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WEDPS512K32LV

eeworld网站中关于WEDPS512K32LV有31个元器件。有WEDPS512K32LV-12BC、WEDPS512K32LV-12BC等。可以通过横向对比他们之间的异同,来寻找器件间替代的可能。
器件名 厂商 描 述 功能
WEDPS512K32LV-12BC Mercury Systems Inc Standard SRAM, 512KX32, 12ns, CMOS, PBGA143, BGA-143 下载
WEDPS512K32LV-12BC White Electronic Designs Corporation 512K X 32 MULTI DEVICE SRAM MODULE, 15 ns, PBGA143 下载
WEDPS512K32LV-12BI Mercury Systems Inc Standard SRAM, 512KX32, 12ns, CMOS, PBGA143, BGA-143 下载
WEDPS512K32LV-12BI White Electronic Designs Corporation STANDARD SRAM 下载
WEDPS512K32LV-12BI Microsemi SRAM Module, 512KX32, 12ns, CMOS, PBGA143, 16 X 18 MM, PLASTIC, BGA-143 下载
WEDPS512K32LV-12BM White Electronic Designs Corporation 512K X 32 MULTI DEVICE SRAM MODULE, 15 ns, PBGA143 下载
WEDPS512K32LV-12BM Mercury Systems Inc Standard SRAM, 512KX32, 12ns, CMOS, PBGA143, BGA-143 下载
WEDPS512K32LV-15BC Mercury Systems Inc Standard SRAM, 512KX32, 15ns, CMOS, PBGA143, BGA-143 下载
WEDPS512K32LV-15BC White Electronic Designs Corporation 512K X 32 MULTI DEVICE SRAM MODULE, 15 ns, PBGA143 下载
WEDPS512K32LV-15BC Microsemi SRAM Module, 512KX32, 15ns, CMOS, PBGA143, 16 X 18 MM, PLASTIC, BGA-143 下载
WEDPS512K32LV-15BI Mercury Systems Inc Standard SRAM, 512KX32, 15ns, CMOS, PBGA143, BGA-143 下载
WEDPS512K32LV-15BI White Electronic Designs Corporation 512K X 32 MULTI DEVICE SRAM MODULE, 15 ns, PBGA143 下载
WEDPS512K32LV-15BM White Electronic Designs Corporation 512K X 32 MULTI DEVICE SRAM MODULE, 15 ns, PBGA143 下载
WEDPS512K32LV-15BM Mercury Systems Inc Standard SRAM, 512KX32, 15ns, CMOS, PBGA143, BGA-143 下载
WEDPS512K32LV-15BM Microsemi SRAM Module, 512KX32, 15ns, CMOS, PBGA143, 16 X 18 MM, PLASTIC, BGA-143 下载
WEDPS512K32LV-17BC Mercury Systems Inc Standard SRAM, 512KX32, 17ns, CMOS, PBGA143, BGA-143 下载
WEDPS512K32LV-17BC White Electronic Designs Corporation 512K X 32 MULTI DEVICE SRAM MODULE, 15 ns, PBGA143 下载
WEDPS512K32LV-17BC Microsemi SRAM Module, 512KX32, 17ns, CMOS, PBGA143, 16 X 18 MM, PLASTIC, BGA-143 下载
WEDPS512K32LV-17BI Mercury Systems Inc Standard SRAM, 512KX32, 17ns, CMOS, PBGA143, BGA-143 下载
WEDPS512K32LV-17BI White Electronic Designs Corporation 512K X 32 MULTI DEVICE SRAM MODULE, 15 ns, PBGA143 下载
WEDPS512K32LV-17BM Mercury Systems Inc Standard SRAM, 512KX32, 17ns, CMOS, PBGA143, BGA-143 下载
WEDPS512K32LV-17BM White Electronic Designs Corporation 512K X 32 MULTI DEVICE SRAM MODULE, 15 ns, PBGA143 下载
WEDPS512K32LV-20BC Mercury Systems Inc Standard SRAM, 512KX32, 20ns, CMOS, 下载
WEDPS512K32LV-20BC White Electronic Designs Corporation 512K X 32 MULTI DEVICE SRAM MODULE, 15 ns, PBGA143 下载
WEDPS512K32LV-20BC Microsemi SRAM Module, 512KX32, 20ns, CMOS, PBGA143, 16 X 18 MM, PLASTIC, BGA-143 下载
WEDPS512K32LV-20BI Mercury Systems Inc Standard SRAM, 512KX32, 20ns, CMOS, 下载
WEDPS512K32LV-20BI White Electronic Designs Corporation 512K X 32 MULTI DEVICE SRAM MODULE, 15 ns, PBGA143 下载
WEDPS512K32LV-20BI Microsemi SRAM Module, 512KX32, 20ns, CMOS, PBGA143, 16 X 18 MM, PLASTIC, BGA-143 下载
WEDPS512K32LV-20BM Mercury Systems Inc Standard SRAM, 512KX32, 20ns, CMOS, 下载
WEDPS512K32LV-20BM White Electronic Designs Corporation 512K X 32 MULTI DEVICE SRAM MODULE, 15 ns, PBGA143 下载
关于WEDPS512K32LV相关文档资料:
对应元器件 pdf文档资料下载
WEDPS512K32LV-12BI 、 WEDPS512K32LV-15BC 、 WEDPS512K32LV-15BM 、 WEDPS512K32LV-17BC 、 WEDPS512K32LV-20BC 、 WEDPS512K32LV-20BI 下载文档
WEDPS512K32LV资料比对:
型号 WEDPS512K32LV-12BI WEDPS512K32LV-15BC WEDPS512K32LV-15BM WEDPS512K32LV-17BC WEDPS512K32LV-20BC WEDPS512K32LV-20BI
描述 SRAM Module, 512KX32, 12ns, CMOS, PBGA143, 16 X 18 MM, PLASTIC, BGA-143 SRAM Module, 512KX32, 15ns, CMOS, PBGA143, 16 X 18 MM, PLASTIC, BGA-143 SRAM Module, 512KX32, 15ns, CMOS, PBGA143, 16 X 18 MM, PLASTIC, BGA-143 SRAM Module, 512KX32, 17ns, CMOS, PBGA143, 16 X 18 MM, PLASTIC, BGA-143 SRAM Module, 512KX32, 20ns, CMOS, PBGA143, 16 X 18 MM, PLASTIC, BGA-143 SRAM Module, 512KX32, 20ns, CMOS, PBGA143, 16 X 18 MM, PLASTIC, BGA-143
是否Rohs认证 不符合 不符合 不符合 不符合 不符合 不符合
包装说明 16 X 18 MM, PLASTIC, BGA-143 16 X 18 MM, PLASTIC, BGA-143 16 X 18 MM, PLASTIC, BGA-143 16 X 18 MM, PLASTIC, BGA-143 16 X 18 MM, PLASTIC, BGA-143 16 X 18 MM, PLASTIC, BGA-143
Reach Compliance Code unknown unknown unknown unknown unknown unknown
最长访问时间 12 ns 15 ns 15 ns 17 ns 20 ns 20 ns
其他特性 ALSO CONFIGURABLE AS 2M X 8 ALSO CONFIGURABLE AS 2M X 8 ALSO CONFIGURABLE AS 2M X 8 ALSO CONFIGURABLE AS 2M X 8 ALSO CONFIGURABLE AS 2M X 8 ALSO CONFIGURABLE AS 2M X 8
备用内存宽度 16 16 16 16 16 16
I/O 类型 COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 代码 R-PBGA-B143 R-PBGA-B143 R-PBGA-B143 R-PBGA-B143 R-PBGA-B143 R-PBGA-B143
内存密度 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit
内存集成电路类型 SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE
内存宽度 32 32 32 32 32 32
功能数量 1 1 1 1 1 1
端子数量 143 143 143 143 143 143
字数 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words
字数代码 512000 512000 512000 512000 512000 512000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 85 °C 70 °C 125 °C 70 °C 70 °C 85 °C
组织 512KX32 512KX32 512KX32 512KX32 512KX32 512KX32
输出特性 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 BGA BGA BGA BGA BGA BGA
封装等效代码 BGA143,12X12,50 BGA143,12X12,50 BGA143,12X12,50 BGA143,12X12,50 BGA143,12X12,50 BGA143,12X12,50
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) 225 225 225 225 225 225
电源 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.93 mm 1.93 mm 1.93 mm 1.93 mm 1.93 mm 1.93 mm
最大待机电流 0.008 A 0.008 A 0.008 A 0.008 A 0.008 A 0.008 A
最小待机电流 2.19 V 2.19 V 2.19 V 2.19 V 2.19 V 2.19 V
最大压摆率 0.4 mA 0.4 mA 0.4 mA 0.4 mA 0.4 mA 0.4 mA
最大供电电压 (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
最小供电电压 (Vsup) 3 V 3 V 3 V 3 V 3 V 3 V
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL COMMERCIAL MILITARY COMMERCIAL COMMERCIAL INDUSTRIAL
端子形式 BALL BALL BALL BALL BALL BALL
端子节距 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
处于峰值回流温度下的最长时间 30 30 30 30 30 30
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