MADP-007224-01072T
Features
Rectangular MELF SMQ
Hermetically Sealed
Low Loss
Low Distortion
High Isolation
Passivated PIN Diode Chips
Full Face Bonds
Ultra Low Non-Magnetic Packages
Suitable for MRI Applications
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High Power Handling Capability
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Non Magnetic MELF PIN Diode
The MADP-007224-01072T is a square, surface mountable, PIN diode in a metal electrode leadless faced (MELF)
package. It utilizes M/A-COM’s HIPAX technology to produce a low inductance ceramic package with no ribbons or
whisker wires. The package is hermetically sealed at temperatures exceeding 300°C and is plated using M/A-COM’s new
ultra low magnetic plating process. The end result is a package with extremely low magnetic permeability. Incorporated in
the package is a passivated PIN diode chip that is full face bonded to refractory metal pins on both the cathode and anode
of the chip. The end product is a device which has a very low resistance, low loss and high power handling capability. The
mechanical and electrical properties of these devices make them ideally suited for MRI transmitters, receivers and surface
coils. The MADP-007224-01072 has been comprehensively characterized both electrically and mechanically to ensure
predictable performance.
Applications
The diodes are designed specifically for use as a low loss, low distortion, high power switching element in a high magnetic
field at HF and UHF frequencies. Its high power rating provides superior performance at high RF power levels and is
designed to meet the most stringent electrical and mechanical requirements of MRI equipment.
Designed for Automated Assembly
These SMQ PIN diodes are designed for high volume tape and reel assembly. The rectangular package design makes
automatic pick and place, indexing and assembly extremely easy. The parallel flat surfaces are suitable for key jaw or
vacuum pickup techniques. All solderable surfaces are tin plated and compatible with reflow and vapor phase RoHS
soldering methods.
RoHS Statement
The MADP-007224-01072T is RoHS compliant, meaning it does not contain the maximum concentration of 0.1% by
weight in homogenous materials for lead, hex chrome, mercury, PBB, PBDE, and 0.01% for cadmium.
Environmental Capability
The MADP-007224-01072T devices are capable of meeting the environmental and mechanical requirements set forth in
MIL-STD-750, MIL-STD-202 as well as other military standards. The table below lists some of the typical MIL-STD 750
tests the device is designed to meet.
MIL-STD-750
Test
High Temp. Storage
Temp. Shock
HTRB
Moisture Resistance
Fine Leak
Constant Acceleration
Vibration Fatigue
Solderability
Method
1031
1051
1038
1021
1071 Cond. H
2006
2046
2026
1 X 10-7 CC/Sec
20,000 G's
20,000 G's
+175C, 250 Hours
-65C to +175C 20 Cycles
80% of rated V
B,
+150C, 96 Hours
Description
Description
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