型号 |
PIC18LF24K50-I/SO |
PIC18LF24K50-I/ML |
PIC18LF24K50-I/SP |
PIC18LF24K50-I/SS |
描述 |
MICROCONTROLLER |
MICROCONTROLLER |
IC,MICROCONTROLLER,8-BIT,PIC CPU,CMOS,DIP,28PIN,PLASTIC |
MICROCONTROLLER |
是否Rohs认证 |
符合 |
符合 |
符合 |
符合 |
Objectid |
1257827801 |
1257827799 |
1550683601 |
1257827802 |
包装说明 |
SOIC-28 |
QFN-44 |
SDIP-28 |
SSOP-28 |
Reach Compliance Code |
compliant |
compliant |
compliant |
compliant |
Country Of Origin |
Thailand |
Malaysia |
Thailand |
Thailand |
ECCN代码 |
3A991.A.2 |
3A991.A.2 |
3A991.A.2 |
3A991.A.2 |
Factory Lead Time |
52 weeks |
6 weeks |
52 weeks |
52 weeks |
YTEOL |
4.5 |
24.48 |
6 |
4.5 |
具有ADC |
YES |
YES |
YES |
YES |
其他特性 |
OPERATES AT 1.8 V MINIMUM SUPPLY AT 4 MHz |
OPERATES AT 1.8 V MINIMUM SUPPLY AT 4 MHz |
OPERATES AT 1.8 V MINIMUM SUPPLY AT 4 MHz |
OPERATES AT 1.8 V MINIMUM SUPPLY AT 4 MHz |
位大小 |
8 |
8 |
8 |
8 |
边界扫描 |
NO |
NO |
NO |
NO |
CPU系列 |
PIC18 |
PIC18 |
PIC18 |
PIC18 |
最大时钟频率 |
48 MHz |
48 MHz |
48 MHz |
48 MHz |
DAC 通道 |
YES |
YES |
YES |
YES |
DMA 通道 |
NO |
NO |
NO |
NO |
格式 |
FIXED POINT |
FIXED POINT |
FIXED POINT |
FIXED POINT |
集成缓存 |
NO |
NO |
NO |
NO |
JESD-30 代码 |
R-PDSO-G28 |
S-PQCC-N44 |
R-PDIP-T28 |
R-PDSO-G28 |
JESD-609代码 |
e3 |
e3 |
e3 |
e3 |
长度 |
17.9 mm |
8 mm |
34.671 mm |
10.2 mm |
低功率模式 |
YES |
YES |
YES |
YES |
外部中断装置数量 |
3 |
3 |
3 |
3 |
I/O 线路数量 |
25 |
25 |
25 |
25 |
串行 I/O 数 |
1 |
1 |
1 |
1 |
端子数量 |
28 |
44 |
28 |
28 |
计时器数量 |
6 |
6 |
6 |
6 |
片上数据RAM宽度 |
8 |
8 |
8 |
8 |
片上程序ROM宽度 |
16 |
16 |
16 |
16 |
最高工作温度 |
85 °C |
85 °C |
85 °C |
85 °C |
最低工作温度 |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
PWM 通道 |
YES |
YES |
YES |
YES |
封装主体材料 |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
封装代码 |
SOP |
HVQCCN |
DIP |
SSOP |
封装等效代码 |
SOP28,.4 |
LCC44,.31SQ,25 |
DIP28,.3 |
SSOP28,.3 |
封装形状 |
RECTANGULAR |
SQUARE |
RECTANGULAR |
RECTANGULAR |
封装形式 |
SMALL OUTLINE |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
IN-LINE |
SMALL OUTLINE, SHRINK PITCH |
认证状态 |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
RAM(字节) |
2048 |
2048 |
2048 |
2048 |
ROM(单词) |
8192 |
8192 |
8192 |
8192 |
ROM可编程性 |
FLASH |
FLASH |
FLASH |
FLASH |
筛选级别 |
TS 16949 |
TS 16949 |
TS 16949 |
TS 16949 |
座面最大高度 |
2.65 mm |
1 mm |
5.08 mm |
2 mm |
速度 |
48 MHz |
48 MHz |
48 MHz |
48 MHz |
最大压摆率 |
11.5 mA |
11.5 mA |
11.5 mA |
11.5 mA |
最大供电电压 |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
最小供电电压 |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
标称供电电压 |
3 V |
3 V |
3 V |
3 V |
表面贴装 |
YES |
YES |
NO |
YES |
技术 |
CMOS |
CMOS |
CMOS |
CMOS |
温度等级 |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
端子面层 |
MATTE TIN |
MATTE TIN |
MATTE TIN |
Matte Tin (Sn) |
端子形式 |
GULL WING |
NO LEAD |
THROUGH-HOLE |
GULL WING |
端子节距 |
1.27 mm |
0.65 mm |
2.54 mm |
0.65 mm |
端子位置 |
DUAL |
QUAD |
DUAL |
DUAL |
宽度 |
7.5 mm |
8 mm |
7.62 mm |
5.3 mm |
uPs/uCs/外围集成电路类型 |
MICROCONTROLLER, RISC |
MICROCONTROLLER, RISC |
MICROCONTROLLER, RISC |
MICROCONTROLLER, RISC |
湿度敏感等级 |
1 |
1 |
- |
2 |
电源 |
2/3.3 V |
- |
2/3.3 V |
2/3.3 V |