Resistors
High Surge Film
TM
Surface Mount Metal Glaze
HSF
High Surge
HSF Series
Film
Surface Mount Metal Glaze
TM
150°C maximum operating temperature
RoHS - compatible components available
Up to triple the surge rating of the rugged CHP1
•
1 Watt and 1/2 Watt power rating
•
Replaces costly surface-mount wirewound resistors
150°C maximum operating temperature
•
RoHS - Compatible Components Available
•
Up to triple the surge rating of the rugged CHP1
•
Replaces costly surface-mount wirewound resistors
Metal Glaze
TM
lm element
red at 1000˚C
to solid ceramic
Metal Glaze
TM
thick film element
fired at 1000°C
to solid ceramic
High
temperature
dielectric
coating
Solder over
nickel barrier
All Pb-free parts comply with
Solder over
nickel barrier
High
temperature
dielectric
EU
coating
Directive 2011/65/EU
(RoHS2)
Electrical Data
Industry
Footprint
2512
3612
Type
HSF-1
HSF-2
Maximum
Power Rating
1W @ 70°C
2W @ 25°C
Working
Voltage
350
500
Resistance
Range (Ω)
5R9, 6R8, 11R, 27R,
12R, 68R, 270R
8R2, 22R, 300R
Tolerance
(±%)
10
10
TCR
(ppm/°C)
±200
1
Product
Category
High Surge
High Surge
±200
1
Note 1 – Standard TCR is ±200ppm/°C. TCR of ±100ppm/°C is available at selected values on request.
Environmental Data
Characteristics
Temperature Coefficient
Thermal Shock
Low Temperature Operation
Short Time Overload
High Temperature Exposure
Resistance to Bonding
Exposure
Solderability
Moisture Resistance
Life Test
Terminal Adhesion Strength
Resistance to Board bending
Maximum Change
As specified
±0.5% +0.01 ohm
±0.25% +0.01 ohm
±0.5% +0.01 ohm
±0.5% +0.01 ohm
±0.25% +0.01 ohm
95% min. coverage
±0.5% +0.01 ohm
±0.5% +0.01 ohm
Test Method
MIL-R-55342H Par 4.7.9 (-55°C +125°C)
MIL-R-55342H Par 4.7.3 (-65°C +150°C, 5 cycles)
MIL-R-55342H Par 4.7.4 (-65°C @ working voltage)
MIL-R-55342H Par 4.7.5
2.5 x
√
P x R
for 5 seconds
MIL-R-55342H Par 4.7.6 (+150°C for 100 hours)
MIL-R-55342H Par 4.7.7
(reflow soldered to board at 260°C for 10 seconds)
MIL-STD-202, Method 208 (245°C for 5 seconds)
MIL-R-55342H Par 4.7.8 (10 cycles, total 240 hours)
MIL-R-55342H Par 4.7.10 (2000 hours at 70°C intermittent)
±1% +0.01 ohm
1200 gram push from underside of mounted chip for 60 seconds
no mechanical damage
Chip mounted in center of 90mm long board, deflected 5mm so
±1% +0.01 ohm
no mechanical damage as to exert pull on chip contacts for 10 seconds
General Note
TT
reserves the
reserves the right
in
make
specification
product specification
IRC
Electronics
right to make changes
to
product
changes in
without notice or liability.
without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
Wire and Film Technologies Division
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
© TT Electronics plc
General Note
BI Technologies IRC Welwyn
www.ttelectronicsresistors.com
TT electronics plc
HSF-1 Series Issue October 2010 Sheet 1 of 4
A subsidiary of
04.16
High Surge Film
Surface
Surge
Metal Glaze™
High
Mount
Film
HSF Series
Surface Mount Metal Glaze
TM
HSF
Physical Data
L
C
W
Dimensions (Inches and (mm))
Industry
Footprint
2512
3612
Type
HSF-1
HSF-2
L
(Length)
0.251 ± 0.010
(6.38 ± 0.25)
0.367 ± 0.010
(9.32 ± 0.25)
W
(Width/Diameter)
0.079 ± 0.006
(2.01 ± 0.15)
0.105 ± 0.006
(2.67 ± 0.15)
C
(Termination Width)
0.040 ± 0.010
(1.02 ± 0.25)
0.050 ± 0.010
(1.27 ± 0.25)
Recommended Solder Pad Dimensions (Reflow):
F
A
C
A
B
E
D
Industry
Footprint
HSF 1
HSF 2
2512
3610
Dimensions (Inches and mm))
A
0.121
(3.07)
0.17
(4.32)
B
0.126
(3.20)
0.16
(4.06)
C
0.127
(3.23)
0.213
(5.41)
D
0.183
(4.65)
0.273
(6.93)
E
0.040
(1.02)
0.044
(1.12)
F
0.369
(9.37)
0.553
(14.05)
Wire and Film Technologies Division
• 4222 South Staples Street • Corpus Christi
Texas
78411 USA
Telephone:
361 992 7900 •
Facsimile:
361 992 3377 •
Website:
www.irctt.com
HSF-1 Series Issue October 2010 Sheet 2 of 4
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC Welwyn
www.ttelectronicsresistors.com
© TT Electronics plc
04.16
HSF
Film
High Surge
High Surge
Metal Glaze™
Surface Mount
Film
Surface Mount Metal Glaze
TM
HSF Series
IRC Solder Reflow Recommendations
Sn-Pb Eutectic and Pb-Free Reflow Profiles
t
P
T
P
Ramp-up
Critical Zone
T
L
to T
P
T
L
Temperature
T
smax
T
smin
t
s
Preheat
t
L
Ramp-down
25
t 25°C to Peak
Time
* Based on Industry Standards and IPC recommendations
Profile Feature
Average Ramp-up rate (Tsmax to Tp)
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (Tsmin to Tsmax) (ts)
Time maintained above
- Temperature (TL)
- Time (tL)
Peak Temperature (TP)
Ramp-down Rate
Time 25°C to Peak Temperature
Time within 5°C of actual Peak Temperature (tp)2
Sn-Pb Eutectic
Assembly
3°C / second max.
100°C
150°C
60 -120 seconds
183°C
60 - 150 seconds
See Table 1
10 - 30 seconds
6°C / second max.
6 minutes max.
Pb-Free
Assembly
3°C / second max.
150°C
200°C
60 -180 seconds
217°C
60 - 150 seconds
See Table 2
20 - 40 seconds
6°C / second max.
8 minutes max.
Note 1:
All temperatures refer
to topside of the package,
measured on the package
body surface.
Note 2:
Time within 5 °C of
actual peak temperature (tp)
specied for the reow proles
is a “supplier” minimum and a
“user” maximum.
Tabel 1: SnPb Eutectic Process -
Package Peak Reflow Temperatures
Package
Thickness
< 2.5 mm
≥
2.5 mm
Volume mm3 < 350
240 +0/-5°C
225 +0/-5°C
Volume mm3
≥
350
225 +0/-5°C
225 +0/-5°C
Note 1:
Package volume excludes external
terminals (balls, bumps, lands, leads) and/or
non-integral heat sinks.
Note 2:
The maximum component temperature
reached during reow depends on package
thickness and volume. The use of convection
reow processess reduces the thermal gradients
between packages. However, thermal gradients
due to differences in thermal mass of SMD pack-
ages may still exist.
Note 3:
Components intended for use in “lead-
free” assembly process shall be evaluated using
the “lead-free” peak temperature and proles
dened in Table 1, 2 and reow prole whether
or not lead-free.
Tabel 2: Pb-free Process -
Package Peak Reflow Temperatures
Package
Thickness
< 1.6 mm
1.6 mm - 2.5 mm
≥
2.5 mm
Volume mm3
< 350
260°C *
260°C *
250°C *
Volume mm3
350 - 2000
260°C *
250°C *
245°C *
Volume mm3
> 2000
260°C *
245°C *
245°C *
* Tolerance: The device manufacturer/supplier shall assure process compat-
ibility up to and including the stated classication temperature at the rated MSL
level.
Wire and Film Technologies Division
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC Welwyn
www.ttelectronicsresistors.com
HSF-1 Series Issue October 2010 Sheet 3 of 4
© TT Electronics plc
04.16
HSF
Film
High Surge
High Surge
Metal Glaze™
Surface Mount
Film
HSF Series
Surface Mount Metal Glaze
TM
Surge Capability Data
for Non-repetitive or Low Repetition Rate Surges
2512 CHP, HSF SURGE CAPABILITY
1000000
For Non-repetitive or Low Repetitive Rate Surges on HSF-1
1,000,000
100,000
100000
Peak Power (watts)
10,000
1,000
100
Peak Power (Watts)
10000
1000
100
10
1
1.E-09
10
Note:
1.E-08
1.E-07
1.0E-08
1.0E-07
1.E-06
1.0E-06
1.E-05
1.0E-05
1.E-04
1.0E-04
1.E-03
1.0E-03
1.E-02
1.0E-02
1.E-01
1.0E-01
1.E+00
1.0E+00
1
1.0E-09
Surge or Pulse Duration (seconds)
Surge or Pulse Duration (Seconds)
Use for low repetitive pulses where the average power
dissipation is not to exceed the component rating at 70°C.
Surge handling capacity for low-repetitive surges may be
significantly greater than shown above. Contact factory
Power Derating Curve
100
Percent of Rated Power
80
60
40
20
0
0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150
Ambient Temperature (C)
Ordering Data
Sample Part No.
Type
HSF-1
200
11R0
K
LF
13
HSF-1 or HSF-2
Temperature Coefficient
200 = ±200ppm/°C (standard)
Note – Standard TCR is ±200ppm/°C. TCR of ±100ppm/°C is available at
selected values on request.
Resistance Value
Tolerance
K = 10%
Standard 4-digit resistance code.
Lead-Free Construction
Packaging Code
BLK = Bulk, 7 = 7" Reel, 13 = 13" Reel
Wire and Film Technologies Division
• 4222 South Staples Street • Corpus Christi
Texas
78411 USA
Telephone:
361 992 7900 •
Facsimile:
361 992 3377 •
Website:
www.irctt.com
HSF-1 Series Issue October 2010 Sheet 4 of 4
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC Welwyn
www.ttelectronicsresistors.com
© TT Electronics plc
04.16
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