 1 1
端子数量 8 8 8 8 8 8 8 8 8 8
字数 4096 words 8192 words 4096 words 16384 words 1024 words 8192 words 32768 words 8192 words 4096 words 16384 words
字数代码 4000 8000 4000 16000 1000 8000 32000 8000 4000 16000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
组织 4KX8 8KX8 4KX8 16KX8 1KX8 8KX8 32KX8 8KX8 4KX8 16KX8
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TSSOP LSSOP LSSOP LSSOP LSSOP SOJ SOJ TSSOP LSSOP SOJ
封装等效代码 TSSOP8,.19 TSSOP8,.25 TSSOP8,.25 TSSOP8,.25 TSSOP8,.25 SOP8,.25 SOP8,.25 TSSOP8,.19 TSSOP8,.25 SOP8,.25
封装形状 SQUARE RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR SQUARE RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE
并行/串行 SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
电源 1.8/5 V 1.8/5 V 1.8/5 V 1.8/5 V 1.8/5 V 1.8/5 V 1.8/5 V 1.8/5 V 1.8/5 V 1.8/5 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.1 mm 1.25 mm 1.25 mm 1.25 mm 1.5 mm 1.775 mm 1.775 mm 1.1 mm 1.5 mm 1.775 mm
串行总线类型 I2C I2C I2C I2C I2C I2C I2C I2C I2C I2C
最大待机电流 0.000002 A 0.000002 A 0.000002 A 0.000002 A 0.000002 A 0.000002 A 0.000002 A 0.000002 A 0.000002 A 0.000002 A
最大压摆率 0.002 mA 0.002 mA 0.002 mA 0.0025 mA 0.002 mA 0.002 mA 0.0025 mA 0.002 mA 0.002 mA 0.0025 mA
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 1.7 V 1.7 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.7 V 1.8 V 1.8 V
标称供电电压 (Vsup) 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V
表面贴装 YES YES YES YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子形式 GULL WING GULL WING GULL WING GULL WING GULL WING J BEND J BEND GULL WING GULL WING J BEND
端子节距 0.65 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 1.27 mm 1.27 mm 0.65 mm 0.65 mm 1.27 mm
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
宽度 3 mm 3 mm 3 mm 3 mm 3 mm 3.9 mm 3.9 mm 3 mm 3 mm 3.9 mm
最长写入周期时间 (tWC) 5 ms 5 ms 5 ms 5 ms 5 ms 5 ms 5 ms 5 ms 5 ms 5 ms
写保护 HARDWARE HARDWARE HARDWARE HARDWARE HARDWARE HARDWARE HARDWARE HARDWARE HARDWARE HARDWARE
厂商名称 ROHM(罗姆半导体) ROHM(罗姆半导体) ROHM(罗姆半导体) ROHM(罗姆半导体) ROHM(罗姆半导体) ROHM(罗姆半导体) ROHM(罗姆半导体) - ROHM(罗姆半导体) ROHM(罗姆半导体)
Base Number Matches - - 1 1 - 1 1 1 - 1

 
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