| 器件名 | 厂商 | 描 述 | 功能 |
|---|---|---|---|
| WEDPS512K32LV-12BC | Mercury Systems Inc | Standard SRAM, 512KX32, 12ns, CMOS, PBGA143, BGA-143 | 下载 |
| WEDPS512K32LV-12BC | White Electronic Designs Corporation | 512K X 32 MULTI DEVICE SRAM MODULE, 15 ns, PBGA143 | 下载 |
| WEDPS512K32LV-12BI | Mercury Systems Inc | Standard SRAM, 512KX32, 12ns, CMOS, PBGA143, BGA-143 | 下载 |
| WEDPS512K32LV-12BI | White Electronic Designs Corporation | STANDARD SRAM | 下载 |
| WEDPS512K32LV-12BI | Microsemi | SRAM Module, 512KX32, 12ns, CMOS, PBGA143, 16 X 18 MM, PLASTIC, BGA-143 | 下载 |
| WEDPS512K32LV-12BM | White Electronic Designs Corporation | 512K X 32 MULTI DEVICE SRAM MODULE, 15 ns, PBGA143 | 下载 |
| WEDPS512K32LV-12BM | Mercury Systems Inc | Standard SRAM, 512KX32, 12ns, CMOS, PBGA143, BGA-143 | 下载 |
| WEDPS512K32LV-15BC | Mercury Systems Inc | Standard SRAM, 512KX32, 15ns, CMOS, PBGA143, BGA-143 | 下载 |
| WEDPS512K32LV-15BC | White Electronic Designs Corporation | 512K X 32 MULTI DEVICE SRAM MODULE, 15 ns, PBGA143 | 下载 |
| WEDPS512K32LV-15BC | Microsemi | SRAM Module, 512KX32, 15ns, CMOS, PBGA143, 16 X 18 MM, PLASTIC, BGA-143 | 下载 |
| WEDPS512K32LV-15BI | Mercury Systems Inc | Standard SRAM, 512KX32, 15ns, CMOS, PBGA143, BGA-143 | 下载 |
| WEDPS512K32LV-15BI | White Electronic Designs Corporation | 512K X 32 MULTI DEVICE SRAM MODULE, 15 ns, PBGA143 | 下载 |
| WEDPS512K32LV-15BM | White Electronic Designs Corporation | 512K X 32 MULTI DEVICE SRAM MODULE, 15 ns, PBGA143 | 下载 |
| WEDPS512K32LV-15BM | Mercury Systems Inc | Standard SRAM, 512KX32, 15ns, CMOS, PBGA143, BGA-143 | 下载 |
| WEDPS512K32LV-15BM | Microsemi | SRAM Module, 512KX32, 15ns, CMOS, PBGA143, 16 X 18 MM, PLASTIC, BGA-143 | 下载 |
| WEDPS512K32LV-17BC | Mercury Systems Inc | Standard SRAM, 512KX32, 17ns, CMOS, PBGA143, BGA-143 | 下载 |
| WEDPS512K32LV-17BC | White Electronic Designs Corporation | 512K X 32 MULTI DEVICE SRAM MODULE, 15 ns, PBGA143 | 下载 |
| WEDPS512K32LV-17BC | Microsemi | SRAM Module, 512KX32, 17ns, CMOS, PBGA143, 16 X 18 MM, PLASTIC, BGA-143 | 下载 |
| WEDPS512K32LV-17BI | Mercury Systems Inc | Standard SRAM, 512KX32, 17ns, CMOS, PBGA143, BGA-143 | 下载 |
| WEDPS512K32LV-17BI | White Electronic Designs Corporation | 512K X 32 MULTI DEVICE SRAM MODULE, 15 ns, PBGA143 | 下载 |
| WEDPS512K32LV-17BM | Mercury Systems Inc | Standard SRAM, 512KX32, 17ns, CMOS, PBGA143, BGA-143 | 下载 |
| WEDPS512K32LV-17BM | White Electronic Designs Corporation | 512K X 32 MULTI DEVICE SRAM MODULE, 15 ns, PBGA143 | 下载 |
| WEDPS512K32LV-20BC | Mercury Systems Inc | Standard SRAM, 512KX32, 20ns, CMOS, | 下载 |
| WEDPS512K32LV-20BC | White Electronic Designs Corporation | 512K X 32 MULTI DEVICE SRAM MODULE, 15 ns, PBGA143 | 下载 |
| WEDPS512K32LV-20BC | Microsemi | SRAM Module, 512KX32, 20ns, CMOS, PBGA143, 16 X 18 MM, PLASTIC, BGA-143 | 下载 |
| WEDPS512K32LV-20BI | Mercury Systems Inc | Standard SRAM, 512KX32, 20ns, CMOS, | 下载 |
| WEDPS512K32LV-20BI | White Electronic Designs Corporation | 512K X 32 MULTI DEVICE SRAM MODULE, 15 ns, PBGA143 | 下载 |
| WEDPS512K32LV-20BI | Microsemi | SRAM Module, 512KX32, 20ns, CMOS, PBGA143, 16 X 18 MM, PLASTIC, BGA-143 | 下载 |
| WEDPS512K32LV-20BM | Mercury Systems Inc | Standard SRAM, 512KX32, 20ns, CMOS, | 下载 |
| WEDPS512K32LV-20BM | White Electronic Designs Corporation | 512K X 32 MULTI DEVICE SRAM MODULE, 15 ns, PBGA143 | 下载 |
| 对应元器件 | pdf文档资料下载 |
|---|---|
| WEDPS512K32LV-12BI 、 WEDPS512K32LV-15BC 、 WEDPS512K32LV-15BM 、 WEDPS512K32LV-17BC 、 WEDPS512K32LV-20BC 、 WEDPS512K32LV-20BI | 下载文档 |
| 型号 | WEDPS512K32LV-12BI | WEDPS512K32LV-15BC | WEDPS512K32LV-15BM | WEDPS512K32LV-17BC | WEDPS512K32LV-20BC | WEDPS512K32LV-20BI |
|---|---|---|---|---|---|---|
| 描述 | SRAM Module, 512KX32, 12ns, CMOS, PBGA143, 16 X 18 MM, PLASTIC, BGA-143 | SRAM Module, 512KX32, 15ns, CMOS, PBGA143, 16 X 18 MM, PLASTIC, BGA-143 | SRAM Module, 512KX32, 15ns, CMOS, PBGA143, 16 X 18 MM, PLASTIC, BGA-143 | SRAM Module, 512KX32, 17ns, CMOS, PBGA143, 16 X 18 MM, PLASTIC, BGA-143 | SRAM Module, 512KX32, 20ns, CMOS, PBGA143, 16 X 18 MM, PLASTIC, BGA-143 | SRAM Module, 512KX32, 20ns, CMOS, PBGA143, 16 X 18 MM, PLASTIC, BGA-143 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | 16 X 18 MM, PLASTIC, BGA-143 | 16 X 18 MM, PLASTIC, BGA-143 | 16 X 18 MM, PLASTIC, BGA-143 | 16 X 18 MM, PLASTIC, BGA-143 | 16 X 18 MM, PLASTIC, BGA-143 | 16 X 18 MM, PLASTIC, BGA-143 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| 最长访问时间 | 12 ns | 15 ns | 15 ns | 17 ns | 20 ns | 20 ns |
| 其他特性 | ALSO CONFIGURABLE AS 2M X 8 | ALSO CONFIGURABLE AS 2M X 8 | ALSO CONFIGURABLE AS 2M X 8 | ALSO CONFIGURABLE AS 2M X 8 | ALSO CONFIGURABLE AS 2M X 8 | ALSO CONFIGURABLE AS 2M X 8 |
| 备用内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | R-PBGA-B143 | R-PBGA-B143 | R-PBGA-B143 | R-PBGA-B143 | R-PBGA-B143 | R-PBGA-B143 |
| 内存密度 | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit |
| 内存集成电路类型 | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE |
| 内存宽度 | 32 | 32 | 32 | 32 | 32 | 32 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 143 | 143 | 143 | 143 | 143 | 143 |
| 字数 | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words |
| 字数代码 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 85 °C | 70 °C | 125 °C | 70 °C | 70 °C | 85 °C |
| 组织 | 512KX32 | 512KX32 | 512KX32 | 512KX32 | 512KX32 | 512KX32 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | BGA | BGA | BGA | BGA | BGA | BGA |
| 封装等效代码 | BGA143,12X12,50 | BGA143,12X12,50 | BGA143,12X12,50 | BGA143,12X12,50 | BGA143,12X12,50 | BGA143,12X12,50 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度(摄氏度) | 225 | 225 | 225 | 225 | 225 | 225 |
| 电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.93 mm | 1.93 mm | 1.93 mm | 1.93 mm | 1.93 mm | 1.93 mm |
| 最大待机电流 | 0.008 A | 0.008 A | 0.008 A | 0.008 A | 0.008 A | 0.008 A |
| 最小待机电流 | 2.19 V | 2.19 V | 2.19 V | 2.19 V | 2.19 V | 2.19 V |
| 最大压摆率 | 0.4 mA | 0.4 mA | 0.4 mA | 0.4 mA | 0.4 mA | 0.4 mA |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL | INDUSTRIAL |
| 端子形式 | BALL | BALL | BALL | BALL | BALL | BALL |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 | 30 |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved