| 器件名 | 厂商 | 描 述 | 功能 |
|---|---|---|---|
| CC2640F128RGZ | Texas Instruments(德州仪器) | SPECIALTY TELECOM CIRCUIT, PQCC48, 7 X 7 MM, 0.50 MM PITCH, GREEN, PLASTIC, VQFN-48 | 下载 |
| CC2640F128RGZR | Texas Instruments(德州仪器) | —— | 下载 |
| CC2640F128RGZT | Texas Instruments(德州仪器) | SimpleLink ultra-low power wireless MCU for Bluetooth low energy 48-VQFN -40 to 85 | 下载 |
| CC2640F128RHB | Texas Instruments(德州仪器) | SPECIALTY TELECOM CIRCUIT, PQCC32, 5 X 5 MM, 0.50 MM PITCH, GREEN, PLASTIC, VQFN-32 | 下载 |
| CC2640F128RHBR | Texas Instruments(德州仪器) | 针对蓝牙智能应用的 SimpleLink 超低功耗无线 MCU | 下载 |
| CC2640F128RHBT | Texas Instruments(德州仪器) | SimpleLink™ 32-bit Arm Cortex-M3 Bluetooth® Low Energy wireless MCU with 128kB Flash 32-VQFN -40 to 85 | 下载 |
| CC2640F128RSM | Texas Instruments(德州仪器) | SPECIALTY TELECOM CIRCUIT, PQCC32, 4 X 4 MM, 0.40 MM PITCH, GREEN, PLASTIC, VQFN-32 | 下载 |
| CC2640F128RSMR | Texas Instruments(德州仪器) | —— | 下载 |
| CC2640F128RSMT | Texas Instruments(德州仪器) | SimpleLink ultra-low power wireless MCU for Bluetooth low energy 32-VQFN -40 to 85 | 下载 |
| 对应元器件 | pdf文档资料下载 |
|---|---|
| CC2640F128RGZ 、 CC2640F128RHB 、 CC2640F128RSM | 下载文档 |
| CC2640F128RGZT 、 CC2640F128RSMT | 下载文档 |
| CC2640F128RSMR | 下载文档 |
| CC2640F128RHBT | 下载文档 |
| CC2640F128RHBR | 下载文档 |
| CC2640F128RGZR | 下载文档 |
| CC2640F128RHBT | 下载文档 |
| 型号 | CC2640F128RGZ | CC2640F128RHB | CC2640F128RSM |
|---|---|---|---|
| 描述 | SPECIALTY TELECOM CIRCUIT, PQCC48, 7 X 7 MM, 0.50 MM PITCH, GREEN, PLASTIC, VQFN-48 | SPECIALTY TELECOM CIRCUIT, PQCC32, 5 X 5 MM, 0.50 MM PITCH, GREEN, PLASTIC, VQFN-32 | SPECIALTY TELECOM CIRCUIT, PQCC32, 4 X 4 MM, 0.40 MM PITCH, GREEN, PLASTIC, VQFN-32 |
| 是否Rohs认证 | 符合 | 符合 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 包装说明 | HVQCCN, | HVQCCN, | HVQCCN, |
| Reach Compliance Code | compliant | compliant | compliant |
| JESD-30 代码 | S-PQCC-N48 | S-PQCC-N32 | S-PQCC-N32 |
| JESD-609代码 | e4 | e4 | e4 |
| 长度 | 7 mm | 5 mm | 4 mm |
| 湿度敏感等级 | 3 | 3 | 3 |
| 功能数量 | 1 | 1 | 1 |
| 端子数量 | 48 | 32 | 32 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HVQCCN | HVQCCN | HVQCCN |
| 封装形状 | SQUARE | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度(摄氏度) | 260 | 260 | 260 |
| 座面最大高度 | 1 mm | 1 mm | 1 mm |
| 标称供电电压 | 3 V | 3 V | 3 V |
| 表面贴装 | YES | YES | YES |
| 电信集成电路类型 | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD |
| 端子节距 | 0.5 mm | 0.5 mm | 0.4 mm |
| 端子位置 | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 7 mm | 5 mm | 4 mm |
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