| 型号 |
BQ24250YFFT |
BQ24250RGET |
BQ24250YFFR |
| 描述 |
2A Single Input I2C/Standalone Switch-Mode Li-Ion Battery Charger 30-DSBGA -40 to 85 |
2A Single Input I2C/Standalone Switch-Mode Li-Ion Battery Charger 24-VQFN |
2A Single Input I2C/Standalone Switch-Mode Li-Ion Battery Charger 30-DSBGA -40 to 85 |
| Brand Name |
Texas Instruments |
Texas Instruments |
Texas Instruments |
| 是否无铅 |
不含铅 |
不含铅 |
不含铅 |
| 是否Rohs认证 |
符合 |
符合 |
符合 |
| 包装说明 |
VFBGA, BGA30,5X6,16 |
HVQCCN, LCC24,.16SQ,20 |
VFBGA, BGA30,5X6,16 |
| Reach Compliance Code |
compli |
compli |
compli |
| ECCN代码 |
EAR99 |
EAR99 |
EAR99 |
| Factory Lead Time |
6 weeks |
6 weeks |
6 weeks |
| 模拟集成电路 - 其他类型 |
POWER SUPPLY MANAGEMENT CIRCUIT |
POWER SUPPLY MANAGEMENT CIRCUIT |
POWER SUPPLY MANAGEMENT CIRCUIT |
| JESD-30 代码 |
R-XBGA-B30 |
S-PQCC-N24 |
R-XBGA-B30 |
| JESD-609代码 |
e1 |
e4 |
e1 |
| 长度 |
2.2 mm |
4 mm |
2.2 mm |
| 湿度敏感等级 |
1 |
2 |
1 |
| 端子数量 |
30 |
24 |
30 |
| 最高工作温度 |
85 °C |
85 °C |
85 °C |
| 最低工作温度 |
-40 °C |
-40 °C |
-40 °C |
| 封装主体材料 |
UNSPECIFIED |
PLASTIC/EPOXY |
UNSPECIFIED |
| 封装代码 |
VFBGA |
HVQCCN |
VFBGA |
| 封装等效代码 |
BGA30,5X6,16 |
LCC24,.16SQ,20 |
BGA30,5X6,16 |
| 封装形状 |
RECTANGULAR |
SQUARE |
RECTANGULAR |
| 封装形式 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 电源 |
4.5/10 V |
4.5/10 V |
4.5/10 V |
| 认证状态 |
Not Qualified |
Not Qualified |
Not Qualified |
| 座面最大高度 |
0.625 mm |
0.88 mm |
0.375 mm |
| 最大供电电流 (Isup) |
5 mA |
5 mA |
5 mA |
| 表面贴装 |
YES |
YES |
YES |
| 温度等级 |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
| 端子面层 |
Tin/Silver/Copper (Sn/Ag/Cu) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 |
BALL |
NO LEAD |
BALL |
| 端子节距 |
0.4 mm |
0.5 mm |
0.4 mm |
| 端子位置 |
BOTTOM |
QUAD |
BOTTOM |
| 阈值电压标称 |
+3.35V |
+3.35V |
+3.35V |
| 宽度 |
2.59 mm |
4 mm |
2.59 mm |
| Base Number Matches |
1 |
1 |
1 |