器件名 | 厂商 | 描 述 | 功能 |
---|---|---|---|
GT24-B7016 | ETC2 | Best 1U dual-socket SMP server implementation for HPC and enterprise virtualization applications | 下载 |
GT24-B7066 | ETC2 | Cost-effective 1U Dual-Socket Server Implementation for Server Applications | 下载 |
GT24-B7067 | ETC2 | RACK-OPTIMIZED 1U Dual-Socket Server Implementation for Server | 下载 |
GT24-B8226 | ETC2 | Best 1U dual-socket SMP server implementation with high power-efficiency and overall performance | 下载 |
GT24-B8236-IL | ETC2 | Best 1U dual-socket SMP server implementation for HPC and enterprise virtualization applications | 下载 |
GT24C01-2GLI-TR | 聚辰(Giantec) | UVPROM, 128X8, 35ns, CMOS, PDSO8, 0.150 INCH, GREEN, SOP-8 | 下载 |
GT24C01-2GLI-TR | e2v technologies | IC 32K X 8 UVPROM, 35 ns, CQCC32, CERAMIC, LCC-32, Programmable ROM | 下载 |
GT24C01-2ZLI-TR | 聚辰(Giantec) | EEPROM, 128X8, Serial, CMOS, PDSO8, 3 X 4.40 MM, LEAD FREE, MO-153, TSSOP-8 | 下载 |
GT24C02 | 聚辰(Giantec) | GT24C02 2K ,I | 下载 |
GT24C02-2GLI-TR | 聚辰(Giantec) | EEPROM, 256X8, Serial, CMOS, PDSO8, 0.150 INCH, LEAD FREE, SOIC-8 | 下载 |
GT24C02-2PLI | 聚辰(Giantec) | EEPROM, 256X8, Serial, CMOS, PDIP8, | 下载 |
GT24C02-2SLI-TR | 聚辰(Giantec) | EEPROM, 256X8, Serial, CMOS, PDSO8, 0.120 INCH, GREEN, MO-187, MSOP-8 | 下载 |
GT24C02-2TLI-TR | 聚辰(Giantec) | EEPROM, | 下载 |
GT24C02-2UDLI-TR | 聚辰(Giantec) | EEPROM, 256X8, Serial, CMOS, PDSO8, 2 X 3 MM, 0.75 MM HEIGHT, LEAD FREE, MO-229, DFN-8 | 下载 |
GT24C02-2ZLI-TR | 聚辰(Giantec) | EEPROM, 256X8, Serial, CMOS, PDSO8, 3 X 4.40 MM, LEAD FREE, MO-153, TSSOP-8 | 下载 |
GT24C02-3SLA1-TR | 聚辰(Giantec) | EEPROM, | 下载 |
GT24C02-3UDLA1-TR | 聚辰(Giantec) | EEPROM, | 下载 |
GT24C02-3UDLA2-TR | 聚辰(Giantec) | EEPROM, | 下载 |
GT24C02-3ZLA1-TR | 聚辰(Giantec) | EEPROM, | 下载 |
GT24C02-3ZLA2-TR | 聚辰(Giantec) | EEPROM, | 下载 |
GT24C02A | 聚辰(Giantec) | 2K ,I | 下载 |
GT24C02A-2GLI-TR | 聚辰(Giantec) | 存储器接口类型:I2C 存储器容量:2Kb (256 x 8) 工作电压:1.7V ~ 5.5V 存储器类型:Non-Volatile | 下载 |
GT24C02A-2TFLI-TR | 聚辰(Giantec) | EEPROM, 256X8, Serial, CMOS, PDSO5, SOT-23, 5 PIN | 下载 |
GT24C02-X07M-TR | 聚辰(Giantec) | EEPROM, | 下载 |
GT24C04 | 聚辰(Giantec) | 2K ,I | 下载 |
GT24C04-2GLI-TR | 聚辰(Giantec) | EEPROM, 512X8, Serial, CMOS, PDSO8, 0.150 INCH, GREEN, SOP-8 | 下载 |
GT24C04-2UDLI-TR | 聚辰(Giantec) | EEPROM, 512X8, Serial, CMOS, PDSO8, 2 X 3 MM, GREEN, MO-229, DFN-8 | 下载 |
GT24C04-2ZLI-TR | 聚辰(Giantec) | EEPROM, 512X8, Serial, CMOS, PDSO8, 3 X 4.40 MM, GREEN, MO-153AA, TSSOP-8 | 下载 |
GT24C04-3GLA1-TR | 聚辰(Giantec) | EEPROM, | 下载 |
GT24C04-3ZLA2-TR | 聚辰(Giantec) | EEPROM, | 下载 |
对应元器件 | pdf文档资料下载 |
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GT24C16B-2GLI-TR 、 GT24C16B-2PLI 、 GT24C16B-2SLI-TR 、 GT24C16B-2TFLI-TR 、 GT24C16B-2UDLI-TR 、 GT24C16B-2XDLI-TR 、 GT24C16B-2ZLI-TR | 下载文档 |
GT24C08B-2GLI-TR 、 GT24C08B-2PLI 、 GT24C08B-2SLI-TR 、 GT24C08B-2TFLI-TR 、 GT24C08B-2UDLI-TR 、 GT24C08B-2ZLI-TR | 下载文档 |
GT24C16A-2PLI 、 GT24C16A-2TFLI-TR 、 GT24C16A-2UDLI-TR 、 GT24C16A-2XDLI-TR 、 GT24C16A-2ZLI-TR | 下载文档 |
GT24C128D-2GLI-TR 、 GT24C128D-2PLI 、 GT24C128D-2SLI-TR 、 GT24C128D-2UD5LI-TR | 下载文档 |
GT24C02-3SLA1-TR 、 GT24C02-3UDLA1-TR 、 GT24C02-3ZLA1-TR | 下载文档 |
GT24C32-2GLI-TR 、 GT24C32-2SLI-TR 、 GT24C32-2ZLI-TR | 下载文档 |
GT24C02-2GLI-TR 、 GT24C02-2UDLI-TR 、 GT24C02-2ZLI-TR | 下载文档 |
GT24C128A-2CLI-TR 、 GT24C128A-2GLI-TR | 下载文档 |
GT24C256C-2GLI-TR 、 GT24C256C-2ZLI-TR | 下载文档 |
GT24C128B-2GLI-TR 、 GT24C128B-2ZLI-TR | 下载文档 |
型号 | GT24C16B-2GLI-TR | GT24C16B-2PLI | GT24C16B-2SLI-TR | GT24C16B-2TFLI-TR | GT24C16B-2UDLI-TR | GT24C16B-2XDLI-TR | GT24C16B-2ZLI-TR |
---|---|---|---|---|---|---|---|
描述 | EEPROM, 2KX8, Serial, CMOS, PDSO8, SOIC-8 | EEPROM, 2KX8, Serial, CMOS, PDIP8, DIP-8 | EEPROM, 2KX8, Serial, CMOS, PDSO8, MSOP-8 | EEPROM, 2KX8, Serial, CMOS, PDSO8, SOT23,5 PIN | EEPROM, 2KX8, Serial, CMOS, PDCC8, UDFN-8 | EEPROM, 2KX8, Serial, CMOS, PDCC8, XDFN-8 | EEPROM, 2KX8, Serial, CMOS, PDSO8, TSSOP-8 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | 聚辰(Giantec) | 聚辰(Giantec) | 聚辰(Giantec) | 聚辰(Giantec) | 聚辰(Giantec) | 聚辰(Giantec) | 聚辰(Giantec) |
包装说明 | SOIC-8 | DIP-8 | MSOP-8 | SOT23,5 PIN | UDFN-8 | XDFN-8 | TSSOP-8 |
Reach Compliance Code | compli | compli | compli | compli | compli | compli | compli |
最大时钟频率 (fCLK) | 1 MHz | 1 MHz | 1 MHz | 1 MHz | 1 MHz | 1 MHz | 1 MHz |
数据保留时间-最小值 | 100 | 100 | 100 | 100 | 100 | 100 | 100 |
耐久性 | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles |
I2C控制字节 | 1010MMMR | 1010MMMR | 1010MMMR | 1010MMMR | 1010MMMR | 1010MMMR | 1010MMMR |
JESD-30 代码 | R-PDSO-G8 | R-PDIP-T8 | S-PDSO-G8 | R-PDSO-G5 | R-PDSO-N8 | R-PDSO-N8 | R-PDSO-G8 |
长度 | 4.9 mm | 9.27 mm | 3 mm | 2.926 mm | 3 mm | 2.2 mm | 4.4 mm |
内存密度 | 16384 bi | 16384 bi | 16384 bi | 16384 bi | 16384 bi | 16384 bi | 16384 bi |
内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
字数 | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words |
字数代码 | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
组织 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | DIP | TSSOP | LSSOP | HVSON | HVSON | TSSOP |
封装等效代码 | SOP8,.25 | DIP8,.3 | TSSOP8,.19 | TSOP5/6,.11,37 | SOLCC8,.12,20 | SOLCC8,.08,16 | TSSOP8,.25 |
封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
座面最大高度 | 1.75 mm | 4.2 mm | 1.1 mm | 1.25 mm | 0.6 mm | 0.4 mm | 1.2 mm |
串行总线类型 | I2C | I2C | I2C | I2C | I2C | I2C | I2C |
最大待机电流 | 0.000001 A | 0.000001 A | 0.000001 A | 0.000001 A | 0.000001 A | 0.000001 A | 0.000001 A |
最大压摆率 | 0.0005 mA | 0.0005 mA | 0.0005 mA | 0.0005 mA | 0.0005 mA | 0.0005 mA | 0.0005 mA |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | NO | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | NO LEAD | NO LEAD | GULL WING |
端子节距 | 1.27 mm | 2.54 mm | 0.65 mm | 0.95 mm | 0.5 mm | 0.4 mm | 0.65 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
宽度 | 3.9 mm | 7.62 mm | 3 mm | 1.626 mm | 2 mm | 1.8 mm | 3 mm |
最长写入周期时间 (tWC) | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms |
写保护 | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE |
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