GBPC12, 15, 25 and 35
Vishay Semiconductors
formerly General Semiconductor
Glass Passivated Single-Phase
Bridge Rectifier
Reverse Voltage
50 and 1000V
Forward Current
12 to 35A
GBPC-W
1.135 (28.8)
Hole for
#10 Screw
0.220 (5.59)
DIA.
0.200 (5.08)
1.115 (28.3)
Hole for
#10 Screw
0.220 (5.59)
DIA.
0.200 (5.08)
GBPC
1.135 (28.8)
1.115 (28.3)
0.672 (17.1)
0.632 (16.1)
AC
0.732 (18.6)
0.692 (17.6)
0.24 (6.0)
0.18 (4.6)
1.135 (28.8)
1.115 (28.3)
0.732 (18.6)
0.692 (17.6)
1.135 (28.8)
1.115 (28.3)
0.672 (17.1)
0.632 (16.1)
0.582 (14.8)
0.542 (13.8)
0.24 (6.0)
0.18 (4.6)
0.470 (11.9)
0.430 (10.9)
0.50 (12.7)
0.44 (11.7)
0.732 (18.6)
0.692 (17.6)
0.042 (1.07)
0.038 (0.97)
DIA.
1.25
(31.8)
MIN.
0.310 (7.62)
0.290 (7.36)
0.094 (2.4)
DIA.
0.034 (0.86)
0.030 (0.76)
0.25
(6.35)
0.840 (21.3)
0.740 (18.8)
0.310 (7.62)
0.290 (7.36)
Dimensions in inches and (millimeters)
Mechanical Data
Case:
Molded plastic with heatsink integrally mounted in
the bridge encapsulation
Terminals:
Either plated 0.25” (6.35mm) Faston lugs or
plated copper leads 0.040” (1.02mm) diameter. Suffix letter
“W” added to indicate wire leads (e.g. GBPC12005W)
Mounting Position:
See
NOTE 2
Features
• Plastic package has Underwriters Laboratory
Flammability Classification 94V-0
• This series is UL listed under the Recognized
Component Index, file number E54214
• Integrally molded heatsink provides very low thermal
resistance for maximum heat dissipation
• Universal 3-way terminals; snap-on, wire wrap-around,
or P.C.B. mounting
• High forward surge current capability
• Glass passivated chip junctions
• Typical I
R
less than 0.3µA
• High temperature soldering guaranteed:
260°C/10 seconds at 5lbs. (2.3kg) tension
Polarity:
Polarity symbols molded on body
Mounting Torque:
20 in. - lb. max.
Weight:
0.53 ounce, 15 grams
Packaging codes/options:
1/100 EA. per Bulk Box
Document Number 88612
13-Feb-02
www.vishay.com
1
GBPC12, 15, 25 and 35
Vishay Semiconductors
formerly General Semiconductor
Maximum Ratings and Thermal Characteristics
(T
Symbols
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward
rectified output current
(See Fig.1)
A
= 25°C unless otherwise noted)
GBPC12, 15, 25, 35
005
50
35
50
01
100
70
100
02
200
140
200
04
400
280
400
12
15
25
35
200
300
300
400
160
375
375
660
2500
1.9
1.4
-55 to +150
06
600
420
600
08
800
560
800
10
1000
700
1000
Units
V
V
V
V
RRM
V
RMS
V
DC
GBPC12
GBPC15
GBPC25
GBPC35
GBPC12
GBPC15
GBPC25
GBPC35
GBPC12
GBPC15
GBPC25
GBPC35
(1)
I
F(AV)
A
Peak forward surge current single
sine-wave superimposed on
rated load (JEDEC Method)
Rating (non-repetitive, for t
greater than 1ms and less
than 8.3ms) for fusing
I
FSM
A
I
2
t
A
2
sec
RMS isolation voltage from case to leads
Typical thermal resistance per leg
GBPC12-25
GBPC35
V
ISO
R
ΘJC
T
J
, T
STG
V
°C/W
°C
Operating junction storage temperature range
Electrical Characteristics
Ratings at 25°C ambient temperature unless otherwise specified.
GBPC12, 15, 25, 35
Symbols
Maximum instantaneous
forward voltage drop per
leg at
GBPC12
GBPC15
GBPC25
GBPC35
I
F
=6.0A
I
F
=7.5A
I
F
=12.5A
I
F
=17.5A
005
01
02
04
06
08
10
Units
V
F
1.1
V
Maximum reverse DC current at rated T
A
=25°C
DC blocking voltage per leg
T
A
=125°C
Typical junction capacitance per leg
at
I
R
C
J
5.0
500
300
µA
pF
4V, 1MH
Z
Notes:
(1) Thermal resistance from junction to case per leg
(2) Bolt down on heatsink with silicone thermal compound between bridge and mounting surface for maximum heat transfer with #10 screw
www.vishay.com
2
Document Number 88612
13-Feb-02
GBPC12, 15, 25 and 35
Vishay Semiconductors
formerly General Semiconductor
Ratings and
Characteristic Curves
(T
A
= 25°C unless otherwise noted)
Fig. 1 — Maximum Output
Rectified Current
40
Fig. 2 — Maximum Output
Rectified Current
40
Average Forward Current (A)
Average Forward Current (A)
35
30
25
20
15
10
5
0
0
60 H
Z
Resistive or
Inductive Load
25
50
75
Bridges Mounted on
9.5 x 3.5 x 4.6"
(22.9 x 8.9 x 11.7cm)
AL. Finned Plate
5 x 6 x 4.9"
AL, Finned Plate
5 x 4 x 3"
AL. Finned Plate
6 x 2.2 x 2.2"
AL. Finned Plate
35
30
25
20
15
10
GBPC35
RthS-A = 0.5°C/W
60 H
Z
Resistive or
Inductive Load
GBPC25
RthS-A = 0.5°C/W
GBPC15
RthS-A = 1.0°C/W
GBPC12
5
RthS-A = 1.0°C/W
0
0
10
20
30
40
50
60
70
80
90
100
100
125
150
175
200
Case Temperature (°C)
Ambient Temperature (°C)
Fig. 3 — Maximum Power Dissipation
Average Power Dissipation of Bridge (W)
80
70
60
50
40
30
20
10
0
0
10
20
30
40
Resistive or
Inductive Load
T
J
= T
J
max.
Capacitive Load
Fig. 4 — Maximum Non-Repetitive
Peak Forward Surge Current Per Leg
500
Peak Forward Surge Current (A)
T
J
= T
J
max.
0.5 Single Sine-Wave
(JEDEC Method)
GBPC35
100
GBPC15
GBPC25
1.0 Cycle
GBPC12
1
10
100
Average Output Current (A)
Number of Cycles at 60 H
Z
Document Number 88612
13-Feb-02
www.vishay.com
3
GBPC12, 15, 25 and 35
Vishay Semiconductors
formerly General Semiconductor
Ratings and
Characteristic Curves
(T
A
= 25°C unless otherwise noted)
Fig. 5 — Typical Instantaneous
Forward Characteristics Per Leg
100
Fig. 6 — Typical Reverse Leakage
Characteristics Per Leg
Instantaneous Reverse Leakage
Current (µA)
100
T
J
= 125°C
T
J
= 150°C
10
Instantaneous Forward Current (A)
10
T
J
= 25°C
Pulse Width = 300µs
1% Duty Cycle
1
1
50 - 400V
600 - 1000V
T
J
= 25°C
0.1
0.1
0.01
0.4
0.01
0.6
0.8
1
1.2
1.4
1.6
0
20
40
60
80
100
Instantaneous Forward Voltage (V)
Percent of Rated Peak Reverse Voltage (V)
Fig. 7 — Typical Junction
Capacitance Per Leg
600
1,000
Fig. 8 — Typical Transient
Thermal Impedance Per Leg
Transient Thermal Impedance (°CW)
T
J
= 25°C
f = 1.0MH
Z
Vsig = 50MVp-p
Junction Capacitance (pF)
T
J
= 25°C
f = 1.0MH
Z
Vsig = 50MVp-p
100
10
100
50
1
10
100
1
0.01
0.1
1
10
100
Reverse Voltage (V)
t, Heating Time, sec.
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4
Document Number 88612
13-Feb-02
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