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SURHD8560W1T4G

产品描述USB Interface IC USB 2.0 to Quad SPI I2C Bridge 53.8Mbps
产品类别分立半导体    二极管   
文件大小109KB,共5页
制造商ON Semiconductor(安森美)
官网地址http://www.onsemi.cn
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SURHD8560W1T4G概述

USB Interface IC USB 2.0 to Quad SPI I2C Bridge 53.8Mbps

SURHD8560W1T4G规格参数

参数名称属性值
Brand NameON Semiconductor
是否无铅不含铅
厂商名称ON Semiconductor(安森美)
包装说明R-PSSO-G2
针数3
制造商包装代码369C
Reach Compliance Codenot_compliant
ECCN代码EAR99
Factory Lead Time4 weeks
Is SamacsysN
其他特性FREE WHEELING DIODE
应用ULTRA FAST RECOVERY POWER
外壳连接CATHODE
配置SINGLE
二极管元件材料SILICON
二极管类型RECTIFIER DIODE
最大正向电压 (VF)2.7 V
JESD-30 代码R-PSSO-G2
JESD-609代码e3
湿度敏感等级1
最大非重复峰值正向电流50 A
元件数量1
相数1
端子数量2
最高工作温度175 °C
最低工作温度-65 °C
最大输出电流5 A
封装主体材料PLASTIC/EPOXY
封装形状RECTANGULAR
封装形式SMALL OUTLINE
峰值回流温度(摄氏度)NOT SPECIFIED
参考标准AEC-Q101
最大重复峰值反向电压600 V
最大反向电流10 µA
最大反向恢复时间0.03 µs
表面贴装YES
端子面层Tin (Sn)
端子形式GULL WING
端子位置SINGLE
处于峰值回流温度下的最长时间NOT SPECIFIED
Base Number Matches1

文档预览

下载PDF文档
MURHD560T4G,
SURHD8560T4G,
MURHD560W1T4G,
SURHD8560W1T4G,
SURHD8560T4G-VF01
Power Rectifier
Features and Benefits
www.onsemi.com
Ultrafast 30 Nanosecond Recovery Times
175°C Operating Junction Temperature
High Temperature Glass Passivated Junction
High Voltage Capability to 600 Volts
SURHD8 Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Applications
ULTRAFAST RECTIFIER
5.0 AMPERES
600 VOLTS
DPAK
CASE 369C
STYLES 3, 8
1
4
3
STYLE 3
1
4
3
STYLE 8
MARKING DIAGRAMS
AYWW
UH560G
STYLE 3
UH560
560W1
A
Y
WW
G
AYWW
560W1G
STYLE 8
= MURHD560T4
= MURHD560W1T4
= Assembly Location
= Year
= Work Week
= Pb−Free Package
Power Supplies
Inverters
Free Wheeling Diodes
Mechanical Characteristics
Case: Epoxy, Molded
Epoxy Meets UL 94 V−0 @ 0.125 in
Weight: 0.4 g (approximately)
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
Lead Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
ESD Ratings:
Machine Model = C (> 400 V)
Human Body Model = 3B (> 8000 V)
* The Assembly Location code (A) is front side
optional. In cases where the Assembly Location is
stamped in the package bottom (molding ejecter
pin), the front side assembly code may be blank.
ORDERING INFORMATION
Device
MURHD560T4G
SURHD8560T4G
MURHD560W1T4G
SURHD8560W1T4G
SSURHD8560W1T4G
SSURHD8560T4G−
VF01
Package
DPAK
(Pb−Free)
DPAK
(Pb−Free)
DPAK
(Pb−Free)
DPAK
(Pb−Free)
DPAK
(Pb−Free)
DPAK
(Pb−Free)
Shipping
2,500 /
Tape & Reel
2,500 /
Tape & Reel
2,500 /
Tape & Reel
2,500 /
Tape & Reel
2,500 /
Tape & Reel
2,500 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
©
Semiconductor Components Industries, LLC, 2016
June, 2017
Rev. 10
1
Publication Order Number:
MURHD560/D

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