Switching Voltage Regulators -5V, Inverting, PWM DC-DC Converter
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | SOIC |
| 包装说明 | PLASTIC, SO-8 |
| 针数 | 8 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| Is Samacsys | N |
| 模拟集成电路 - 其他类型 | SWITCHING REGULATOR |
| 控制模式 | CURRENT-MODE |
| 控制技术 | PULSE WIDTH MODULATION |
| 最大输入电压 | 9 V |
| 最小输入电压 | 2.7 V |
| 标称输入电压 | 5 V |
| JESD-30 代码 | R-PDSO-G8 |
| JESD-609代码 | e0 |
| 长度 | 4.9 mm |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 最大输出电流 | 2 A |
| 标称输出电压 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP8,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 245 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.75 mm |
| 最大供电电流 (Isup) | 3.5 mA |
| 表面贴装 | YES |
| 切换器配置 | BUCK-BOOST |
| 最大切换频率 | 160 kHz |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 3.9 mm |
| Base Number Matches | 1 |
| MAX755ESA | MAX735EPA | MAX735CSA- | MAX735C-D | MAX735CPA- | MAX735CSA | MAX755CSA-T | MAX735MJA | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Switching Voltage Regulators -5V, Inverting, PWM DC-DC Converter | Switching Voltage Regulators 5V- Inverting DC/DC Converter | Switching Voltage Regulators -5V Inverting Current-Mode PWM Regulator | ARM Microcontrollers - MCU | Switching Voltage Regulators 5V- Inverting DC/DC Converter | Switching Voltage Regulators 5V- Inverting DC/DC Converter | Switching Voltage Regulators -5V, Inverting, PWM DC-DC Converter | |
| 是否无铅 | 含铅 | 含铅 | - | - | - | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | - | - | - | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | - | - | - | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
| 零件包装代码 | SOIC | DIP | - | - | - | SOIC | SOIC | DIP |
| 包装说明 | PLASTIC, SO-8 | DIP, DIP8,.3 | - | - | - | SOP, SOP8,.25 | PLASTIC, SO-8 | DIP, DIP8,.3 |
| 针数 | 8 | 8 | - | - | - | 8 | 8 | 8 |
| Reach Compliance Code | not_compliant | not_compliant | - | - | - | not_compliant | not_compliant | not_compliant |
| ECCN代码 | EAR99 | EAR99 | - | - | - | EAR99 | EAR99 | EAR99 |
| 模拟集成电路 - 其他类型 | SWITCHING REGULATOR | SWITCHING REGULATOR | - | - | - | SWITCHING REGULATOR | SWITCHING REGULATOR | SWITCHING REGULATOR |
| 控制模式 | CURRENT-MODE | CURRENT-MODE | - | - | - | CURRENT-MODE | CURRENT-MODE | CURRENT-MODE |
| 控制技术 | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION | - | - | - | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION |
| 最大输入电压 | 9 V | 6.2 V | - | - | - | 6.2 V | 9 V | 6.2 V |
| 最小输入电压 | 2.7 V | 4 V | - | - | - | 4 V | 2.7 V | 4 V |
| 标称输入电压 | 5 V | 5 V | - | - | - | 5 V | 5 V | 5 V |
| JESD-30 代码 | R-PDSO-G8 | R-PDIP-T8 | - | - | - | R-PDSO-G8 | R-PDSO-G8 | R-GDIP-T8 |
| JESD-609代码 | e0 | e0 | - | - | - | e0 | e0 | e0 |
| 湿度敏感等级 | 1 | 1 | - | - | - | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | - | - | - | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | - | - | - | 8 | 8 | 8 |
| 最高工作温度 | 85 °C | 85 °C | - | - | - | 70 °C | 70 °C | 125 °C |
| 最大输出电流 | 2 A | 2 A | - | - | - | 2 A | 2 A | 2 A |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED |
| 封装代码 | SOP | DIP | - | - | - | SOP | SOP | DIP |
| 封装等效代码 | SOP8,.25 | DIP8,.3 | - | - | - | SOP8,.25 | SOP8,.25 | DIP8,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | - | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | IN-LINE | - | - | - | SMALL OUTLINE | SMALL OUTLINE | IN-LINE |
| 峰值回流温度（摄氏度） | 245 | 245 | - | - | - | 245 | 245 | 245 |
| 认证状态 | Not Qualified | Not Qualified | - | - | - | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.75 mm | 4.572 mm | - | - | - | 1.75 mm | 1.75 mm | 5.08 mm |
| 最大供电电流 (Isup) | 3.5 mA | 3 mA | - | - | - | 3 mA | 3.5 mA | 3 mA |
| 表面贴装 | YES | NO | - | - | - | YES | YES | NO |
| 切换器配置 | BUCK-BOOST | BUCK-BOOST | - | - | - | BUCK-BOOST | BUCK-BOOST | BUCK-BOOST |
| 最大切换频率 | 160 kHz | 160 kHz | - | - | - | 160 kHz | 160 kHz | 160 kHz |
| 技术 | CMOS | CMOS | - | - | - | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | - | - | - | COMMERCIAL | COMMERCIAL | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | THROUGH-HOLE | - | - | - | GULL WING | GULL WING | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 2.54 mm | - | - | - | 1.27 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | - | - | - | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | - | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 3.9 mm | 7.62 mm | - | - | - | 3.9 mm | 3.9 mm | 7.62 mm |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
