| 型号 |
MAX706TEUA-T |
MAX706TCPA |
MAX706TCPA- |
MAX706TCSA |
MAX706TCSA- |
MAX706TCSA-T |
MAX706TCUA- |
MAX706TCUA-T |
MAX706TEPA- |
MAX706TEUA |
| 描述 |
Supervisory Circuits +3V Voltage Monitoring, Low-Cost, P Supervisory Circuits |
Supervisory Circuits |
8-bit Microcontrollers - MCU 448B FL 32B RAM 4I/O 8bit ADC 2.3-5.5V |
Supervisory Circuits +3V Voltage Monitoring, Low-Cost, P Supervisory Circuits |
Multilayer Ceramic Capacitors MLCC - SMD/SMT 50V 1uF X7R 0805 10% |
Supervisory Circuits +3V Voltage Monitoring, Low-Cost, P Supervisory Circuits |
Supervisory Circuits Single uPower Supervisor |
Supervisory Circuits Single uPower Supervisor |
Switching Voltage Regulators |
Supervisory Circuits +3V Voltage Monitoring, Low-Cost, P Supervisory Circuits |
| 是否无铅 |
含铅 |
含铅 |
- |
含铅 |
- |
含铅 |
- |
含铅 |
- |
含铅 |
| 是否Rohs认证 |
不符合 |
不符合 |
- |
不符合 |
- |
不符合 |
- |
不符合 |
- |
不符合 |
| 厂商名称 |
Maxim(美信半导体) |
Maxim(美信半导体) |
- |
Maxim(美信半导体) |
- |
Maxim(美信半导体) |
- |
Maxim(美信半导体) |
- |
Maxim(美信半导体) |
| 零件包装代码 |
TSSOP |
DIP |
- |
SOIC |
- |
SOIC |
- |
TSSOP |
- |
TSSOP |
| 包装说明 |
MO-187CAA, MICRO, MAX, PACKAGE-8 |
0.300 INCH, PLASTIC, MS-001AB, DIP-8 |
- |
0.150 INCH, MS-012AA, SOP-8 |
- |
0.150 INCH, MS-012AA, SOP-8 |
- |
MO-187CAA, MICRO, MAX, PACKAGE-8 |
- |
MO-187CAA, MICRO, MAX, PACKAGE-8 |
| 针数 |
8 |
8 |
- |
8 |
- |
8 |
- |
8 |
- |
8 |
| Reach Compliance Code |
not_compliant |
not_compliant |
- |
not_compliant |
- |
not_compliant |
- |
not_compliant |
- |
not_compliant |
| ECCN代码 |
EAR99 |
EAR99 |
- |
EAR99 |
- |
EAR99 |
- |
EAR99 |
- |
EAR99 |
| 其他特性 |
WATCHDOG TIMER, MANUAL RESET, POWER FAIL COMPARATOR |
WATCHDOG TIMER, MANUAL RESET, POWER FAIL COMPARATOR |
- |
WATCHDOG TIMER, MANUAL RESET, POWER FAIL COMPARATOR |
- |
WATCHDOG TIMER, MANUAL RESET, POWER FAIL COMPARATOR |
- |
WATCHDOG TIMER, MANUAL RESET, POWER FAIL COMPARATOR |
- |
WATCHDOG TIMER, MANUAL RESET, POWER FAIL COMPARATOR |
| 可调阈值 |
NO |
NO |
- |
NO |
- |
NO |
- |
NO |
- |
NO |
| 模拟集成电路 - 其他类型 |
POWER SUPPLY MANAGEMENT CIRCUIT |
POWER SUPPLY MANAGEMENT CIRCUIT |
- |
POWER SUPPLY MANAGEMENT CIRCUIT |
- |
POWER SUPPLY MANAGEMENT CIRCUIT |
- |
POWER SUPPLY MANAGEMENT CIRCUIT |
- |
POWER SUPPLY MANAGEMENT CIRCUIT |
| JESD-30 代码 |
S-PDSO-G8 |
R-PDIP-T8 |
- |
R-PDSO-G8 |
- |
R-PDSO-G8 |
- |
S-PDSO-G8 |
- |
S-PDSO-G8 |
| JESD-609代码 |
e0 |
e0 |
- |
e0 |
- |
e0 |
- |
e0 |
- |
e0 |
| 长度 |
3 mm |
9.375 mm |
- |
4.9 mm |
- |
4.9 mm |
- |
3 mm |
- |
3 mm |
| 湿度敏感等级 |
1 |
1 |
- |
1 |
- |
1 |
- |
1 |
- |
1 |
| 信道数量 |
1 |
1 |
- |
1 |
- |
1 |
- |
1 |
- |
1 |
| 功能数量 |
1 |
1 |
- |
1 |
- |
1 |
- |
1 |
- |
1 |
| 端子数量 |
8 |
8 |
- |
8 |
- |
8 |
- |
8 |
- |
8 |
| 最高工作温度 |
85 °C |
70 °C |
- |
70 °C |
- |
70 °C |
- |
70 °C |
- |
85 °C |
| 封装主体材料 |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
- |
PLASTIC/EPOXY |
- |
PLASTIC/EPOXY |
- |
PLASTIC/EPOXY |
- |
PLASTIC/EPOXY |
| 封装代码 |
TSSOP |
DIP |
- |
SOP |
- |
SOP |
- |
TSSOP |
- |
TSSOP |
| 封装等效代码 |
TSSOP8,.19 |
DIP8,.3 |
- |
SOP8,.25 |
- |
SOP8,.25 |
- |
TSSOP8,.19 |
- |
TSSOP8,.19 |
| 封装形状 |
SQUARE |
RECTANGULAR |
- |
RECTANGULAR |
- |
RECTANGULAR |
- |
SQUARE |
- |
SQUARE |
| 封装形式 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
IN-LINE |
- |
SMALL OUTLINE |
- |
SMALL OUTLINE |
- |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
- |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度(摄氏度) |
NOT SPECIFIED |
245 |
- |
245 |
- |
245 |
- |
245 |
- |
245 |
| 电源 |
3.3/5 V |
5 V |
- |
5 V |
- |
3.3/5 V |
- |
3.3/5 V |
- |
3.3/5 V |
| 认证状态 |
Not Qualified |
Not Qualified |
- |
Not Qualified |
- |
Not Qualified |
- |
Not Qualified |
- |
Not Qualified |
| 座面最大高度 |
1.1 mm |
4.572 mm |
- |
1.75 mm |
- |
1.75 mm |
- |
1.1 mm |
- |
1.1 mm |
| 最大供电电流 (Isup) |
0.5 mA |
0.35 mA |
- |
0.35 mA |
- |
0.35 mA |
- |
0.35 mA |
- |
0.5 mA |
| 最大供电电压 (Vsup) |
5.5 V |
5.5 V |
- |
5.5 V |
- |
5.5 V |
- |
5.5 V |
- |
5.5 V |
| 最小供电电压 (Vsup) |
1.2 V |
1 V |
- |
1 V |
- |
1 V |
- |
1 V |
- |
1.2 V |
| 标称供电电压 (Vsup) |
3 V |
3 V |
- |
3 V |
- |
3 V |
- |
3 V |
- |
3 V |
| 表面贴装 |
YES |
NO |
- |
YES |
- |
YES |
- |
YES |
- |
YES |
| 技术 |
CMOS |
CMOS |
- |
CMOS |
- |
CMOS |
- |
CMOS |
- |
CMOS |
| 温度等级 |
INDUSTRIAL |
COMMERCIAL |
- |
COMMERCIAL |
- |
COMMERCIAL |
- |
COMMERCIAL |
- |
INDUSTRIAL |
| 端子面层 |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
- |
Tin/Lead (Sn/Pb) |
- |
Tin/Lead (Sn/Pb) |
- |
Tin/Lead (Sn/Pb) |
- |
Tin/Lead (Sn/Pb) |
| 端子形式 |
GULL WING |
THROUGH-HOLE |
- |
GULL WING |
- |
GULL WING |
- |
GULL WING |
- |
GULL WING |
| 端子节距 |
0.65 mm |
2.54 mm |
- |
1.27 mm |
- |
1.27 mm |
- |
0.65 mm |
- |
0.65 mm |
| 端子位置 |
DUAL |
DUAL |
- |
DUAL |
- |
DUAL |
- |
DUAL |
- |
DUAL |
| 处于峰值回流温度下的最长时间 |
NOT SPECIFIED |
NOT SPECIFIED |
- |
NOT SPECIFIED |
- |
NOT SPECIFIED |
- |
NOT SPECIFIED |
- |
NOT SPECIFIED |
| 宽度 |
3 mm |
7.62 mm |
- |
3.9 mm |
- |
3.9 mm |
- |
3 mm |
- |
3 mm |